JP2705258B2 - Semiconductor process support system - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor process support system having a semiconductor process flow creating means used in a semiconductor manufacturing support system or the like.

2. Description of the Related Art A conventional example of a semiconductor process support system will be described with reference to FIG.

In the creation of a semiconductor process flow in a conventional semiconductor process support system, only one process processing condition can be set for each semiconductor wafer (hereinafter abbreviated as a wafer). For example, steps 1 (10) to 9 (90) It is composed of nine steps, and when setting four different processing conditions 5_a (51), 5_b (52), 5_c (53), 5_d (54) in step 5 (50), step 1 (10) 4 wafers (wafer No. 1 (100), 2 (200), 3 (30)
0), 4 (400)), the same processing conditions were set, and step 5 (5
In (0), process condition 5_a (5
1) was changed to wafer No. 2 (200) with process condition 5_b (5
2) was changed to wafer No. 3 (300) with process condition 5_c (5
3) to wafer No. 4 (400), process process condition 5_d (5
4) is set, and steps 6 (60) to 9 (90)
Until then, the same processing conditions were set again for the four wafers 100 to 400. That is, four wafers are required to set four processing conditions in one process.

Problems to be Solved by the Invention As described above, in order to set a plurality of processing conditions in a process, wafers corresponding to the number of processing conditions are required, the number of wafers increases, and the processing time increases. Had the problem of becoming

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a semiconductor process support system that can set a plurality of process processing conditions for one wafer.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a semiconductor process flow creation means for graphically displaying any semiconductor wafer in any process step and displaying the same on an output device; and Means for dividing the semiconductor wafer into a plurality of regions by selecting an arbitrary region in the region using an input device or a pointing device,
Means for setting different processing conditions using an input device or a pointing device for each of the divided areas.

According to the present invention, an arbitrary area in a wafer graphically displayed on an output device is selected using an input device or a pointing device, and the wafer is divided into a plurality of areas by the above-described configuration. Alternatively, by setting different processing conditions using a pointing device, even when a plurality of processing conditions are set, the processing conditions can be set for one wafer, and the number of wafers can be reduced.

Embodiment FIG. 1 is a flowchart of a semiconductor process flow creation means of a semiconductor process support system according to an embodiment of the present invention, and FIG. 2 shows process processing conditions of the semiconductor process support system according to an embodiment of the present invention. FIG. FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG.

First, in a semiconductor processing step including nine steps of Step 1 (10) to Step 9 (90), in Step 5 (50),
Three different processing conditions 5_a (51), 5_b (52), 5_c
(53) and 5_d (54) are set, and the number of wafers is designated as one by the wafer number setting means 1. The wafer is designated as wafer No. 1 (100). Next, nine steps are selected and arranged by the step selecting means 2 in consideration of the order from a list or the like registered in advance. From step 1 (10) to step 4 (40), the same processing condition setting means 3 applies condition 1 (11) to the entire surface of the wafer irrespective of the area of the wafer.
From the condition 4 (41) and the process processing condition are set. In step 5 (50), the wafer is schematized and displayed on an output device such as a computer terminal (means 4). A region within the wafer is selected and divided using an input device or a pointing device. For example, the wafer is divided into four regions, an upper right region (110), an upper left region (120), a lower left region (130), and a lower right region (140) (means 5). The processing conditions are set for each of the divided areas using an input device or a pointing device. For example, in the upper right area (110) of the wafer, process condition 5
_a (51), process processing condition 5_b in the upper left area (120)
(52), process processing condition 5_c (5
3), process processing condition 5_d (54) in the lower right area (140)
And four different processing conditions for one wafer 100
(Means 6). Step 6 (60) to Step 9 (90)
Until the condition 6 (61) to the condition 9 (9
1) and set the processing conditions. Finally, the set processing conditions are registered in an external storage device such as a database (DB) on the magnetic disk device (means 7).

Therefore, process processing conditions can be set for one wafer 100 from step 1 (10) to step 9 (90). further,
When the process processing conditions of the process are changed in the course of the semiconductor process, the process processing conditions can be changed for each of the wafer regions and the wafer regions, similarly to the above-described means (1 to 7).

Effect of the Invention In the present invention, a means for graphically displaying a wafer and displaying it on an output device, a means for selecting an arbitrary area in the wafer using an input device or a pointing device and dividing the wafer into a plurality of areas, a divided area Means for setting different processing conditions using an input device or a pointing device for each, a plurality of processing conditions can be set for one wafer, the number of wafers can be reduced, and the processing time can be reduced. Can be shortened. Therefore, the effect of the present invention is enormous.

[Brief description of the drawings]

FIG. 1 is a flowchart of a semiconductor process flow creating means of a semiconductor process support system according to an embodiment of the present invention, and FIG. 2 is a block diagram showing process processing conditions of the semiconductor process support system according to an embodiment of the present invention. FIG. 3 is a block diagram showing process processing conditions of a semiconductor process support system according to a conventional example. 1... Means for designating the number of wafers, 2.
... Same processing condition setting means, 4 ... display means, 5 ... dividing means, 6 ... processing condition setting means, 7 ... registration means.

Claims (3)

(57) [Claims] 1. A semiconductor process flow creation means for graphically displaying an arbitrary semiconductor wafer in an arbitrary process step and displaying it on an output device, and selecting an arbitrary region in the semiconductor wafer using an input device or a pointing device. And a means for setting different processing conditions using an input device or a pointing device for each of the divided areas. 2. The semiconductor device according to claim 1, further comprising means for changing a region division of the semiconductor wafer when a change occurs in an arbitrary process condition of an arbitrary process during the semiconductor process. Semiconductor process support system. 3. The semiconductor device according to claim 1, further comprising: means for enabling a change in a process condition for each region of the semiconductor wafer when a change occurs in a given process condition of a given process during the semiconductor process. 2. The semiconductor process support system according to claim 1.