FR2370403A1 - Nouvelle matiere pour former les enveloppes utilisees pour proteger certains composants electroniques - Google Patents

Nouvelle matiere pour former les enveloppes utilisees pour proteger certains composants electroniques

Info

Publication number
FR2370403A1
FR2370403A1 FR7733500A FR7733500A FR2370403A1 FR 2370403 A1 FR2370403 A1 FR 2370403A1 FR 7733500 A FR7733500 A FR 7733500A FR 7733500 A FR7733500 A FR 7733500A FR 2370403 A1 FR2370403 A1 FR 2370403A1
Authority
FR
France
Prior art keywords
electronic components
order
new material
electrostatic charges
protect certain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7733500A
Other languages
English (en)
Other versions
FR2370403B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of FR2370403A1 publication Critical patent/FR2370403A1/fr
Application granted granted Critical
Publication of FR2370403B1 publication Critical patent/FR2370403B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F1/00—Preventing the formation of electrostatic charges
    • H05F1/02—Preventing the formation of electrostatic charges by surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2323/00—Polyalkenes
    • B32B2323/04—Polyethylene
    • B32B2323/046—LDPE, i.e. low density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/06—PVC, i.e. polyvinylchloride
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2331/00—Polyvinylesters
    • B32B2331/04—Polymers of vinyl acetate, e.g. PVA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2369/00—Polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/918—Material abnormally transparent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Elimination Of Static Electricity (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Nouvelle matière pour former les enveloppes utilisées pour protéger certains composants électroniques des charges électrostatiques pendant le stockage et l'expédition. Cette matière comprend une feuille polymérique 23 ayant une grande résistivité tridimensionnelle afin d'isoler électriquement les composants, une matière antistatique disposée sur la surface intérieure 22 de l'enveloppe afin de dissiper et de restreindre les charges électrostatiques sur les composants, et une couche hautement conductrice 24 disposée sur la surface extérieure de la feuille polymérique afin d'écouler à la masse les charges électrostatiques venant au contact de cette dernière. La matière Il est suffisamment transparente pour permettre d'identifier à vue les composants électroniques contenus dans l'enveloppe.
FR7733500A 1976-11-09 1977-11-08 Nouvelle matiere pour former les enveloppes utilisees pour proteger certains composants electroniques Granted FR2370403A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/740,303 US4154344A (en) 1976-11-09 1976-11-09 Material for forming envelopes used to protect electronic components
KR7702879A KR820000357B1 (ko) 1976-11-09 1977-12-09 전자부품을 보호하기 위한 포대(envelope) 형성용 재료

Publications (2)

Publication Number Publication Date
FR2370403A1 true FR2370403A1 (fr) 1978-06-02
FR2370403B1 FR2370403B1 (fr) 1981-11-20

Family

ID=26626077

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7733500A Granted FR2370403A1 (fr) 1976-11-09 1977-11-08 Nouvelle matiere pour former les enveloppes utilisees pour proteger certains composants electroniques

Country Status (10)

Country Link
US (2) US4154344A (fr)
JP (1) JPS6018294B2 (fr)
KR (1) KR820000357B1 (fr)
DE (1) DE2750357A1 (fr)
FR (1) FR2370403A1 (fr)
GB (1) GB1592308A (fr)
HK (1) HK11185A (fr)
IT (1) IT1090643B (fr)
NL (1) NL7712228A (fr)
SG (1) SG64284G (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3221937A1 (de) * 1981-06-11 1983-05-11 Denki Kagaku Kogyo K.K., Tokyo Kunststoff-verbundfolie oder -platte mit elektrisch leitender oberflaeche
FR2531933A1 (fr) * 1982-08-18 1984-02-24 Cii Honeywell Bull Systeme d'ouverture pour pochette antistatique et application a l'ouverture de pochettes antistatiques contenant des composants de type mos
EP0130489A1 (fr) * 1983-06-30 1985-01-09 Siemens Aktiengesellschaft Récipient tubulaire pour l'incorporation de composants semi-conducteurs
EP0254580A2 (fr) * 1986-07-23 1988-01-27 Motorola, Inc. Procédé d'emballage, des composants semiconducteurs et article emballé
EP0347321A1 (fr) * 1988-06-17 1989-12-20 STMicroelectronics S.A. Carte à puce avec écran de protection
EP0350003A2 (fr) * 1988-07-06 1990-01-10 Kabushiki Kaisha Toshiba Elément d'emballage pour dispositif semi-conducteur et procédé de fabrication de l'élément d'emballage
EP0359328A1 (fr) * 1988-09-16 1990-03-21 Trt Telecommunications Radioelectriques Et Telephoniques Dispositif comportant un circuit électronique monté sur un support souple, protégé contre les décharges d'électricité statique, et carte souple le comprenant
EP0422928A1 (fr) * 1989-10-13 1991-04-17 E.I. Du Pont De Nemours And Company Couche protectrice d'empaquetage pour l'électronique

Families Citing this family (99)

* Cited by examiner, † Cited by third party
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US4241829A (en) * 1979-06-04 1980-12-30 Republic Packaging Company Means for containing electrostatic sensitive electronic components
JPS5675855A (en) * 1979-11-24 1981-06-23 Toppan Printing Co Ltd Conductive packing material with transparent section
US4823945A (en) * 1980-07-07 1989-04-25 The Crowell Corporation Protective cushioning
JPS5786960U (fr) * 1980-11-11 1982-05-28
US4528222A (en) * 1981-04-24 1985-07-09 Pervel Industries, Inc. Conductively printed flexible sheet material
US4657137A (en) * 1981-05-22 1987-04-14 North American Philips Corporation Multi-chip packaging system
US4407872A (en) * 1981-06-02 1983-10-04 Ricoh Co. Ltd. Sheet material and envelope for packaging electronic parts
JPS6045586B2 (ja) * 1981-06-02 1985-10-11 株式会社麗光 包装用フイルム
JPS5815399U (ja) * 1981-07-22 1983-01-31 株式会社東芝 電子部品の保持装置
JPS5820598U (ja) * 1981-07-31 1983-02-08 藤森工業株式会社 半導体デバイス用包装材
US4439810A (en) * 1981-09-10 1984-03-27 Marcon Electronics Co., Ltd. Electric capacitor with enclosure structure consisting of plastic laminated film
JPS58143329U (ja) * 1982-03-20 1983-09-27 株式会社山形グラビア 非帯電性封筒
JPS58187344A (ja) * 1982-04-27 1983-11-01 株式会社　麗光 包装用フイルム
JPS58187345A (ja) * 1982-04-27 1983-11-01 株式会社　麗光 包装用フイルム
JPS58212942A (ja) * 1982-05-06 1983-12-10 株式会社　麗光 包装用フイルム
JPS58193146A (ja) * 1982-05-06 1983-11-10 株式会社　麗光 電子部品包装用シ−ト
US4553190A (en) * 1982-08-26 1985-11-12 Minnesota Mining And Manufacturing Co. Transparent container for electrostatic sensitive electronic components
JPS5890060A (ja) * 1982-08-27 1983-05-28 株式会社麗光 電子部品包装用袋
JPS6046017B2 (ja) * 1982-08-27 1985-10-14 株式会社麗光 包装用袋
JPS58193272A (ja) * 1982-09-20 1983-11-10 株式会社　麗光 包装用袋
JPS58193273A (ja) * 1982-09-20 1983-11-10 株式会社　麗光 包装用袋
JPS58193275A (ja) * 1982-09-20 1983-11-10 株式会社　麗光 包装用袋
US4496406A (en) * 1982-09-30 1985-01-29 General Dynamics, Pomona Division Method of making a conductive resealable pouch
US4471872A (en) * 1982-09-30 1984-09-18 General Dynamics, Pomona Division Conductive resealable pouch
US4589954A (en) * 1982-11-17 1986-05-20 Charleswater Products, Inc. Fibrous sheet material for conductive high-pressure laminate
US4455350A (en) * 1982-11-17 1984-06-19 Charleswater Products, Inc. Conductive laminate sheet material and method of preparation
US4454199A (en) * 1982-11-17 1984-06-12 Charleswater Products, Inc. Conductive high-pressure laminate and method of preparation
JPS59115598U (ja) * 1983-01-25 1984-08-04 日立エーアイシー株式会社 静電気防止袋
US5223553A (en) * 1983-03-09 1993-06-29 Metallized Products, Inc. Antistatic resin composition
JPS59192842U (ja) * 1983-06-10 1984-12-21 共同印刷株式会社 Ｉｃカ−ド用ケ−ス
JPS6047277U (ja) * 1983-09-07 1985-04-03 株式会社　武田産業 集積回路部品用包装材料
US4529087A (en) * 1983-10-21 1985-07-16 Maine Poly, Inc. Printed antistatic plastic bag
US4662514A (en) * 1983-11-01 1987-05-05 Charleswater Products, Inc. Electrically conductive polymeric tubes for static sensitive electronic devices
US4557379A (en) * 1983-12-16 1985-12-10 Lane Container Company Circuit board package and method of manufacture
DE3433779A1 (de) * 1984-09-14 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart Schutzschicht fuer halbleiterschaltungen
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MX157711A (es) * 1984-10-10 1988-12-09 Grace W R & Co Mejoras a estacion de trabajo antiestatica electricamente conductora en recipientes de alto riesgo
US4875581A (en) * 1985-03-19 1989-10-24 Robert B. Ray Static dissipative elastomeric coating for electronic packaging components
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AU588397B2 (en) * 1985-10-09 1989-09-14 Minnesota Mining And Manufacturing Company Antistatic sheet material
US4906494A (en) * 1985-10-09 1990-03-06 The Dow Chemical Company Antistatic sheet material, package and method of making
US4658958A (en) * 1985-10-30 1987-04-21 Robert A. Neal Transparent article
US4699830A (en) * 1986-06-30 1987-10-13 Baxter Travenol Laboratories, Inc. Laminated sheet material for packaging electronic components
US4738882A (en) * 1986-09-08 1988-04-19 Bemis Company, Inc. Static shielding sheet materials and bags formed therefrom
US4806410A (en) * 1986-09-18 1989-02-21 Ranpak Corp. Processes for the production of antistatic or static dissipative paper, and the paper products thus produced, and apparatus utilized
KR960015106B1 (ko) * 1986-11-25 1996-10-28 가부시기가이샤 히다찌세이사꾸쇼 면실장형 반도체패키지 포장체
US5295297B1 (en) * 1986-11-25 1996-11-26 Hitachi Ltd Method of producing semiconductor memory
US6369159B1 (en) 1987-05-13 2002-04-09 Pdm Holdings Corp. Antistatic plastic materials containing epihalohydrin polymers
US5154886A (en) * 1987-10-08 1992-10-13 At&T Bell Laboratories Protection of devices
EP0311361B1 (fr) * 1987-10-08 1992-07-08 AT&T Corp. Inhibition de la corrosion
US4792042A (en) * 1987-11-24 1988-12-20 Minnesota Mining And Manufacturing Company Transparent box for protecting against damage from electrostatic discharge and sheet material to be cut into a box blank for forming same
US4773534A (en) * 1988-03-28 1988-09-27 Deheras Charles Printed circuit board transporter
DE8816793U1 (de) * 1988-04-19 1990-07-26 Maibach, Gerd D., 73092 Heiningen Behälter aus faserverstärktem Kunststoff mit stromleitender Innenschicht
US5613610A (en) * 1988-05-04 1997-03-25 Bradford Company Naturally degradable and recyclable static-dissipative packaging material
US5205406A (en) * 1988-05-04 1993-04-27 Bradford Company Anti-static coated paperboard or similar rigid material
US5017260A (en) * 1989-04-12 1991-05-21 Bradford Company Anti-static coated paperboard or similar rigid material
US4966280B1 (en) * 1988-05-04 1997-03-25 Bradford Co Multiple-ply anti-static paperboard
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DE3221937A1 (de) * 1981-06-11 1983-05-11 Denki Kagaku Kogyo K.K., Tokyo Kunststoff-verbundfolie oder -platte mit elektrisch leitender oberflaeche
FR2531933A1 (fr) * 1982-08-18 1984-02-24 Cii Honeywell Bull Systeme d'ouverture pour pochette antistatique et application a l'ouverture de pochettes antistatiques contenant des composants de type mos
EP0130489A1 (fr) * 1983-06-30 1985-01-09 Siemens Aktiengesellschaft Récipient tubulaire pour l'incorporation de composants semi-conducteurs
EP0254580A2 (fr) * 1986-07-23 1988-01-27 Motorola, Inc. Procédé d'emballage, des composants semiconducteurs et article emballé
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EP0347321A1 (fr) * 1988-06-17 1989-12-20 STMicroelectronics S.A. Carte à puce avec écran de protection
FR2633141A1 (fr) * 1988-06-17 1989-12-22 Sgs Thomson Microelectronics Carte a puce avec ecran de protection
EP0350003A2 (fr) * 1988-07-06 1990-01-10 Kabushiki Kaisha Toshiba Elément d'emballage pour dispositif semi-conducteur et procédé de fabrication de l'élément d'emballage
EP0350003B1 (fr) * 1988-07-06 1995-06-21 Kabushiki Kaisha Toshiba Elément d'emballage pour dispositif semi-conducteur et procédé de fabrication de l'élément d'emballage
EP0359328A1 (fr) * 1988-09-16 1990-03-21 Trt Telecommunications Radioelectriques Et Telephoniques Dispositif comportant un circuit électronique monté sur un support souple, protégé contre les décharges d'électricité statique, et carte souple le comprenant
FR2636776A1 (fr) * 1988-09-16 1990-03-23 Trt Telecom Radio Electr Dispositif comportant un circuit electronique monte sur un support souple, protege contre les decharges d'electricite statique, et carte souple le comprenant
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KR820000357B1 (ko) 1982-03-24
US4154344A (en) 1979-05-15
NL7712228A (nl) 1978-05-11
JPS6018294B2 (ja) 1985-05-09
DE2750357C2 (fr) 1988-08-04
JPS5388953A (en) 1978-08-04
IT1090643B (it) 1985-06-26
GB1592308A (en) 1981-07-01
FR2370403B1 (fr) 1981-11-20
SG64284G (en) 1985-03-15
US4156751A (en) 1979-05-29
DE2750357A1 (de) 1978-05-11
HK11185A (en) 1985-02-15

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