JPS5438770A - Etching device - Google Patents

Etching device

Info

Publication number
JPS5438770A
JPS5438770A JP10551377A JP10551377A JPS5438770A JP S5438770 A JPS5438770 A JP S5438770A JP 10551377 A JP10551377 A JP 10551377A JP 10551377 A JP10551377 A JP 10551377A JP S5438770 A JPS5438770 A JP S5438770A
Authority
JP
Japan
Prior art keywords
etching
etched
etching device
dipping
proceed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10551377A
Other languages
Japanese (ja)
Inventor
Takashi Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10551377A priority Critical patent/JPS5438770A/en
Publication of JPS5438770A publication Critical patent/JPS5438770A/en
Pending legal-status Critical Current

Links

Landscapes

  • Weting (AREA)

Abstract

PURPOSE: To perform desired selective etching by dipping the material to be etched into the solution in which etching does not proceed at a low temperature region and etching proceeds as temperature rises, and heating only the portions to be etched with an external heat source.
COPYRIGHT: (C)1979,JPO&Japio
JP10551377A 1977-09-01 1977-09-01 Etching device Pending JPS5438770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10551377A JPS5438770A (en) 1977-09-01 1977-09-01 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10551377A JPS5438770A (en) 1977-09-01 1977-09-01 Etching device

Publications (1)

Publication Number Publication Date
JPS5438770A true JPS5438770A (en) 1979-03-23

Family

ID=14409671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10551377A Pending JPS5438770A (en) 1977-09-01 1977-09-01 Etching device

Country Status (1)

Country Link
JP (1) JPS5438770A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577938A (en) * 1980-06-18 1982-01-16 Fujitsu Ltd Method for forming thin film pattern
US4379022A (en) * 1979-05-08 1983-04-05 International Business Machines Corporation Method for maskless chemical machining
JPS6090834U (en) * 1983-11-28 1985-06-21 シグマ技術工業株式会社 Processing tank
EP2850227A4 (en) * 2012-05-14 2015-11-18 United Technologies Corp Component finishing method and assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49111585A (en) * 1973-02-23 1974-10-24
JPS50156372A (en) * 1974-06-05 1975-12-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49111585A (en) * 1973-02-23 1974-10-24
JPS50156372A (en) * 1974-06-05 1975-12-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4379022A (en) * 1979-05-08 1983-04-05 International Business Machines Corporation Method for maskless chemical machining
JPS577938A (en) * 1980-06-18 1982-01-16 Fujitsu Ltd Method for forming thin film pattern
JPS6090834U (en) * 1983-11-28 1985-06-21 シグマ技術工業株式会社 Processing tank
EP2850227A4 (en) * 2012-05-14 2015-11-18 United Technologies Corp Component finishing method and assembly

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