JPS55150279A - Infrared ray camera device - Google Patents
Infrared ray camera deviceInfo
- Publication number
- JPS55150279A JPS55150279A JP5772379A JP5772379A JPS55150279A JP S55150279 A JPS55150279 A JP S55150279A JP 5772379 A JP5772379 A JP 5772379A JP 5772379 A JP5772379 A JP 5772379A JP S55150279 A JPS55150279 A JP S55150279A
- Authority
- JP
- Japan
- Prior art keywords
- infrared ray
- input unit
- detector
- camera device
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/157—CCD or CID infrared image sensors
- H10F39/1575—CCD or CID infrared image sensors of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5772379A JPS55150279A (en) | 1979-05-10 | 1979-05-10 | Infrared ray camera device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5772379A JPS55150279A (en) | 1979-05-10 | 1979-05-10 | Infrared ray camera device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55150279A true JPS55150279A (en) | 1980-11-22 |
| JPS6142869B2 JPS6142869B2 (enrdf_load_stackoverflow) | 1986-09-24 |
Family
ID=13063853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5772379A Granted JPS55150279A (en) | 1979-05-10 | 1979-05-10 | Infrared ray camera device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55150279A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61229342A (ja) * | 1985-04-03 | 1986-10-13 | Fujitsu Ltd | バンプ電極の接続方法 |
| JPS61256745A (ja) * | 1985-05-10 | 1986-11-14 | Fujitsu Ltd | 半導体装置 |
| EP0663696A3 (enrdf_load_stackoverflow) * | 1994-01-13 | 1995-08-16 | Texas Instruments Inc | |
| JP2001225502A (ja) * | 1999-12-21 | 2001-08-21 | Xerox Corp | 集積発光源の高均一性を達成するためのマイクロスプリング内部配線を有するハイブリッド装置 |
| JP2007214191A (ja) * | 2006-02-07 | 2007-08-23 | Sumitomo Heavy Ind Ltd | 放射線検出器および放射線検査装置 |
| JP2011129824A (ja) * | 2009-12-21 | 2011-06-30 | Fujitsu Ltd | 電子装置の製造方法及び電子部品製造装置 |
-
1979
- 1979-05-10 JP JP5772379A patent/JPS55150279A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61229342A (ja) * | 1985-04-03 | 1986-10-13 | Fujitsu Ltd | バンプ電極の接続方法 |
| JPS61256745A (ja) * | 1985-05-10 | 1986-11-14 | Fujitsu Ltd | 半導体装置 |
| EP0663696A3 (enrdf_load_stackoverflow) * | 1994-01-13 | 1995-08-16 | Texas Instruments Inc | |
| JP2001225502A (ja) * | 1999-12-21 | 2001-08-21 | Xerox Corp | 集積発光源の高均一性を達成するためのマイクロスプリング内部配線を有するハイブリッド装置 |
| JP2007214191A (ja) * | 2006-02-07 | 2007-08-23 | Sumitomo Heavy Ind Ltd | 放射線検出器および放射線検査装置 |
| JP2011129824A (ja) * | 2009-12-21 | 2011-06-30 | Fujitsu Ltd | 電子装置の製造方法及び電子部品製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6142869B2 (enrdf_load_stackoverflow) | 1986-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS55150279A (en) | Infrared ray camera device | |
| JPS5423484A (en) | Semiconductor integrated circuit and its manufacture | |
| JPS5314561A (en) | Packaging device of semiconductor device | |
| JPS5422122A (en) | Solid state pickup element | |
| JPS5263685A (en) | Production of semiconductor device | |
| JPS5710951A (en) | Semiconductor device | |
| JPS55107251A (en) | Electronic part and its packaging construction | |
| JPS5315762A (en) | Production of semiconductor device | |
| JPS558023A (en) | Heat-generating element | |
| JPS55117254A (en) | Fabrication of electronic device | |
| JPS5259576A (en) | Semiconductor device | |
| JPS5362471A (en) | Semiconductor device | |
| JPS5368163A (en) | Production of flip chip | |
| JPS5333057A (en) | Bump type semiconductor device | |
| JPS53110370A (en) | Semiconductor device | |
| JPS5512710A (en) | Semiconductor device | |
| JPS5365063A (en) | Semiconductor device | |
| JPS57190330A (en) | Semiconductor device | |
| JPS547272A (en) | Semiconductor package | |
| JPS5429580A (en) | Semiconductor device | |
| JPS5311578A (en) | Production of semiconductor device | |
| JPS5399880A (en) | Manufacture of circuit element structure | |
| JPS5631287A (en) | Color solid image pickup element and its production | |
| JPS5333064A (en) | Semiconductor device | |
| JPS5362481A (en) | Production of semiconductor device |