JPS558072A - Selection of semiconductor pellet - Google Patents

Selection of semiconductor pellet

Info

Publication number
JPS558072A
JPS558072A JP8116278A JP8116278A JPS558072A JP S558072 A JPS558072 A JP S558072A JP 8116278 A JP8116278 A JP 8116278A JP 8116278 A JP8116278 A JP 8116278A JP S558072 A JPS558072 A JP S558072A
Authority
JP
Japan
Prior art keywords
pellets
normal
wafer
tape
periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8116278A
Other languages
Japanese (ja)
Inventor
Akira Shimizu
Yutaka Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8116278A priority Critical patent/JPS558072A/en
Publication of JPS558072A publication Critical patent/JPS558072A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Bipolar Transistors (AREA)

Abstract

PURPOSE: For facilitating selection, to divide a semiconductor wafer in pellets, stick adhesive tape to either of a normal shape pellet group and the non-normal-shape pellet group placed at the periphery of said normal shape pellet group, and leave either of said groups on said tape through break.
CONSTITUTION: Scratch 3 groove is formed by scribing a semiconductor wafer 1 in a given pellet size. At this time, pellets are kept interconnected by the bottom face of said wafer 1, not separated. Thereby, normal pellets 8 are generated at the section excepting the periphery of said wafer 1, and waste non-normal pellets 9 at said periphery. The tape with the adhesive having such a shape as to stick only to said non-normal pellets 9 is sticked to the whole surface of said wafer 1, said wafer 1 is placed on a semi-globular projecting table 4, and said wafer 1 is broken by applying load P through the medium of a phosphor bronze plate 5 and an elastic body 6 for separating pellets. When said tape 10 is removed thereafter, only said normal pellets 8 are left on said table 4. Thus, no special selection process is necessary.
COPYRIGHT: (C)1980,JPO&Japio
JP8116278A 1978-07-03 1978-07-03 Selection of semiconductor pellet Pending JPS558072A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8116278A JPS558072A (en) 1978-07-03 1978-07-03 Selection of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8116278A JPS558072A (en) 1978-07-03 1978-07-03 Selection of semiconductor pellet

Publications (1)

Publication Number Publication Date
JPS558072A true JPS558072A (en) 1980-01-21

Family

ID=13738747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8116278A Pending JPS558072A (en) 1978-07-03 1978-07-03 Selection of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS558072A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161485A (en) * 1987-12-17 1989-06-26 Nichiden Mach Ltd Method for recognizing small work piece
JPH02134844A (en) * 1988-11-15 1990-05-23 Nec Corp Method for dicing semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01161485A (en) * 1987-12-17 1989-06-26 Nichiden Mach Ltd Method for recognizing small work piece
JPH02134844A (en) * 1988-11-15 1990-05-23 Nec Corp Method for dicing semiconductor wafer

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