JPS6142869B2 - - Google Patents
Info
- Publication number
- JPS6142869B2 JPS6142869B2 JP54057723A JP5772379A JPS6142869B2 JP S6142869 B2 JPS6142869 B2 JP S6142869B2 JP 54057723 A JP54057723 A JP 54057723A JP 5772379 A JP5772379 A JP 5772379A JP S6142869 B2 JPS6142869 B2 JP S6142869B2
- Authority
- JP
- Japan
- Prior art keywords
- ccd
- infrared
- connecting member
- sensing element
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/157—CCD or CID infrared image sensors
- H10F39/1575—CCD or CID infrared image sensors of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5772379A JPS55150279A (en) | 1979-05-10 | 1979-05-10 | Infrared ray camera device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5772379A JPS55150279A (en) | 1979-05-10 | 1979-05-10 | Infrared ray camera device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55150279A JPS55150279A (en) | 1980-11-22 |
| JPS6142869B2 true JPS6142869B2 (enrdf_load_stackoverflow) | 1986-09-24 |
Family
ID=13063853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5772379A Granted JPS55150279A (en) | 1979-05-10 | 1979-05-10 | Infrared ray camera device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55150279A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61229342A (ja) * | 1985-04-03 | 1986-10-13 | Fujitsu Ltd | バンプ電極の接続方法 |
| JP2574145B2 (ja) * | 1985-05-10 | 1997-01-22 | 富士通株式会社 | 半導体装置 |
| US5485010A (en) * | 1994-01-13 | 1996-01-16 | Texas Instruments Incorporated | Thermal isolation structure for hybrid thermal imaging system |
| US6794725B2 (en) * | 1999-12-21 | 2004-09-21 | Xerox Corporation | Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources |
| JP2007214191A (ja) * | 2006-02-07 | 2007-08-23 | Sumitomo Heavy Ind Ltd | 放射線検出器および放射線検査装置 |
| JP5287694B2 (ja) * | 2009-12-21 | 2013-09-11 | 富士通株式会社 | 電子装置の製造方法及び電子部品製造装置 |
-
1979
- 1979-05-10 JP JP5772379A patent/JPS55150279A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55150279A (en) | 1980-11-22 |
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