JPH02134844A - Method for dicing semiconductor wafer - Google Patents

Abstract

PURPOSE:To eliminate unnecessary dicing and reduce the time required for dicing by a method wherein positions of street lines including four sides around an acceptable pellet in a semiconductor wafer are calculated from the addresses and electrical characteristics data of the respective pellets in the semiconductor wafer which is diced along those street lines only. CONSTITUTION:In a dicing method by which a semiconductor wafer 2 is divided into individual pellets 3, positions of street lines 6 including four sides around an acceptable pellet 4 in the semiconductor wafer 2 are calculated from the addresses and electrical characteristics data of the respective pellets 3 in the semiconductor wafer 2 which are obtained in processes before a dicing process and the semiconductor wafer 2 is diced along only the street lines 6 including the four sides around the acceptable pellet 4. For instance, the wafer 2 is diced along the X- and Y-direction of the wafer 2 only at the positions of the street lines 6 including the four sides around the acceptable pellet 4. If one acceptable pellet 4 exists in the wafer 2, dicing lines 5 after dicing are as shown in the figure.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a dicing method for dividing a semiconductor wafer into individual pellets.

[Conventional technology]

Conventionally, when dividing a semiconductor wafer (hereinafter referred to as wafer) into individual pellets, the wafer is aligned on a dicing stage by automatic recognition using a camera, and then a blade rotating at high speed is used to separate the wafer into individual pellets. Wafer X, Y
Dicing was performed sequentially from the edge of the wafer along a street line corresponding to the pellet size in the direction, and the pellets were separated into individual pellets.

[Problem to be solved by the invention]

In the conventional dicing method described above, all of the street lines in the wafer are diced along the street lines according to the pellet dimensions on the wafer. If they are present unevenly on the top, there is a disadvantage that the number of street lines that do not require dicing increases, and the unnecessary time required for dicing increases. In particular, this has become a big problem with the recent trend toward higher integration and larger wafer diameters.

[Means to solve the problem]

In a dicing method for dividing a semiconductor wafer into clear pellets, the present invention provides a dicing method for dividing a semiconductor wafer into clear pellets based on address and electrical characteristic data of each pellet in the semiconductor wafer obtained in a process before the dicing process. A semiconductor wafer dicing method in which the street line position including the four sides of the pellet is calculated and only the street line including the four sides around the pellet is diced, and in the method, only the four sides around the good pellet in the semiconductor wafer are diced. This is a method for dicing semiconductor wafers.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(^) and 1(B) are a plan view and a sectional view, respectively, illustrating an embodiment of the present invention. Dicing stage 1
The wafer 2 transported above is automatically recognized using a camera, and the position of the wafer 2 is corrected.

Next, each pellet 3 in the wafer 2 obtained in the previous process
address and electrical characteristic data are input from an external storage device or host computer, and the street line position including the four sides around the good pellet 4 is calculated from among the street lines 6.

Then, only the street line position including the four sides around the good pellet 4 is diced in the X and Y directions of the wafer 2, and only the good pellet 4 is separated from the wafer 2. In FIG. 1, there is one good pellet 4 in the wafer 2.
Dicing line 5 after dicing if there are
shows.

Note that, along the same street line in the wafer, duplicate dicing is not performed on a common dicing line when there are multiple good pellets, and on a shared dicing line when there are consecutive good pellets.
Perform 1 dicing.

FIGS. 2(A) and 2(B) are a plan view and a sectional view, respectively, illustrating another embodiment of the present invention. After calculating the street line position including the four sides around the good pellet 4 in the wafer 2, the dicing blade is positioned at the X direction street line position on the four sides around the good pellet 4, and the dicing blade is lowered to meet the street line. Cut in.

Next, the dicing stage 1 is driven by the same distance as the pellet size to perform dicing, and the dicing blade is raised. Similar operation is performed on the four sides of the good pellet 4.
It is performed on the direction streak I line, and only the good pellets 4 are separated from the wafer 2.

Here, if there are two or more good pellets in a row, dice the common street line continuously,
Also, shared street lines are diced once without duplication.

〔Effect of the invention〕

As described above, according to the present invention, unnecessary dicing can be omitted by dicing only the street lines around the good pellets on the wafer, thereby shortening the dicing time. Moreover, at the same time, the amount of wear of the dicing blade is reduced, and the frequency of replacing the dicing blade is reduced.

[Brief explanation of the drawing]

FIGS. 1(A) and (B) are a plan view and a sectional view, respectively, illustrating one embodiment of the present invention, and FIGS. 2(A) and (B) are plane views, respectively, illustrating another embodiment of the present invention. They are a figure and a sectional view. 1... Dicing stage, 2... Wafer, 3...
- Pellet, 4... Good pellet, 5... Dicing line, 6... Street line.

Claims (2)

[Claims] (1) In a dicing method in which a semiconductor wafer is divided into individual pellets, the area around the good pellets in the semiconductor wafer is determined based on the address and electrical property data of each pellet in the semiconductor wafer obtained in a process before the dicing process. A method for dicing semiconductor wafers, which comprises calculating the street line position including the four sides and dicing only the street line including the four sides around the non-defective pellet. (2) The method for dicing a semiconductor wafer according to claim (1), wherein only the four sides around the good pellets in the semiconductor wafer are diced.