JPS55143040A - Tape carrier type semiconductor device - Google Patents

Tape carrier type semiconductor device

Info

Publication number
JPS55143040A
JPS55143040A JP5029679A JP5029679A JPS55143040A JP S55143040 A JPS55143040 A JP S55143040A JP 5029679 A JP5029679 A JP 5029679A JP 5029679 A JP5029679 A JP 5029679A JP S55143040 A JPS55143040 A JP S55143040A
Authority
JP
Japan
Prior art keywords
chip
alpha
leads
bump electrodes
tape carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5029679A
Other languages
Japanese (ja)
Inventor
Kanji Otsuka
Shinji Onishi
Hiroshi Kawamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5029679A priority Critical patent/JPS55143040A/en
Publication of JPS55143040A publication Critical patent/JPS55143040A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE:To stabilize operation, by coating an alpha-ray shielding resin layer on an active region which is provided in a semiconductor chip and which is likely to perform wrong action when alpha-rays are irradiated upon the region. CONSTITUTION:Bump electrodes 11 are attached to the surface of a semiconductor IC chip 10 near its edges. The chip 10 has an active region such as a memory cell on the surface. Cu leads 12 are connected to the bump electrodes 11 so that the leads project outward. An alpha-ray shielding layer 13 of polyimide resin, polyester resin or the like with a thickness of 25-60mum is fixed on the leads 12 opposite the bump electrodes 11 so that the memory cell region of the chip 10 exposed between the electrodes is covered with the resin layer. As a result, no pairs of electron and positive hole are produced due to the radiation of U or Th contained in a package and troubles such as the fall or inversion of the logical level of stored information do not occur even if a device is made of the tape carrier type.
JP5029679A 1979-04-25 1979-04-25 Tape carrier type semiconductor device Pending JPS55143040A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5029679A JPS55143040A (en) 1979-04-25 1979-04-25 Tape carrier type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5029679A JPS55143040A (en) 1979-04-25 1979-04-25 Tape carrier type semiconductor device

Publications (1)

Publication Number Publication Date
JPS55143040A true JPS55143040A (en) 1980-11-08

Family

ID=12854928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5029679A Pending JPS55143040A (en) 1979-04-25 1979-04-25 Tape carrier type semiconductor device

Country Status (1)

Country Link
JP (1) JPS55143040A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990009035A1 (en) * 1989-02-06 1990-08-09 Furukawa Denki Kogyo Kabushiki Kaisha Chip carrier
JPH0394436A (en) * 1989-09-06 1991-04-19 Toshiba Corp Manufacture of semiconductor device
JPH03268339A (en) * 1990-03-16 1991-11-29 Yokogawa Electric Corp Semiconductor sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365063A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5365063A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990009035A1 (en) * 1989-02-06 1990-08-09 Furukawa Denki Kogyo Kabushiki Kaisha Chip carrier
JPH0394436A (en) * 1989-09-06 1991-04-19 Toshiba Corp Manufacture of semiconductor device
JPH03268339A (en) * 1990-03-16 1991-11-29 Yokogawa Electric Corp Semiconductor sensor

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