FR2506112A1 - Boitier pour dispositif electrique par exemple pour composant electronique - Google Patents
Boitier pour dispositif electrique par exemple pour composant electroniqueInfo
- Publication number
- FR2506112A1 FR2506112A1 FR8208290A FR8208290A FR2506112A1 FR 2506112 A1 FR2506112 A1 FR 2506112A1 FR 8208290 A FR8208290 A FR 8208290A FR 8208290 A FR8208290 A FR 8208290A FR 2506112 A1 FR2506112 A1 FR 2506112A1
- Authority
- FR
- France
- Prior art keywords
- housing
- electronic component
- electrical device
- enclosure
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Packaging Frangible Articles (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
L'INVENTION CONCERNE LES BOITIERS POUR DISPOSITIFS ELECTRIQUES ET ELECTRONIQUES. ELLE SE RAPPORTE A UN BOITIER COMPRENANT UN RECIPIENT 1 AYANT UNE EXTREMITE OUVERTE ET UNE ENCEINTE 11 DELIMITANT UNE CAVITE 16 DANS LAQUELLE EST DISPOSE UN DISPOSITIF ELECTRONIQUE 4. L'ENCEINTE 11 EST PLACEE DANS LE RECIPIENT 1 ET Y EST MAINTENUE HERMETIQUEMENT PAR UN REMPLISSAGE D'UNE MATIERE 14 DE MOULAGE. APPLICATION AU CONDITIONNEMENT DES DISPOSITIFS A ONDES ACOUSTIQUES DE SURFACE, NOTAMMENT AUX FILTRES QUI NE DOIVENT PAS ETRE AU CONTACT DE LA MATIERE DE MOULAGE.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8114541 | 1981-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2506112A1 true FR2506112A1 (fr) | 1982-11-19 |
FR2506112B1 FR2506112B1 (fr) | 1986-05-30 |
Family
ID=10521752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8208290A Expired FR2506112B1 (fr) | 1981-05-13 | 1982-05-12 | Boitier pour dispositif electrique par exemple pour composant electronique |
Country Status (7)
Country | Link |
---|---|
US (1) | US4480148A (fr) |
JP (1) | JPS5825246A (fr) |
DE (1) | DE3217687A1 (fr) |
FR (1) | FR2506112B1 (fr) |
GB (1) | GB2100521B (fr) |
IT (1) | IT1152132B (fr) |
NL (1) | NL8201957A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0482419A1 (fr) * | 1990-10-25 | 1992-04-29 | Siemens Aktiengesellschaft | Module de circuit à boîtier de sécurité |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0157938A3 (fr) * | 1984-03-23 | 1987-05-13 | Siemens Aktiengesellschaft | Boítier pour composants électriques |
US4845397A (en) * | 1984-12-19 | 1989-07-04 | Tektronix, Inc. | Constraining mount system for surface acoustic wave devices |
US4716082A (en) * | 1986-10-28 | 1987-12-29 | Isotronics, Inc. | Duplex glass preforms for hermetic glass-to-metal sealing |
DE3703465C2 (de) * | 1987-02-05 | 1998-02-19 | Behr Thomson Dehnstoffregler | Verfahren zum Herstellen eines elektrischen Schaltgerätes und elektrisches Schaltgerät |
US5260601A (en) * | 1988-03-14 | 1993-11-09 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
US4870224A (en) * | 1988-07-01 | 1989-09-26 | Intel Corporation | Integrated circuit package for surface mount technology |
US4991291A (en) * | 1989-12-29 | 1991-02-12 | Isotronics, Inc. | Method for fabricating a fold-up frame |
US5123538A (en) * | 1991-04-26 | 1992-06-23 | Sundstrand Corporation | Crash protection enclosure for solid state memory devices |
JPH0590872A (ja) * | 1991-09-27 | 1993-04-09 | Sumitomo Electric Ind Ltd | 表面弾性波素子 |
US5237235A (en) * | 1991-09-30 | 1993-08-17 | Motorola, Inc. | Surface acoustic wave device package |
US5620647A (en) * | 1993-09-10 | 1997-04-15 | Calhoun Pitch Company, Inc. | Process for potting electrical circuits |
CN1099158C (zh) * | 1994-05-02 | 2003-01-15 | 埃普科斯股份有限公司 | 电子部件的封闭装置 |
DE19524001A1 (de) * | 1995-06-30 | 1997-03-06 | Siemens Ag | Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung |
US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
US6311621B1 (en) | 1996-11-01 | 2001-11-06 | The Ensign-Bickford Company | Shock-resistant electronic circuit assembly |
US6079332A (en) * | 1996-11-01 | 2000-06-27 | The Ensign-Bickford Company | Shock-resistant electronic circuit assembly |
JPH10215143A (ja) * | 1997-01-31 | 1998-08-11 | Nec Corp | 弾性表面波装置 |
US6415505B1 (en) | 1999-11-15 | 2002-07-09 | Amkor Technology, Inc. | Micromachine package fabrication method |
WO2001036320A2 (fr) * | 1999-11-15 | 2001-05-25 | Amkor Technology, Inc. | Boitier de micromachine |
US7245491B2 (en) | 2004-08-20 | 2007-07-17 | Digital Site Management Llc | Storage medium protection system |
US7198981B2 (en) * | 2004-10-21 | 2007-04-03 | Honeywell International Inc. | Vacuum sealed surface acoustic wave pressure sensor |
US7651879B2 (en) * | 2005-12-07 | 2010-01-26 | Honeywell International Inc. | Surface acoustic wave pressure sensors |
WO2008065834A1 (fr) * | 2006-11-29 | 2008-06-05 | Murata Manufacturing Co., Ltd. | Résonateur à ondes élastiques de surface et dispositif à ondes élastiques de surface |
US8059425B2 (en) * | 2008-05-28 | 2011-11-15 | Azurewave Technologies, Inc. | Integrated circuit module with temperature compensation crystal oscillator |
KR101702837B1 (ko) * | 2010-07-22 | 2017-02-07 | 삼성전자주식회사 | 필름형 전자회로를 구비하는 전자제품의 케이스 구조물 및 그 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1457305A (fr) * | 1965-05-07 | 1966-01-24 | Siemens Ag | élément constructif électrique chemisé et procédé pour son chemisage |
DE1514514B1 (de) * | 1965-07-23 | 1971-05-06 | Siemens Ag | In ein rohrfoermiges gehaeuse eingebauter elektrischer kondensator |
FR2326780A1 (fr) * | 1975-10-02 | 1977-04-29 | Licentia Gmbh | Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3469684A (en) * | 1967-01-26 | 1969-09-30 | Advalloy Inc | Lead frame package for semiconductor devices and method for making same |
US3469148A (en) * | 1967-11-08 | 1969-09-23 | Gen Motors Corp | Protectively covered hybrid microcircuits |
US3484536A (en) * | 1967-11-29 | 1969-12-16 | Sprague Electric Co | Encapsulated component |
US4105861A (en) * | 1975-09-29 | 1978-08-08 | Semi-Alloys, Inc. | Hermetically sealed container for semiconductor and other electronic devices |
JPS55112019A (en) * | 1979-02-22 | 1980-08-29 | Murata Mfg Co Ltd | Elastic surface wave device |
US4296347A (en) * | 1979-09-28 | 1981-10-20 | Texas Instruments Incorporated | Surface acoustic wave sensor |
-
1982
- 1982-05-10 GB GB8213485A patent/GB2100521B/en not_active Expired
- 1982-05-11 US US06/377,059 patent/US4480148A/en not_active Expired - Fee Related
- 1982-05-11 DE DE19823217687 patent/DE3217687A1/de not_active Withdrawn
- 1982-05-12 FR FR8208290A patent/FR2506112B1/fr not_active Expired
- 1982-05-12 NL NL8201957A patent/NL8201957A/nl not_active Application Discontinuation
- 1982-05-12 IT IT21216/82A patent/IT1152132B/it active
- 1982-05-13 JP JP57080839A patent/JPS5825246A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1457305A (fr) * | 1965-05-07 | 1966-01-24 | Siemens Ag | élément constructif électrique chemisé et procédé pour son chemisage |
DE1514514B1 (de) * | 1965-07-23 | 1971-05-06 | Siemens Ag | In ein rohrfoermiges gehaeuse eingebauter elektrischer kondensator |
FR2326780A1 (fr) * | 1975-10-02 | 1977-04-29 | Licentia Gmbh | Circuit integre, amplificateur en particulier, a substrat semi-conducteur enrobe dans un isolant avec des connexions planes ne reposant pas sur lui |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0482419A1 (fr) * | 1990-10-25 | 1992-04-29 | Siemens Aktiengesellschaft | Module de circuit à boîtier de sécurité |
Also Published As
Publication number | Publication date |
---|---|
IT8221216A0 (it) | 1982-05-12 |
FR2506112B1 (fr) | 1986-05-30 |
DE3217687A1 (de) | 1982-12-16 |
US4480148A (en) | 1984-10-30 |
JPS5825246A (ja) | 1983-02-15 |
NL8201957A (nl) | 1982-12-01 |
GB2100521B (en) | 1984-09-12 |
IT1152132B (it) | 1986-12-31 |
GB2100521A (en) | 1982-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |