JPS55146938A - Aging device for semiconductor element - Google Patents
Aging device for semiconductor elementInfo
- Publication number
- JPS55146938A JPS55146938A JP5435579A JP5435579A JPS55146938A JP S55146938 A JPS55146938 A JP S55146938A JP 5435579 A JP5435579 A JP 5435579A JP 5435579 A JP5435579 A JP 5435579A JP S55146938 A JPS55146938 A JP S55146938A
- Authority
- JP
- Japan
- Prior art keywords
- aging
- input signal
- terminal
- connection
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000032683 aging Effects 0.000 title abstract 7
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/326—Application of electric currents or fields, e.g. for electroforming
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5435579A JPS55146938A (en) | 1979-05-02 | 1979-05-02 | Aging device for semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5435579A JPS55146938A (en) | 1979-05-02 | 1979-05-02 | Aging device for semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55146938A true JPS55146938A (en) | 1980-11-15 |
JPS6210388B2 JPS6210388B2 (ja) | 1987-03-05 |
Family
ID=12968317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5435579A Granted JPS55146938A (en) | 1979-05-02 | 1979-05-02 | Aging device for semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55146938A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5914074U (ja) * | 1982-06-18 | 1984-01-27 | 利昌工業株式会社 | 半導体素子試験用絶縁基板 |
JPS5917870U (ja) * | 1982-07-24 | 1984-02-03 | 利昌工業株式会社 | フラット型半導体パッケージ試験用基板 |
JPS6033661U (ja) * | 1982-07-31 | 1985-03-07 | 利昌工業株式会社 | スモ−ルアウトラインパツケ−ジ型半導体素子試験用基板 |
JPH04198776A (ja) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | バーンイン装置 |
-
1979
- 1979-05-02 JP JP5435579A patent/JPS55146938A/ja active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5914074U (ja) * | 1982-06-18 | 1984-01-27 | 利昌工業株式会社 | 半導体素子試験用絶縁基板 |
JPS5917870U (ja) * | 1982-07-24 | 1984-02-03 | 利昌工業株式会社 | フラット型半導体パッケージ試験用基板 |
JPH0120701Y2 (ja) * | 1982-07-24 | 1989-06-21 | ||
JPS6033661U (ja) * | 1982-07-31 | 1985-03-07 | 利昌工業株式会社 | スモ−ルアウトラインパツケ−ジ型半導体素子試験用基板 |
JPH04198776A (ja) * | 1990-11-28 | 1992-07-20 | Mitsubishi Electric Corp | バーンイン装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6210388B2 (ja) | 1987-03-05 |
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