JPH06181152A - Forming apparatus for classificatin of wafer according to condition - Google Patents

Abstract

PURPOSE:To provide an apparatus for manufacturing wafers while classifying them according to conditions, in which the steps of procedure can be reduced and the time required for manufacturing wafers while classifying them according to conditions can be shortened too. CONSTITUTION:A plurality of groups for classifying wafers according to conditions are made by group-making means 10, the processing conditions of each classifying group are set by processing conditions-setting means 20, and wafers to be processed by each classifying group are set by processed wafer- setting means 30. Thus, wafers are classified according to conditions in flexible order by these three steps of procedure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for creating a condition classification of wafers for defining process processing conditions for each wafer, which is used in a manufacturing support system for electronic devices such as semiconductors.

[0002]

2. Description of the Related Art FIG. 6 shows a functional block diagram of a conventional wafer condition dividing / creating apparatus.
A conventional wafer condition dividing / creating apparatus will be described by taking as an example the condition dividing and creating of wafers when manufacturing.

In a wafer condition dividing / creating apparatus for creating a process flow that defines processing conditions for each wafer in a semiconductor manufacturing process, a parameter number setting means 101 sets the number of parameters for changing wafer processing conditions in a process. .

The parameter designating means 102 designates parameters for changing the wafer processing conditions in the process. The parameter specifying unit 102 repeatedly specifies the number of parameters set by the parameter number setting unit 101.

The parameter processing condition setting means 103 sets the processing conditions of the parameters designated by the parameter designating means 102 for dividing the conditions. Processing wafer setting means 10
4 sets a wafer to be processed under the processing conditions set by the parameter processing condition setting means 103. The parameter processing condition setting means 103 and the processing wafer setting means 10
4 is repeatedly set for each parameter designated by the parameter designating means 102.

In the conventional condition dividing / creating apparatus configured as described above, it is necessary to perform as many as four procedures and condition the wafers in a predetermined order.

[0007]

That is, in the wafer condition dividing / creating apparatus having the above-mentioned conventional structure, it takes a lot of time because four procedures have to be performed in the determined order in the wafer condition dividing / creating. Had a problem.

The present invention solves the above problems, and an object of the present invention is to provide a wafer condition division preparation apparatus capable of shortening the wafer condition division preparation time.

[0009]

In order to solve the above problems, the present invention is directed to a group creating means for creating a condition dividing group for changing processing conditions for each wafer, and each wafer processing operation created by the group creating means. A process processing condition setting means for setting a process processing condition of a group and a process wafer setting means for setting a processed wafer of each wafer processing group created by the group creating means are provided.

[0010]

With the above structure, a plurality of condition dividing groups are created by the group creating means, the process processing conditions of each condition dividing group are set by the process processing condition setting means, and the process wafers of each condition dividing group are set by the process wafer setting means. The wafer conditions can be classified in three steps and in a flexible order.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example in which an embodiment of a wafer condition dividing preparation device of the present invention is applied to a semiconductor process flow preparation device using a computer will be described below with reference to FIGS.

FIG. 1 is a functional block diagram of a wafer condition dividing / creating apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing an example of a process condition table of the wafer condition dividing / creating apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a diagram showing an example of a group forming means of the wafer condition dividing / creating device of one embodiment of the present invention, FIG. 4 is a diagram showing an example of a process processing condition setting means of the wafer condition dividing / creating device of one embodiment of the present invention, FIG. 5 is a view showing an example of processing wafer setting means of the wafer condition dividing / creating apparatus according to the embodiment of the present invention.

As shown in FIG. 1, the wafer condition division / preparation apparatus comprises a group preparation means 10, a process treatment condition setting means 20, and a treatment wafer setting means 30. Each of these will be described in detail below.

The group creating means 10 creates a condition group for changing the processing condition for each wafer.
Process number 41, Sub number 42, Process name 43, Processing condition 4
4. A specific record designated in the process condition table 40 (see FIG. 2) on the auxiliary storage having the processed wafer 45 as an item is copied to create a new record. At this time, 1 is added to the item value of the Sub number 42 of the copy source record and registered as the item of the Sub number 42 of the new record. However, when the item number of Sub number 42 of the copy source record is 0, the Sub number 42 of the copy source record
1 is registered in the item, and 2 is registered in the item of Sub number 42 of the new record.

An embodiment of the group creating means 10 will be described with reference to FIG. FIG. 3 is an example of a screen display when the group creating means 10 is realized by computer software. A process processing sequence 63, a process processed wafer 64, etc. in the semiconductor manufacturing process are displayed, and a menu 65 arranged in the upper part.
Process flow is created by the operation of. For example 6-
To copy the condition classification of 2 steps 61 to create a new group, select 6-2 step 61 by mouse click, execute the condition classification ▽ copy menu 62, and copy the record 51 of the process condition table 40. Then, a new record 52 is created.

The process processing condition setting means 20 is for setting process processing conditions for each condition group created by the group creating means 10. Each process is set to the item of the processing condition 44 of the corresponding record in the process condition table 40. Register processing conditions.

Next, an embodiment of the process treatment condition setting means 20 will be described with reference to FIG. FIG. 4 shows process processing condition setting means 2
It is an example of a screen display when 0 is realized by computer software. The screen shows the process conditions 73 of the semiconductor manufacturing process.
Etc. are displayed, and the process processing condition 73 is set by keyboard input and selection from a list. Eg 6
In order to set the processing condition of the -3 step 71, the 6-3 step 71 is selected by mouse click, the detailed setting ▽ step menu 72 is executed, and the item of the processing condition 44 of the record 52 of the process condition table 40 is processed. Register the conditions.

The process wafer setting means 30 sets process wafers for each condition group created by the group creating means 10, and registers each process wafer in the process wafer item 45 of the corresponding record of the process condition table 40. To do.

An embodiment of the processing wafer setting means 30 will be described with reference to FIG. FIG. 5 shows a screen display example when the processing wafer setting means 30 is realized by computer software.
A process process sequence 63, a process process wafer 64, and the like in the semiconductor manufacturing process are displayed, and the process wafer is set by operating the mouse. For example, in order to set the processed wafer of 6-3 step 71, the wafer pattern 81 is selected by the pointing device, and the processed wafer is registered in the item of the processed wafer 45 of the record 52 of the process condition table 40.

The order of the process condition setting means 20 and the process wafer setting means 30 does not matter. Further, the processing by the process processing condition setting means 20 and the processing wafer setting means 30 may be repeated for each condition group.

As described above, according to this embodiment, the wafer conditions can be divided in three steps and in a flexible order. In this embodiment, the auxiliary storage device is used as the storage means of each table, but the main storage device may be used. A storage means using a list structure may be used instead of the table.

[0022]

As described above, according to the wafer condition dividing / creating apparatus of the present invention, the group creating means for creating the condition dividing group for changing the processing condition for each wafer and the group creating means. By providing the process processing condition setting means for setting the process processing condition of each wafer processing group and the process wafer setting means for setting the processed wafer of each wafer processing group created by the group creating means, three steps are performed. Moreover, the wafer conditions can be sorted in a flexible order, and the wafer conditions can be sorted in a short time.

[Brief description of drawings]

FIG. 1 is a functional block diagram of a wafer condition classification creation device according to an embodiment of the present invention.

FIG. 2 is a diagram showing an example of a process condition table of a wafer condition dividing / creating apparatus according to an embodiment of the present invention.

FIG. 3 is a diagram showing an example of execution by computer software of a group creating means of a wafer condition classification creating apparatus according to an embodiment of the present invention.

FIG. 4 is a diagram showing an example of execution by computer software of a process processing condition setting unit of a wafer condition division creation device according to an embodiment of the present invention.

FIG. 5 is a diagram showing an example of execution by computer software of processing wafer setting means of the wafer condition dividing / creating apparatus in an embodiment of the present invention.

FIG. 6 is a functional block diagram of a wafer condition dividing / creating apparatus in a conventional example.

[Explanation of symbols]

 10 Group Creating Means 20 Process Treatment Condition Setting Means 30 Process Wafer Setting Means 40 Process Condition Table 41 Process Number 42 Sub Number 43 Process Name 44 Process Condition 45 Process Wafers 51, 52 Records 61 6-2 Processes 62 Copy Menu 63 Process Process Order 64 process wafer 65 menu 71 6-3 process 72 detailed setting menu 73 process condition 81 wafer pattern

Claims (1)

[Claims] 1. A wafer condition classifying device for creating a process flow for defining a process condition of a semiconductor manufacturing process for each wafer, and a group creating means for creating a condition group for changing a process condition for each wafer. Process processing condition setting means for setting process processing conditions of each wafer processing group created by the group creating means, and process wafer setting means for setting process wafers of each wafer processing group created by the group creating means. A wafer condition classification preparation device provided.