JPS553607A - Manufacturing method for semiconductor element - Google Patents

Manufacturing method for semiconductor element

Info

Publication number
JPS553607A
JPS553607A JP7416078A JP7416078A JPS553607A JP S553607 A JPS553607 A JP S553607A JP 7416078 A JP7416078 A JP 7416078A JP 7416078 A JP7416078 A JP 7416078A JP S553607 A JPS553607 A JP S553607A
Authority
JP
Japan
Prior art keywords
sheet
junction
pallets
substrate
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7416078A
Other languages
Japanese (ja)
Other versions
JPS6028140B2 (en
Inventor
Yoshio Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP53074160A priority Critical patent/JPS6028140B2/en
Publication of JPS553607A publication Critical patent/JPS553607A/en
Publication of JPS6028140B2 publication Critical patent/JPS6028140B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To improve efficiency of separation works that are required when a semiconductor substrate with a P-N junction is divided into a number of pellets, by dividing the substrate while holding a first sheet thereon and sticking a second sheet on the surface having no sheet and then stripping off the first sheet.
CONSTITUTION: A vinyl resin thin film 12 is deposited on the rear surface of a semiconductor substrate 11 on which a P-N junction is formed, and a first sheet 13 having layer 14 of acrylic adhesive is sticked on the surface of the film 12. The substrate 11 is then divided into several pallets 17 by forming separation grooves 16 from its surface, including the P-N junction, by means of a cutting saw, and pulling the sheet 13 in the outer peripheral divection. In the next step, a second sheet 19 provided with an adhesive layer 18 is pasted on the surface 20 of the pellet 17 located opposite the first sheet 13, and then the first sheet 13 is stripped off, leaving the pallets 17 on the second sheet 17. Under such condition, the pallets can be easily separated from the second sheet 19.
COPYRIGHT: (C)1980,JPO&Japio
JP53074160A 1978-06-21 1978-06-21 Manufacturing method for semiconductor devices Expired JPS6028140B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53074160A JPS6028140B2 (en) 1978-06-21 1978-06-21 Manufacturing method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53074160A JPS6028140B2 (en) 1978-06-21 1978-06-21 Manufacturing method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS553607A true JPS553607A (en) 1980-01-11
JPS6028140B2 JPS6028140B2 (en) 1985-07-03

Family

ID=13539117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53074160A Expired JPS6028140B2 (en) 1978-06-21 1978-06-21 Manufacturing method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6028140B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7140951B2 (en) 2003-01-10 2006-11-28 Kabushiki Kaisha Toshiba Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH045641Y2 (en) * 1985-08-28 1992-02-18

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7140951B2 (en) 2003-01-10 2006-11-28 Kabushiki Kaisha Toshiba Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer
DE10312662B4 (en) * 2003-01-10 2008-06-05 Kabushiki Kaisha Toshiba Semiconductor device manufacturing arrangement and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafers

Also Published As

Publication number Publication date
JPS6028140B2 (en) 1985-07-03

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