IT8221216A0 - Unita' integrata comprendente un dispositivo elettrico. - Google Patents

Unita' integrata comprendente un dispositivo elettrico.

Info

Publication number
IT8221216A0
IT8221216A0 IT8221216A IT2121682A IT8221216A0 IT 8221216 A0 IT8221216 A0 IT 8221216A0 IT 8221216 A IT8221216 A IT 8221216A IT 2121682 A IT2121682 A IT 2121682A IT 8221216 A0 IT8221216 A0 IT 8221216A0
Authority
IT
Italy
Prior art keywords
unit including
electrical device
integrated unit
integrated
electrical
Prior art date
Application number
IT8221216A
Other languages
English (en)
Other versions
IT1152132B (it
Inventor
Steven Kenneth Archer
Original Assignee
Plessey Overseas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Overseas filed Critical Plessey Overseas
Publication of IT8221216A0 publication Critical patent/IT8221216A0/it
Application granted granted Critical
Publication of IT1152132B publication Critical patent/IT1152132B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Packaging Frangible Articles (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
IT21216/82A 1981-05-13 1982-05-12 Unita' integrata comprendente un dispositivo elettrico IT1152132B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8114541 1981-05-13

Publications (2)

Publication Number Publication Date
IT8221216A0 true IT8221216A0 (it) 1982-05-12
IT1152132B IT1152132B (it) 1986-12-31

Family

ID=10521752

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21216/82A IT1152132B (it) 1981-05-13 1982-05-12 Unita' integrata comprendente un dispositivo elettrico

Country Status (7)

Country Link
US (1) US4480148A (it)
JP (1) JPS5825246A (it)
DE (1) DE3217687A1 (it)
FR (1) FR2506112B1 (it)
GB (1) GB2100521B (it)
IT (1) IT1152132B (it)
NL (1) NL8201957A (it)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0157938A3 (de) * 1984-03-23 1987-05-13 Siemens Aktiengesellschaft Gehäuse für elektrische Bauelemente
US4845397A (en) * 1984-12-19 1989-07-04 Tektronix, Inc. Constraining mount system for surface acoustic wave devices
US4716082A (en) * 1986-10-28 1987-12-29 Isotronics, Inc. Duplex glass preforms for hermetic glass-to-metal sealing
DE3703465C2 (de) * 1987-02-05 1998-02-19 Behr Thomson Dehnstoffregler Verfahren zum Herstellen eines elektrischen Schaltgerätes und elektrisches Schaltgerät
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US4870224A (en) * 1988-07-01 1989-09-26 Intel Corporation Integrated circuit package for surface mount technology
US4991291A (en) * 1989-12-29 1991-02-12 Isotronics, Inc. Method for fabricating a fold-up frame
DE4033999A1 (de) * 1990-10-25 1992-04-30 Siemens Ag Schaltungsmodul mit sicherheitsgehaeuse
US5123538A (en) * 1991-04-26 1992-06-23 Sundstrand Corporation Crash protection enclosure for solid state memory devices
JPH0590872A (ja) * 1991-09-27 1993-04-09 Sumitomo Electric Ind Ltd 表面弾性波素子
US5237235A (en) * 1991-09-30 1993-08-17 Motorola, Inc. Surface acoustic wave device package
US5620647A (en) * 1993-09-10 1997-04-15 Calhoun Pitch Company, Inc. Process for potting electrical circuits
FI952093A0 (fi) 1994-05-02 1995-05-02 Siemens Matsushita Components Kapsling foer med akustiska ytvaogefunktionerande byggelement
DE19524001A1 (de) * 1995-06-30 1997-03-06 Siemens Ag Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung
US5729185A (en) * 1996-04-29 1998-03-17 Motorola Inc. Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal
US6311621B1 (en) 1996-11-01 2001-11-06 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
US6079332A (en) * 1996-11-01 2000-06-27 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
JPH10215143A (ja) * 1997-01-31 1998-08-11 Nec Corp 弾性表面波装置
WO2001036320A2 (en) * 1999-11-15 2001-05-25 Amkor Technology, Inc. Micromachine package
US6415505B1 (en) 1999-11-15 2002-07-09 Amkor Technology, Inc. Micromachine package fabrication method
WO2006023895A2 (en) 2004-08-20 2006-03-02 Digital Site Management, Llc Storage medium protection system
US7198981B2 (en) * 2004-10-21 2007-04-03 Honeywell International Inc. Vacuum sealed surface acoustic wave pressure sensor
US7651879B2 (en) * 2005-12-07 2010-01-26 Honeywell International Inc. Surface acoustic wave pressure sensors
EP2093880A4 (en) * 2006-11-29 2013-04-17 Murata Manufacturing Co ELASTIC SURFACE WAVE RESONATOR AND ELASTIC SURFACE WAVE DEVICE
US8059425B2 (en) * 2008-05-28 2011-11-15 Azurewave Technologies, Inc. Integrated circuit module with temperature compensation crystal oscillator
KR101702837B1 (ko) * 2010-07-22 2017-02-07 삼성전자주식회사 필름형 전자회로를 구비하는 전자제품의 케이스 구조물 및 그 제조방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1457305A (fr) * 1965-05-07 1966-01-24 Siemens Ag élément constructif électrique chemisé et procédé pour son chemisage
DE1514514B1 (de) * 1965-07-23 1971-05-06 Siemens Ag In ein rohrfoermiges gehaeuse eingebauter elektrischer kondensator
US3469684A (en) * 1967-01-26 1969-09-30 Advalloy Inc Lead frame package for semiconductor devices and method for making same
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3484536A (en) * 1967-11-29 1969-12-16 Sprague Electric Co Encapsulated component
US4105861A (en) * 1975-09-29 1978-08-08 Semi-Alloys, Inc. Hermetically sealed container for semiconductor and other electronic devices
DE2543968A1 (de) * 1975-10-02 1977-04-07 Licentia Gmbh Integrierte schaltungsanordnung
JPS55112019A (en) * 1979-02-22 1980-08-29 Murata Mfg Co Ltd Elastic surface wave device
US4296347A (en) * 1979-09-28 1981-10-20 Texas Instruments Incorporated Surface acoustic wave sensor

Also Published As

Publication number Publication date
JPS5825246A (ja) 1983-02-15
NL8201957A (nl) 1982-12-01
GB2100521B (en) 1984-09-12
GB2100521A (en) 1982-12-22
DE3217687A1 (de) 1982-12-16
FR2506112A1 (fr) 1982-11-19
IT1152132B (it) 1986-12-31
US4480148A (en) 1984-10-30
FR2506112B1 (fr) 1986-05-30

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