JPS57190330A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57190330A
JPS57190330A JP7591081A JP7591081A JPS57190330A JP S57190330 A JPS57190330 A JP S57190330A JP 7591081 A JP7591081 A JP 7591081A JP 7591081 A JP7591081 A JP 7591081A JP S57190330 A JPS57190330 A JP S57190330A
Authority
JP
Japan
Prior art keywords
bump
lead
gold
junction
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7591081A
Other languages
Japanese (ja)
Inventor
Hiroshi Osabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7591081A priority Critical patent/JPS57190330A/en
Publication of JPS57190330A publication Critical patent/JPS57190330A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To support a lead on the outside of a bump for the simultaneous installation of a plurality of leads in avoidance of end short, by providing a micro projection with the same quality of material as the bump between the bump and end surface of semiconductor element to cover the surface of the projection with heat-resisting insulating material. CONSTITUTION:A gold bump 3b and small bump 7 are provided on the Si element 2b to be arranged between the bump 3b and element end surface 6b. The bump 7 is made of gold with the area approx. 1/2 of the bump 3b and the height same. The bump 7 is covered with a polyimide film 8. When joining the lead 1 to the bump 3b by Au/Sn alloy 4, the bump 7 is not joined by an insulating film 8 without deformation, and the lead 1 is lifted up by the thickness of the insulating film 8 for no end short. Therefore, lead correction after the junction is not necessary allowing the simultaneous junction of many leads at high reliability.
JP7591081A 1981-05-20 1981-05-20 Semiconductor device Pending JPS57190330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7591081A JPS57190330A (en) 1981-05-20 1981-05-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7591081A JPS57190330A (en) 1981-05-20 1981-05-20 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57190330A true JPS57190330A (en) 1982-11-22

Family

ID=13589956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7591081A Pending JPS57190330A (en) 1981-05-20 1981-05-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57190330A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091772A (en) * 1989-05-18 1992-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and package
EP0622845A2 (en) * 1993-04-30 1994-11-02 Hewlett-Packard Company Apparatus and method for tape automated bonding beam lead insulation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091772A (en) * 1989-05-18 1992-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and package
EP0622845A2 (en) * 1993-04-30 1994-11-02 Hewlett-Packard Company Apparatus and method for tape automated bonding beam lead insulation
EP0622845A3 (en) * 1993-04-30 1995-03-29 Hewlett Packard Co Apparatus and method for tape automated bonding beam lead insulation.

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