JPS5252574A - Integrated circuit device - Google Patents
Integrated circuit deviceInfo
- Publication number
- JPS5252574A JPS5252574A JP51118423A JP11842376A JPS5252574A JP S5252574 A JPS5252574 A JP S5252574A JP 51118423 A JP51118423 A JP 51118423A JP 11842376 A JP11842376 A JP 11842376A JP S5252574 A JPS5252574 A JP S5252574A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752543968 DE2543968A1 (de) | 1975-10-02 | 1975-10-02 | Integrierte schaltungsanordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5252574A true JPS5252574A (en) | 1977-04-27 |
Family
ID=5958044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51118423A Pending JPS5252574A (en) | 1975-10-02 | 1976-10-01 | Integrated circuit device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5252574A (ja) |
DE (1) | DE2543968A1 (ja) |
FR (1) | FR2326780A1 (ja) |
GB (1) | GB1540598A (ja) |
IT (1) | IT1073327B (ja) |
NL (1) | NL7610920A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5989542U (ja) * | 1982-12-08 | 1984-06-18 | 日本電気株式会社 | モノリシツク集積回路容器 |
US5083340A (en) * | 1990-05-09 | 1992-01-28 | Kioritz Corporation | Nozzle pipe supporting handle |
US5149160A (en) * | 1990-05-07 | 1992-09-22 | Kioritz Corporation | Pipe structure |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55163850A (en) * | 1979-06-08 | 1980-12-20 | Fujitsu Ltd | Semiconductor device |
JPS55166943A (en) * | 1979-06-15 | 1980-12-26 | Fujitsu Ltd | Semiconductor device |
GB2100521B (en) * | 1981-05-13 | 1984-09-12 | Plessey Co Plc | Electrical device package |
FR2524707B1 (fr) * | 1982-04-01 | 1985-05-31 | Cit Alcatel | Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus |
EP0237725A1 (en) * | 1986-03-20 | 1987-09-23 | GTE Products Corporation | Plastic integrated circuit package having reduced moisture absorbtion |
KR960000706B1 (ko) * | 1993-07-12 | 1996-01-11 | 한국전기통신공사 | 전력소자용 플라스틱 패키지 구조 및 그 제조방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3489953A (en) * | 1964-09-18 | 1970-01-13 | Texas Instruments Inc | Stabilized integrated circuit and process for fabricating same |
US3518504A (en) * | 1966-11-15 | 1970-06-30 | Int Standard Electric Corp | Transistor with lead-in electrodes |
US3614546A (en) * | 1970-01-07 | 1971-10-19 | Rca Corp | Shielded semiconductor device |
-
1975
- 1975-10-02 DE DE19752543968 patent/DE2543968A1/de not_active Ceased
-
1976
- 1976-10-01 GB GB40964/76A patent/GB1540598A/en not_active Expired
- 1976-10-01 FR FR7629645A patent/FR2326780A1/fr active Granted
- 1976-10-01 IT IT27920/76A patent/IT1073327B/it active
- 1976-10-01 NL NL7610920A patent/NL7610920A/xx not_active Application Discontinuation
- 1976-10-01 JP JP51118423A patent/JPS5252574A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5989542U (ja) * | 1982-12-08 | 1984-06-18 | 日本電気株式会社 | モノリシツク集積回路容器 |
US5149160A (en) * | 1990-05-07 | 1992-09-22 | Kioritz Corporation | Pipe structure |
US5083340A (en) * | 1990-05-09 | 1992-01-28 | Kioritz Corporation | Nozzle pipe supporting handle |
Also Published As
Publication number | Publication date |
---|---|
GB1540598A (en) | 1979-02-14 |
FR2326780B1 (ja) | 1982-10-22 |
IT1073327B (it) | 1985-04-17 |
FR2326780A1 (fr) | 1977-04-29 |
DE2543968A1 (de) | 1977-04-07 |
NL7610920A (nl) | 1977-04-05 |
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