JPH03268339A - Semiconductor sensor - Google Patents

Abstract

PURPOSE:To improve characteristics and obtain a wide available temperature range, by accommodating a semiconductor sensor chip in a package via a carrier tape. CONSTITUTION:The title device is constituted of the following; a semiconductor chip 4, a bump 5 formed at a connection part of the chip 4, a carrier tape 6 wherein a wiring pattern to which the semiconductor sensor is connected is formed, and a package 7 which has electrodes connecting the wiring pattern of the carrier tape 6 to the outside and includes the carrier tape 6. That is, since the semiconductor sensor chip 4 is accommodated in the package 7 via the carrier tape 6, stress is not applied on the semiconductor chip sensor 6. Besides, since no adhesive is used, the limitation of available temperature range caused by any adhesive is not present. Thereby characteristics are improved, and a semiconductor sensor having a wide available temperature range can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a semiconductor sensor, and more specifically, to improving the effects of stress applied to a semiconductor sensor chip.

<Prior Art> FIG. 4 is a configuration explanatory diagram showing an example of the main parts of a conventional semiconductor sensor. In FIG. It is bonded to a base 3 via an epoxy adhesive 2. These semiconductor sensor chip 11 and base 3 are housed and sealed in a camper gauge (not shown). Furthermore, the wiring portion of the semiconductor sensor chip 1 is wire-bonded to the lead pins of the Kampara gauge, but this is not shown.

<Problems to be Solved by the Invention> However, according to such a conventional configuration, stress is applied to the semiconductor sensor chip 1 by the adhesive used for die-bonding the semiconductor sensor chip 1.

As a result, even if a semiconductor sensor chip has excellent characteristics (e.g. linearity) obtained by 10-bing measurements on a semiconductor wafer, distortion occurs due to die bonding, resulting in deterioration of the characteristics or a decrease in the output signal level. It may change.

Furthermore, it is inevitable that there will be individual differences in the magnitude of distortion caused by Guibond, resulting in variations in characteristics.

Furthermore, since adhesive is used for die bonding,
The operating temperature range of semiconductor sensors is also limited by the characteristics of the adhesive.

The present invention has focused on these points, and its purpose is to provide a semiconductor sensor that improves characteristics by removing stress applied to a semiconductor sensor chip and that can be used over a wide temperature range. It is in.

<Means for Solving the Problems> The semiconductor sensor of the present invention includes: a semiconductor sensor chip; a bump formed at a connecting portion of the semiconductor sensor chip; and a wiring pattern to which the semiconductor sensor is connected via the bump. and a package containing the carrier tape and having an electrode for connecting the wiring pattern of the carrier tape to the outside.

<Function> The semiconductor sensor chip is housed in a package via a carrier tape.

As a result, no stress is applied to the semiconductor sensor chip, and excellent characteristics can be obtained.

Furthermore, since no adhesive is used, there are no restrictions on the range of use due to adhesives.

<Example> Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a configuration explanatory diagram showing one embodiment of the present invention, FIG. 2 is a flowchart showing the flow of the manufacturing process of FIG. 1, and FIG. 3 is a manufacturing process diagram of FIG. 2.

First, in FIG. 1, a bump 5 is formed at the connection portion of the semiconductor sensor chip 4. As shown in FIG. This bump 5 is connected to a wiring pattern (not shown) of the carrier cheese 6. The carrier cheese 6 is fitted into the stepped portion 8 of the package 7, and the wiring pattern is bonded and fixed to an electrode (not shown). The opening of the package 7 is closed and sealed with a cover 9.

The specific manufacturing process will be explained.

After inspecting each semiconductor sensor chip 4 on the completed wafer (step 2), bumps 5 are formed on each chip 4 (step 2). Then, the semiconductor sensor chip 4 is tiled (step ■). As a result, Figure 3 (
A semiconductor sensor chip 4 as shown in a) is obtained. on the other hand,
Carrier Chill Pro is also tested (Step ■
), After the inspection is completed, the bumps 5 of the semiconductor sensor chip 4 are connected to the wiring pattern of the carrier tape 6 as shown in FIG. 3(b). #Put the carrier tape 6 on which the semiconductor sensor chip 4 is attached in this way (step ■)
As shown in FIG. 3(C), fit it into the stepped #8 of the package 7, and bond and secure the wiring pattern of the carrier tape 6 and the electrode provided on the package 7 (Step 2).
), and the cover 9 is overlaid and sealed so as to close the opening of the package 7 as shown in FIG. 3(d) (step 2).

Through these steps, a semiconductor sensor as shown in FIG. 1 is formed.

In the semiconductor sensor configured in this way, since the semiconductor sensor chip 4 is attached to the package 7 via the carrier tape 6, no stress is applied to the semiconductor sensor chip 4 due to paragel shift, and the measurement results obtained by probing in the wafer state are It is possible to obtain characteristics similar to
Fluctuations in the output signal can also be prevented.

Furthermore, since there is no stress, it is possible to resolve variations in properties caused by stress.

Furthermore, since no adhesive is used as in the past, the usable temperature range, which was previously limited by the adhesive, can be expanded.

In the above embodiment, an example of a temperature sensor has been described, but it is also effective for, for example, an optical sensor.

<Effects of the Invention> As described above, according to the present invention, it is possible to realize a semiconductor sensor that improves characteristics by removing stress applied to a semiconductor sensor chip and that can be used over a wide temperature range.

[Brief explanation of drawings]

Fig. 1 is a configuration explanatory diagram showing one embodiment of the present invention, Fig. 2 is a flowchart showing the flow of the manufacturing process of Fig. 1, Fig. 3 is a manufacturing process diagram of Fig. 2, and Fig. 4 is a conventional apparatus. FIG.

Claims (1)

[Claims] A semiconductor sensor chip, a bump formed at the connecting portion of this semiconductor sensor chip, a carrier tape on which a wiring pattern is formed to connect the semiconductor sensor via this bump, and the wiring pattern of this carrier tape is connected to the outside. 1. A semiconductor sensor comprising: a package containing an electrode and a carrier tape;