FR2326780A1 - Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui - Google Patents

Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui

Info

Publication number
FR2326780A1
FR2326780A1 FR7629645A FR7629645A FR2326780A1 FR 2326780 A1 FR2326780 A1 FR 2326780A1 FR 7629645 A FR7629645 A FR 7629645A FR 7629645 A FR7629645 A FR 7629645A FR 2326780 A1 FR2326780 A1 FR 2326780A1
Authority
FR
France
Prior art keywords
residing
insulation
semi
integrated circuit
conductive substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7629645A
Other languages
English (en)
Other versions
FR2326780B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of FR2326780A1 publication Critical patent/FR2326780A1/fr
Application granted granted Critical
Publication of FR2326780B1 publication Critical patent/FR2326780B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7629645A 1975-10-02 1976-10-01 Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui Granted FR2326780A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752543968 DE2543968A1 (de) 1975-10-02 1975-10-02 Integrierte schaltungsanordnung

Publications (2)

Publication Number Publication Date
FR2326780A1 true FR2326780A1 (fr) 1977-04-29
FR2326780B1 FR2326780B1 (fr) 1982-10-22

Family

ID=5958044

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7629645A Granted FR2326780A1 (fr) 1975-10-02 1976-10-01 Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui

Country Status (6)

Country Link
JP (1) JPS5252574A (fr)
DE (1) DE2543968A1 (fr)
FR (1) FR2326780A1 (fr)
GB (1) GB1540598A (fr)
IT (1) IT1073327B (fr)
NL (1) NL7610920A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2506112A1 (fr) * 1981-05-13 1982-11-19 Plessey Overseas Boitier pour dispositif electrique par exemple pour composant electronique

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55163850A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Semiconductor device
JPS55166943A (en) * 1979-06-15 1980-12-26 Fujitsu Ltd Semiconductor device
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
JPS5989542U (ja) * 1982-12-08 1984-06-18 日本電気株式会社 モノリシツク集積回路容器
EP0237725A1 (fr) * 1986-03-20 1987-09-23 GTE Products Corporation Boîtier en plastique pour circuits intégrés ayant une résistance à l'humidité élevée
JP2506233Y2 (ja) * 1990-05-07 1996-08-07 株式会社共立 管構造
JPH086522Y2 (ja) * 1990-05-09 1996-02-28 株式会社共立 噴管支持ハンドル
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1137619A (en) * 1966-11-15 1968-12-27 Itt Semiconductor devices
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
FR2075958A1 (fr) * 1970-01-07 1971-10-15 Rca Corp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
GB1137619A (en) * 1966-11-15 1968-12-27 Itt Semiconductor devices
FR2075958A1 (fr) * 1970-01-07 1971-10-15 Rca Corp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2506112A1 (fr) * 1981-05-13 1982-11-19 Plessey Overseas Boitier pour dispositif electrique par exemple pour composant electronique

Also Published As

Publication number Publication date
GB1540598A (en) 1979-02-14
IT1073327B (it) 1985-04-17
FR2326780B1 (fr) 1982-10-22
DE2543968A1 (de) 1977-04-07
JPS5252574A (en) 1977-04-27
NL7610920A (nl) 1977-04-05

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Legal Events

Date Code Title Description
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