JPS5516459A - Taper etching method - Google Patents
Taper etching methodInfo
- Publication number
- JPS5516459A JPS5516459A JP8955878A JP8955878A JPS5516459A JP S5516459 A JPS5516459 A JP S5516459A JP 8955878 A JP8955878 A JP 8955878A JP 8955878 A JP8955878 A JP 8955878A JP S5516459 A JPS5516459 A JP S5516459A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- layer
- pattern
- ion beam
- placed beyond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To improve the controllability of a taper angle of a fine pattern by forming a resist mask pattern placed beyond an etching layer on an etched layer, and then by irradiating an ion beam from an oblique direction while rotating within the plane.
CONSTITUTION: After forming a resist mask pattern 3 placed beyond an etching control layer 8 on an etched layer 7, etching is effected by irradiating an ion beam from an oblique direction against a normal line while rotating within the plane. For example, a three layer of Ti/Au/Ti, 100Å, 6000Å, 1100Å thick respectively, is electron-beam evaporated on a GGG bubble material substrate 1 placed beyond an Al2O3 spacer, and then a thin 1 μm resist pattern 3 is formed. After this is rotated at a rate of about 3 r.p.m. the tape angle α=about 40° of an Au pattern 7 is obtained by effecting an ion beam etching of oblique incidence of which angle is 30°.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8955878A JPS5516459A (en) | 1978-07-21 | 1978-07-21 | Taper etching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8955878A JPS5516459A (en) | 1978-07-21 | 1978-07-21 | Taper etching method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5516459A true JPS5516459A (en) | 1980-02-05 |
JPS63944B2 JPS63944B2 (en) | 1988-01-09 |
Family
ID=13974141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8955878A Granted JPS5516459A (en) | 1978-07-21 | 1978-07-21 | Taper etching method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5516459A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105655231A (en) * | 2014-11-13 | 2016-06-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Etching mask group and substrate etching method applying same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE1007908A3 (en) * | 1993-12-24 | 1995-11-14 | Philips Electronics Nv | An image display device WITH AND deflection unit deflection unit for a display device. |
-
1978
- 1978-07-21 JP JP8955878A patent/JPS5516459A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105655231A (en) * | 2014-11-13 | 2016-06-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Etching mask group and substrate etching method applying same |
Also Published As
Publication number | Publication date |
---|---|
JPS63944B2 (en) | 1988-01-09 |
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