JPH09219410A - Method and device for mounting of semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method which can reduce flaws and cracks in a semiconductor element when compared to a conventional one during manufacturing of a semiconductor device of a lead-on-chip structure and can mount a semiconductor element on a lead frame making mounting accuracy higher than that of a conventional one. SOLUTION: A semiconductor wafer 13 wherein each semiconductor element 13a is divided and temporarily fixed and a lead frame 17 are arranged under the tight of a common recognition device 19. In the recognition device 19, a position of the semiconductor element 13a is detected and the semiconductor element 13a is raised from its rear by a separation means 21 for separating the element 13a from the semiconductor wafer 13. The separated semiconductor element 13a is attracted by a semiconductor element moving means 23 at its rear and the element 13a is moved so that its front comes into contact with a specified position of a lead frame 17 while detecting a position of the element 13a and the lead frame 17 by the recognition device 19.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a semiconductor element on a lead frame when manufacturing a semiconductor device having a LOC (lead-on-chip) structure, and a mounting apparatus suitable for carrying out this method. It is a thing.

[0002]

2. Description of the Related Art When manufacturing a semiconductor device having a LOC structure, mounting of a semiconductor element on a lead frame has conventionally been generally performed as follows. First, the position of each semiconductor element formed in large numbers on a semiconductor wafer is detected using a recognition device such as a camera. Although each semiconductor element is in a state of being divided by dicing or the like, it is in a state of being temporarily fixed by a dicing tape or the like. Next, the semiconductor element is moved from the semiconductor wafer to a location for position correction by the holding jig. At the location where this position correction is performed, the position and inclination of the semiconductor element are corrected by another camera so that the element is mounted on the lead frame as desired. Next, the semiconductor element whose position has been corrected is moved and pressure-bonded to a separately positioned lead frame with the front surface side of the semiconductor element in contact with the back surface of the lead frame.

[0003]

However, in the above-described conventional mounting method, the individual semiconductor elements on the semiconductor wafer are moved to a position where the position correction is performed at a position different from that of the semiconductor wafer by using the holding jig. Since the position is corrected there, an external force is applied to the surface of the semiconductor element and the outer peripheral portion during movement or position correction. Therefore, there is a risk that the semiconductor element may be damaged or chipped. In addition, there is a risk that foreign matter may adhere to the semiconductor element when it is moved by the holding jig or when the position is corrected. Also,
In the above-described conventional mounting method, the position correction of the semiconductor element and the positioning of the lead frame, which is the mounted object, at the time of mounting are performed by different recognition devices. Therefore, there is also a problem that a positional deviation between the semiconductor element and the lead frame is likely to occur.

[0004]

According to the method for mounting a semiconductor element of this application, therefore, when mounting the semiconductor element on the lead frame when manufacturing the semiconductor device having the LOC structure, the semiconductor element is formed. A semiconductor wafer, which is a semiconductor wafer in which individual semiconductor elements are divided and is in a temporarily fixed state, and a lead frame are arranged in the field of view of a common recognition device, and the semiconductor device in the temporarily fixed state is recognized by the recognition device. Position, the semiconductor element is lifted from its back surface by a separating means to separate the element from the semiconductor wafer, the separated semiconductor element is adsorbed on its back surface by a moving means, While detecting the positions of the element and the lead frame, the element is moved so that the surface thereof comes into contact with a predetermined position of the lead frame to carry out the mounting. It is characterized in.

According to this mounting method, the semiconductor element can be moved from the semiconductor wafer to the lead frame side using only the back surface of the semiconductor element. Moreover, the position of the semiconductor element can be corrected so that the semiconductor element is located at a predetermined position with respect to the lead frame during the movement. Moreover, the correlation between the desired mounting position of the lead frame and the position of the semiconductor element that is the mounted object is
It can be grasped by one recognition device.

Further, according to the semiconductor element mounting apparatus of this application, in the apparatus for mounting the semiconductor element on the lead frame when manufacturing the semiconductor device having the LOC structure, it is a semiconductor wafer in which the semiconductor element is formed. And a stage for mounting a semiconductor wafer in which individual semiconductor elements are divided and temporarily fixed, a stage for mounting a lead frame provided above the stage for the wafer, and the lead frame. And a recognition device which is provided above the wafer stage and is used for detecting the positions of the individual semiconductor elements on the lead frame and the semiconductor wafer, and one semiconductor element from the back surface of the semiconductor wafer placed on the wafer stage. And a separating means for separating the device from the semiconductor wafer by raising A semiconductor element in a state of being held by suction on the back surface, moving the held semiconductor element in the stage direction for the lead frame, and having a semiconductor element moving means capable of driving itself for position correction. Characterize.

According to this semiconductor element mounting apparatus, the invention relating to the above-described semiconductor element mounting method can be easily implemented.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a semiconductor element mounting method and a semiconductor element mounting apparatus of the present application will be described below with reference to the drawings. However, the drawings used in the description are merely schematic representations so that the invention can be understood. Also, in each of the drawings, the same components are denoted by the same reference numerals, and duplicate description thereof may be omitted.

1. Description of Mounting Device FIG. 1 is a diagram illustrating an embodiment of a mounting device for a semiconductor element. In FIG. 1, 11 is a stage for mounting the semiconductor wafer 13 (wafer stage), 15 is a stage for mounting the lead frame 17 (lead frame stage), 19 is a recognition device, and 21 is Separating means and 23 are semiconductor element moving means, respectively. In the figure, the stages 11 and 15 and the semiconductor wafer 1 are shown.
Note that each of the lead frame 17 and the lead frame 17 is shown only partially.

In this case, the wafer stage 11 supports only the outer peripheral portion of the semiconductor wafer 13, and there is no stage when it faces the portion of the semiconductor wafer 13 where the semiconductor element 13a is formed (open). State), which is a frame-shaped stage. With such a stage, the separating means 21 is removed from the back surface of the semiconductor wafer 13 by using the open portion of the semiconductor element 13a.
This is because it can be contacted with. Here, it is preferable that the stage 11 for the wafer has a structure capable of moving the semiconductor wafer 13 in each of the X, Y and Z directions and further rotating (as indicated by θ in FIG. 1) in the XY plane. is there. In this case it does. The semiconductor wafer 13 has a large number of semiconductor elements 13a formed therein, and the individual semiconductor elements 13a are divided by dicing or the like, and are temporarily fixed by dicing tape or the like.

The stage 15 for the lead frame is also used.
Are provided above the wafer stage 11. Further, the stage 15 for the lead frame is a frame-shaped stage in which at least a portion of the lead frame 17 facing the portion where the semiconductor element is to be mounted has no stage (open state). This is because with such a stage, the semiconductor element 13a can be brought into contact with the predetermined position on the back surface of the lead frame 17 by the semiconductor element moving means 23 by utilizing the opened portion. Here, it is preferable that the lead frame stage 15 has a structure in which the lead frame 17 can be moved in each of the X, Y and Z directions and can be rotated in the XY plane. In this case it does.

The recognition device 19 is provided above the stage 15 for the lead frame. This recognition device 19
Is used for detecting the positions of the individual semiconductor elements 13a on the lead frame 17 and the semiconductor wafer 13, and is a recognition device common to these. This recognition device is, for example, CC
It can be configured with an arbitrary one such as a D camera or a TV camera. The recognition device has a zoom function and an autofocus function.

The separating means 21 is for separating one semiconductor element 13a from the semiconductor wafer 13 by raising one semiconductor element 13a from the back surface of the semiconductor wafer 13 placed on the wafer stage 11. Here, a plurality of (here, four) pins 21a are provided so that the semiconductor element 13a can be raised above the semiconductor wafer 13 from the back surface of the semiconductor wafer 13 by sticking out of the dicing tape. Therefore, this separating means 21 is
It is configured to be movable in any direction. Further, it is preferable that the separating means in this case is configured to be movable in each of the X and Y directions and to be rotationally movable in the XY plane. In this case it does.

The semiconductor element moving means 23 adsorbs and holds the semiconductor element 13a, which has been raised by the separating means 21, on the back surface thereof, and moves the held semiconductor element in the direction of the lead frame stage 17. In addition, it can be driven by itself for position correction. Specifically, it is a comb-shaped support body having grooves at positions corresponding to the plurality of pins 21a of the separating means 21, and the support body having suction ports S for adsorbing the semiconductor element 13a in some places. The semiconductor element moving means 23 is composed of a driving mechanism (not shown) for moving the support in each of the X, Y and Z directions, and a suction means (not shown).

These wafer stage 11, lead frame stage 15, recognition device 19, and separating means 21
Each of the semiconductor element moving means 23 and the semiconductor element moving means 23 is configured to be controlled by any suitable control device such as a computer (not shown).

2. Description of Mounting Method Next, an embodiment of a method of mounting a semiconductor element will be described with reference to FIGS. 1 and 2A and 2B. Here, FIGS. 2A and 2B show a procedure until the semiconductor element 13a is separated from the semiconductor wafer 13 by the separating means 21, and the separated semiconductor element 13a is suction-held by the semiconductor element moving means 23. It is the figure mainly shown.

Individual semiconductor elements 13 are formed by dicing or the like.
A semiconductor wafer 13 in a state of having a large number of semiconductor elements 13a, which is divided into a pieces but is temporarily fixed by a dicing tape or the like (not shown), is placed on the wafer stage 11. The lead frame 17 is placed on the lead frame stage 15.

Next, the separating means 21 is moved below the back surface of the desired semiconductor element 13a on the semiconductor wafer 13 according to an instruction from a control device (not shown). The recognition device 19 detects the position of the semiconductor element 13a and the like. Further, the separating means 21 is moved upward so as to raise the semiconductor element 13a above the surface of the semiconductor wafer 13 (see FIG. 2A). At this time, the pin 21 of the separating means 21
After a breaks through the dicing tape (not shown), it hits the back surface of the semiconductor element 13a and raises it, so that the semiconductor element 13a is separated from the semiconductor wafer 13 (see FIG. 2A).

Next, the semiconductor element 13 in this raised state
The semiconductor element moving means 23 is moved to the lower side of a according to an instruction from a control device (not shown). Semiconductor element 13a at this time
The position is detected by the recognition device 19. The shape of the semiconductor element moving means 23 is devised (developed into a comb shape) so as not to come into contact with the pin 21a of the separating means 21, so that the semiconductor element 1 does not come into contact with the pin 21a.
It is moved to the back side of 3a. Then, the semiconductor element moving means 13a adsorbs and holds the semiconductor element 13a on its back surface (see FIG. 2B).

The semiconductor element moving means 23 holding the semiconductor element 13a is moved toward the lead frame stage 15 according to an instruction from a control device (not shown). At this time, the recognition device 19 recognizes the relationship between the position of the semiconductor element 13a being moved and the mounting position on the lead frame 17, and sends information necessary for proper movement of the semiconductor element moving means 23 to a control device (not shown). send. Receiving this information, the control device (not shown) causes the semiconductor element moving means 2
The drive mechanism (not shown) provided in 3 causes the comb-shaped support of the semiconductor element moving means 23 to move to X, Y,
It is moved in each direction of Z and is rotated (θ direction). As a result, the position of the semiconductor element 13 is corrected. Then, the moving means 23 is driven so that the semiconductor element 13a is brought into contact with a predetermined position on the back surface of the lead frame 17. The semiconductor element 13a may be fixed to the lead frame 17 by a known LOC mounting technique.

As is clear from the above description, according to the mounting method and mounting apparatus of this application, the semiconductor element is used as the lead frame by using only the back surface of the semiconductor element without touching the front surface or the outer peripheral portion of the semiconductor element. You can see that it can be implemented. Further, it can be seen that the mounting can be performed while the correlation between the desired mounting position of the lead frame and the position of the semiconductor element that is the mounted object is grasped by one recognition device.

Although the embodiments of the inventions according to the present application have been described above, the inventions are not limited to the above-mentioned embodiments. For example, the structure of the stages 11 and 15 described in the embodiment, the structure of the separation means 21,
The structure of the semiconductor device moving means 23 is merely an example. Other suitable structures can be made without departing from the purpose of the present application.

[0023]

As is apparent from the above description, according to the invention of the mounting method of this application, the semiconductor wafer in which the individual semiconductor elements are divided and in the temporarily fixed state and the lead frame are commonly used. Place it in the field of view of a simple recognition device. Then, the position of the semiconductor element is detected by the recognition device, and the semiconductor element is lifted from the back surface thereof by the separating means to separate the element from the semiconductor wafer. Then, the separated semiconductor element is adsorbed on the back surface thereof, and while the recognition device detects the positions of the element and the lead frame, the element is moved so that the surface thereof contacts the predetermined position of the lead frame. Perform the above-mentioned mounting.

According to the invention of the mounting apparatus of this application, a predetermined wafer stage, a lead frame stage, a recognition device common to the wafer and the lead frame, and a semiconductor element separating means. , Means for moving the semiconductor element.

Therefore, according to the invention of the mounting method and the invention of the mounting apparatus, it is understood that the semiconductor element can be mounted on the lead frame without touching the surface or the outer peripheral portion of the semiconductor element. Therefore, conventionally, it can be expected to reduce the occurrence of scratches and chips in the semiconductor element. Further, the mounting can be performed while the correlation between the mounting position of the lead frame and the position of the semiconductor element is grasped by one recognition device. Therefore, it can be expected that the mounting accuracy is improved as compared with the related art.

[Brief description of drawings]

FIG. 1 is an explanatory diagram (part 1) of an embodiment, and is mainly an explanatory diagram of a mounting apparatus of the embodiment.

2 (A) and 2 (B) are explanatory views (2) of the embodiment, in which a semiconductor element is mainly separated from a semiconductor wafer by a separating means, and the separated semiconductor element is moved to a semiconductor element moving means. It is a figure showing the procedure until it is adsorbed and held by.

[Explanation of symbols]

 11: Wafer stage 13: Semiconductor wafer 15: Lead frame stage 17: Lead frame 19: Recognition device 21: Separation means 21a: Pin 23: Semiconductor element moving means S: Suction port

Claims (2)

[Claims] 1. When mounting a semiconductor element on a lead frame when manufacturing a semiconductor device having a LOC structure, the semiconductor wafer is a semiconductor wafer in which individual semiconductor elements are divided into a temporarily fixed state. The semiconductor wafer and the lead frame are placed under the field of view of the common recognition device, the position of the semiconductor element in the temporarily fixed state is detected by the recognition device, and the semiconductor element is lifted from its back surface by the separating means. Then, the element is separated from the semiconductor wafer, the separated semiconductor element is adsorbed on the back surface by a moving means, and while the position of the element and the lead frame is detected by the recognition device, the element is separated from the front surface. A method for mounting a semiconductor element, wherein the mounting is performed by moving the lead frame so as to come into contact with a predetermined position. 2. An apparatus for mounting a semiconductor element on a lead frame when manufacturing a semiconductor device having a LOC structure, wherein the semiconductor wafer is a semiconductor wafer in which individual semiconductor elements are divided and temporarily fixed. A stage for mounting a semiconductor wafer, a stage for mounting the lead frame on the wafer, a stage for mounting the lead frame, and a stage for mounting the lead frame on the stage. And a recognition device commonly used for detecting the position of each semiconductor element on the semiconductor wafer, and the semiconductor element is lifted from the back surface of the semiconductor wafer placed on the wafer stage to separate the element from the semiconductor wafer. And a semiconductor element in a state of being raised by the separating means by adsorbing and holding the semiconductor element on the back surface. The semiconductor element is moved to the stage direction of the lead frame, and mounting apparatus for a semiconductor device, characterized in that it comprises a semiconductor element moving means drivable for their own position fix.