JPS558072A - Selection of semiconductor pellet - Google Patents
Selection of semiconductor pelletInfo
- Publication number
- JPS558072A JPS558072A JP8116278A JP8116278A JPS558072A JP S558072 A JPS558072 A JP S558072A JP 8116278 A JP8116278 A JP 8116278A JP 8116278 A JP8116278 A JP 8116278A JP S558072 A JPS558072 A JP S558072A
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- normal
- wafer
- tape
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE: For facilitating selection, to divide a semiconductor wafer in pellets, stick adhesive tape to either of a normal shape pellet group and the non-normal-shape pellet group placed at the periphery of said normal shape pellet group, and leave either of said groups on said tape through break.
CONSTITUTION: Scratch 3 groove is formed by scribing a semiconductor wafer 1 in a given pellet size. At this time, pellets are kept interconnected by the bottom face of said wafer 1, not separated. Thereby, normal pellets 8 are generated at the section excepting the periphery of said wafer 1, and waste non-normal pellets 9 at said periphery. The tape with the adhesive having such a shape as to stick only to said non-normal pellets 9 is sticked to the whole surface of said wafer 1, said wafer 1 is placed on a semi-globular projecting table 4, and said wafer 1 is broken by applying load P through the medium of a phosphor bronze plate 5 and an elastic body 6 for separating pellets. When said tape 10 is removed thereafter, only said normal pellets 8 are left on said table 4. Thus, no special selection process is necessary.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8116278A JPS558072A (en) | 1978-07-03 | 1978-07-03 | Selection of semiconductor pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8116278A JPS558072A (en) | 1978-07-03 | 1978-07-03 | Selection of semiconductor pellet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS558072A true JPS558072A (en) | 1980-01-21 |
Family
ID=13738747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8116278A Pending JPS558072A (en) | 1978-07-03 | 1978-07-03 | Selection of semiconductor pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS558072A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161485A (en) * | 1987-12-17 | 1989-06-26 | Nichiden Mach Ltd | Method for recognizing small work piece |
JPH02134844A (en) * | 1988-11-15 | 1990-05-23 | Nec Corp | Method for dicing semiconductor wafer |
-
1978
- 1978-07-03 JP JP8116278A patent/JPS558072A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01161485A (en) * | 1987-12-17 | 1989-06-26 | Nichiden Mach Ltd | Method for recognizing small work piece |
JPH02134844A (en) * | 1988-11-15 | 1990-05-23 | Nec Corp | Method for dicing semiconductor wafer |
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