JP2000348994A - Semiconductor manufacturing device and manufacture of device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute copying between patch jobs with high operability at generation of the patch jobs. SOLUTION: A semiconductor manufacture device can expose plural circuit patterns on one wafer, by executing a patch job constituted of plural single jobs where the exposure condition of the circuit pattern is set. A data storage part storing position data for making exposures of the single jobs constituting the patch job corresponding to the region of a layout drawing 11 and shape data showing the shapes of the exposure regions of the respective single jobs is installed. At the generation of the patch job, the respective single jobs constituting the generated patch job are individually copied from the existed single jobs, while the table is updated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a semiconductor manufacturing apparatus and a device manufacturing method capable of processing a patch job for executing a plurality of single jobs with exposure conditions set on one wafer.

[0002]

2. Description of the Related Art In a recent semiconductor exposure apparatus, parameters for a wafer positioning process and an exposure process are prepared for exposing a circuit pattern onto a wafer, and various exposure conditions can be adjusted by changing the values of these parameters. It can be set (hereinafter, this parameter group is called a job).

However, when the same type of semiconductor is exposed on one wafer, the exposure is performed in one job (hereinafter, referred to as a single job). Accordingly, it has become desirable to expose many types of semiconductors on one wafer, and a need has arisen for a job for executing a plurality of single jobs (hereinafter referred to as a patch job).

Conventionally, when creating such a patch job, an existing single job is used, or a single job in which parameter values are newly set is created, and this single job is copied by a number required for a patch. Then, first, a single job (hereinafter, referred to as a patch single job) constituting the patch job has created a patch job in which all the parameter values are the same as those of the copy source single job. Then, the parameter value of each patch single job of the patch job composed of the same patch single job is corrected to create the patch job to be obtained.

Further, an existing single job is copied,
When creating a patch job, the existing single job is specified using the directory name and file name on the computer, and after understanding the parameter values, shot layout, etc. of the existing single job, creating the patch job Operation was being performed.

[0006]

However, in the above-mentioned conventional example, when a patch job is created, all of the patch single jobs constituting the patch job are copied from an existing single job or a newly created single job. Since a patch job having the same parameter value as the copy source single job had to be created, there were the following disadvantages. A new patch job cannot be created directly using a patch single job that constitutes an existing patch job. Therefore, when creating a patch job, there is a problem in that extra work such as creating a single job having the same parameter value occurs because copying cannot be performed from a patch single job that constitutes an existing patch job. Was. It is not possible to copy from another job in patch single job units that make up an existing patch job. Therefore, once a patch job is created, even if it is desired to replace some of the patch single jobs with another job, the same parameter values must be input again using the patch job editing function. Instead, it takes a long time to create. To specify an existing single job, a patch job creation operation must be performed after grasping each parameter value, shot layout, and the like of the existing single job.

An existing single job is specified by a directory name and a file name on a computer.
At the time of creation, the shot layout and the like of the copy source could not be confirmed, and the user had to prepare for grasping the shot layout and the like of the existing single job in advance and then had to operate.

The present invention solves the above-mentioned problems of the prior art,
It is an object of the present invention to provide a semiconductor manufacturing apparatus and a device manufacturing method capable of performing highly operable copying between patch jobs in creating a patch job.

[0009]

In order to achieve the above object, the present invention executes a patch job composed of a plurality of single jobs in which exposure conditions of a circuit pattern are set, so that a single job can be performed on one wafer. In a device manufacturing method for exposing a plurality of circuit patterns or a semiconductor manufacturing apparatus capable of performing such an exposure, position data and exposure data for each exposure area of each single job that constitutes a patch job correspond to the area of the layout diagram. The shape data indicating the shape of the exposure area of the job is stored for each single job in the form of a table, and when creating a patch job,
While updating the table of the patch job to be created, each single job constituting the patch job to be created is copied separately from the existing single job.

Normally, copying is performed by creating image data for displaying on a screen a layout diagram showing an exposure area on a wafer by a patch job to be created and an existing patch job or an existing single job as a copy source, When an arbitrary single job shown in the layout diagram is designated from the input section of data or a command, the designated single job is specified with reference to the table, and the specified single job is copied.

The layout diagram may be displayed so that a layout diagram of a patch job to be created and a layout diagram of an existing patch job or an existing single job as a copy source are arranged side by side on the same screen. Also,
Before copying the designated single job, the layout diagram of the single job may be displayed on the layout diagram of the patch job to be created. With such a configuration, it is possible to further improve the operability of copying between patch jobs.

The specific means for specifying a specified single job is not particularly limited. For example, when a position on the screen is specified by a mouse or a touch panel, a single job corresponding to a display area including the specified position is stored in a table. Can be searched and specified.

[0013]

An embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a view best showing the features of the present invention, and is an example of a screen for realizing copying of a patch single job between patch jobs. In the figure, 11 is a layout diagram of the patch job to be created, 12 is a layout diagram of the patch job to be copied, 13 is a patch single job configuration list of the patch job to be created, and 14 is A patch single job configuration list of the patch job to be copied, 15 is a command button for sending a command for actually processing the copy of the patch single job, 16 is a function button for terminating the function,
A command button for exiting this screen and returning control to the previous screen. As described above, on the patch job creation screen in this example, two patch jobs for performing the copying process are displayed on the same screen, and the patch single job to be copied can be designated.

In FIG. 1, a patch job 11 to be created is composed of three patch single jobs, and a patch job 12 as a copy source is
This shows an example in the case of being composed of patch single jobs.

Here, the concept of a patch job will be briefly described with reference to FIG. The patch job is composed of a plurality of patch single jobs, and in the figure, three patch single jobs (jobA, jobB and jo
bC). Each patch single job has parameter values in which exposure conditions of the circuit pattern are set, and an aggregate of these is called a patch job.

FIGS. 3 and 4 schematically show tables for controlling screens for realizing copying between patch jobs in FIG. FIG. 3 shows a table 30 for a creation target patch job, and FIG. 4 shows a table 4 for a copy source patch job.
Indicates 0.

These tables are composed of the following data items. Reference numerals 31 and 41 denote patch single job names for identifying patch single jobs constituting the patch job, and display areas 32 and 42 denote coordinate values for indicating the patch single job area on the patch job layout diagram. 33 and 43 are display data for drawing the shape of each patch single job on the patch job layout diagram.

Next, the function and operation of this embodiment will be described with reference to the flowchart of FIG. The patch job creation screen shown in FIG. 1 is started from a console program serving as a man-machine interface in the semiconductor exposure apparatus. It is started after the copy source patch job is selected.

When this function is activated, first, at step 50
In step 1, necessary data is read from the parameter value of the patch job to be created specified on the previous screen, and written to the patch job table 30 to be created. Further, necessary data is read from the parameter value of the copy source patch job specified on the previous screen, and written to the copy source patch job table 40.

Then, the patch job copy screen shown in FIG. 1 is displayed from the creation target patch job table 30 into which the data is written and the copy source patch job table 40 (step 502). Here, since this is the initial screen of this function, each patch single job of the creation target patch job and the copy source patch job is still in a non-selected state, but it has a default value and the top of each patch job. Patch single job to be selected. That is, the layout diagram of the patch job to be created 11
In the above, the color of the exposure area of the first patch single job is changed so that the exposure area of the copy target can be visually recognized so as to be distinguished from the exposure areas of other patch single jobs. Similarly, on the layout diagram of the copy source patch job, the color of the exposure area of the first patch single job is changed so that the exposure area to be copied can be visually recognized. Also, two patch job configuration lists 1
In 3 and 14, the first patch single job is set to the selected state.

Further, in the layout diagram 11 of the patch job to be created, the exposure area when the copy source patch single job is copied is specified, and the exposure area is marked for visual confirmation. This marking is displayed in the same size and at the same position as the exposure area of the selected patch single job as the copy source, and is displayed, for example, in a transparent square frame.

Next, in step 503, the presence or absence of an input on the patch job copy screen is checked. If there is an input, the process proceeds to step 504, and if there is no input, the process returns to step 502 to be in a standby state.

The input processing (step 504) on the patch job copy screen shown in FIG. 1 will be described. There are three types of inputs from the screen, a designation input of a creation target patch single job, a designation input of a copy source patch single job, and a copy execution command input.

First, a process of designating and inputting a single job to be created will be described. There are two ways to specify. One is the creation target patch job layout diagram 1
In this method, the patch single job to be copied is specified by clicking the exposure area on the patch single job 1 with a mouse or touching it with a finger in the case of a touch panel display. The other is a method of selecting a patch single job to be copied in the patch single job configuration list 13 to be created by clicking with a mouse or touching it with a finger in the case of a touch panel display.

When an input is made by either of these methods, the designated patch single job is identified and read (step 511). When the exposure area on the former patch job layout diagram 11 is designated,
A search is made for an input point coordinate on the screen that is inside the display area 32 stored in the creation target patch job table 30, and the designated patch single job name 31 is determined. At this time, if the exposure areas of a plurality of patch single jobs are overlapped, a candidate patch single job name 31 is indicated, and an operation for selecting one from the names is provided. Further, when an input is made from the latter patch single job configuration list 13, a process of determining and reading the designated patch single job name is performed by input inquiry to the list.

Then, the display color of the exposure area of the patch single job selected before the designation of the patch single job in the patch single job exposure area in FIG. 11 is returned.
The exposure area of the patch single job designated this time is changed to the display color at the time of selection (step 512).

Secondly, a description will be given of a process of inputting designation of a copy source patch single job. As in the specification input processing of the creation target patch single job, there are two types of specification methods. Click the mouse on the exposure area of the patch single job on the copy source patch job layout diagram 12 with the mouse or use the finger with the touch panel display. This is a method of specifying a patch single job to be copied by touching it. The other is a method of selecting a copy source patch single job from the copy source patch single job configuration list 14 by clicking with a mouse or touching it with a finger in the case of a touch panel display.

When an input is made by any of these methods, a process of discriminating and reading the designated copy source patch single job (step 521), and updating the copy source patch job layout diagram 12 in the designated patch single job exposure area Is performed (step 522) to change the display color of the target patch in the same manner as the processing of the creation target single job. Further, with the change of the copy source patch single job, the layout diagram of the patch job to be created 11
The processing of updating the marking of the copy source patch single job exposure area displayed above is performed (step 52).
3). By updating the marking, it is possible to determine in which position the patch source single job of the designated copy source is to be copied and which patch target single job to replace on the layout diagram of the target patch job layout diagram before execution of the copy. It is specified.

Third, the execution command processing will be described. GO button 1 on the patch job copy screen in FIG.
An execution command is input by clicking the mouse 5 or touching it with a finger in the case of a touch panel display, and a copy process for each patch single job is performed between patch jobs. When the execution command is input, the parameter value of the selected copy source patch single job is copied to the selected creation target patch single job, and the parameter value is replaced (step 532). Then, the corresponding display area 32 of the creation target patch job table 30 and the layout drawing shape data 33 are updated with the corresponding data 42 and 43 of the copy source patch job table 40 (step 53).
3). Further, a patch job layout diagram to be created 11
Above, the exposure area displayed in the selected display color is deleted, and the copied exposure shape is added to the patch job layout diagram 11 in the selected display color (step 53).
4).

As an execution command, the EXIT button 16
Is input by a similar operation, this screen (FIG. 1) is terminated, and control is returned to the previous screen. The copy source patch job may be a single job, and a single job data can be copied to a patch single job of a patch job to be created.

[0031]

As described above, according to the present invention, when a new patch job is created, data of an existing patch job can be copied and created. This eliminates the need to create a single job for a single job, or to modify the data of individual patch single jobs once the same data is assigned to all patch single jobs that make up the patch job. Can be shortened.

In addition, since data can be copied from an existing patch job or single job in patch single job units, exposure condition parameter values can be replaced in patch single job units, and patch patch jobs can be replaced. The time required for editing a job can be reduced.

Further, when copying is performed in patch single job units, the exposure area where copying is to be performed can be confirmed at the copy destination in advance, so that there is also an effect of preventing a copying error.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a screen for performing inter-patch job copying according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating the concept of a patch job.

FIG. 3 is a diagram illustrating a creation target patch job table according to the embodiment of the present invention.

FIG. 4 is a diagram illustrating a copy source patch job table according to the embodiment of the present invention.

FIG. 5 is a flowchart illustrating a procedure for copying between patch jobs according to an embodiment of the present invention.

[Explanation of symbols]

11: creation target patch job layout diagram, 12: copy source patch job layout diagram, 13: creation target patch single job configuration list, 14: copy source patch single job configuration list, 15: copy GO button, 16: screen EXIT button, 30: Creation target patch job table, 31: Creation target patch single job name, 32:
Exposure area display area, 33: layout diagram shape data,
40: copy source patch job table, 41: copy source patch single job name, 42: exposure area display area, 4
3: Layout drawing shape data.

Claims (7)

[Claims] 1. A semiconductor manufacturing apparatus capable of exposing a plurality of circuit patterns on one wafer by executing a patch job including a plurality of single jobs in which exposure conditions of the circuit patterns are set. Position data for associating the exposure area of each single job constituting the patch job with the area of the layout diagram and shape data indicating the shape of the exposure area of each single job can be stored in the form of a table for each single job. A data storage unit; and a copy unit that copies each single job constituting the patch job to be created separately from an existing single job while updating the table when creating the patch job. Semiconductor manufacturing equipment. 2. The image forming apparatus according to claim 1, wherein the copying unit creates and displays image data for displaying, on a screen, a layout diagram showing an exposure area on the wafer by a patch job to be created and an existing patch job or an existing single job to be copied. And a means for specifying the specified single job by referring to the table when an arbitrary single job shown in the layout diagram is specified from the data or command input unit. 2. The semiconductor manufacturing apparatus according to claim 1, wherein said single job is copied. 3. The data display unit displays a layout diagram of the patch job to be created and a layout diagram of an existing patch job or an existing single job as a copy source side by side on the same screen. Item 3. A semiconductor manufacturing apparatus according to item 2. 4. The method according to claim 1, wherein the copying unit further includes means for displaying a layout diagram of the designated single job on a layout diagram of the patch job to be created before copying the designated single job. The semiconductor manufacturing apparatus according to claim 2. 5. A method according to claim 1, wherein said means for specifying the designated single job searches the table for a single job corresponding to a display area including the designated position when the position on the screen is designated by a mouse or a touch panel. 5. The semiconductor manufacturing apparatus according to claim 2, wherein the apparatus is specified. 6. A method of manufacturing a semiconductor device by exposing a plurality of circuit patterns on one wafer by executing a patch job composed of a plurality of single jobs in which exposure conditions of the circuit patterns are set. In the above, the position data for making the exposure area of each single job constituting the patch job correspond to the area of the layout diagram and the shape data indicating the shape of the exposure area of each single job are stored in the form of a table for each single job. A step of copying each single job constituting the patch job to be created separately from an existing single job while updating the table when creating a patch job. Method. 7. The step of copying the single job includes the steps of: displaying, on the same screen, a layout diagram showing an exposure area on a wafer by a patch job to be created and an existing patch job or an existing single job to be copied; When an arbitrary single job shown in the layout diagram is designated from the input section of data or command, the designated single job is identified by referring to the table, and the identified single job is identified. 7. The device manufacturing method according to claim 6, wherein copying is performed.