JPS5539645A - Dry taper etching - Google Patents
Dry taper etchingInfo
- Publication number
- JPS5539645A JPS5539645A JP11277778A JP11277778A JPS5539645A JP S5539645 A JPS5539645 A JP S5539645A JP 11277778 A JP11277778 A JP 11277778A JP 11277778 A JP11277778 A JP 11277778A JP S5539645 A JPS5539645 A JP S5539645A
- Authority
- JP
- Japan
- Prior art keywords
- etching object
- object film
- film
- etching
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE: To ensure highly-controllable taper etching by providing a process consisting of providing mask on etching object film, depositing auxiliary film over the whole surface of said etching object film, placing said etching object film on a rotary table, and etching said auxiliary film and etching object film by applying ion beam from a given angle with the normal of said etching object film.
CONSTITUTION: Etching object film 2 is formed on a substrate 1, and mask with thickness h is made of photo-resist 3. Next, auxiliary film 4 with thickness a' is deposited over the whole surface of said etching object film 2. When said etching object film 2 is etched by applying ion beam form angle θ with the normal of said etching object film 2 while rotated, such a form that the portions thereof at the edges of said mask 3 rise and the other inclined gently is given thereto depending on the incidence distribution of ion beam. Thereby, all materials can be subjected to one method of taper angle control in highly-reproducible dry treatment. Lastly, the remainder portion 5 of said mask is removed so that manufacture is completed.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11277778A JPS5539645A (en) | 1978-09-12 | 1978-09-12 | Dry taper etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11277778A JPS5539645A (en) | 1978-09-12 | 1978-09-12 | Dry taper etching |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5539645A true JPS5539645A (en) | 1980-03-19 |
JPS63945B2 JPS63945B2 (en) | 1988-01-09 |
Family
ID=14595230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11277778A Granted JPS5539645A (en) | 1978-09-12 | 1978-09-12 | Dry taper etching |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5539645A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01222447A (en) * | 1988-03-01 | 1989-09-05 | Furukawa Electric Co Ltd:The | Formation of etched mirror by ribe |
JPH0677516A (en) * | 1992-07-10 | 1994-03-18 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor photodetector and its manufacture |
-
1978
- 1978-09-12 JP JP11277778A patent/JPS5539645A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01222447A (en) * | 1988-03-01 | 1989-09-05 | Furukawa Electric Co Ltd:The | Formation of etched mirror by ribe |
JPH0677516A (en) * | 1992-07-10 | 1994-03-18 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor photodetector and its manufacture |
Also Published As
Publication number | Publication date |
---|---|
JPS63945B2 (en) | 1988-01-09 |
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