JPS5563850A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5563850A
JPS5563850A JP13748578A JP13748578A JPS5563850A JP S5563850 A JPS5563850 A JP S5563850A JP 13748578 A JP13748578 A JP 13748578A JP 13748578 A JP13748578 A JP 13748578A JP S5563850 A JPS5563850 A JP S5563850A
Authority
JP
Japan
Prior art keywords
container
lid
bonded
semiconductor chip
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13748578A
Other languages
Japanese (ja)
Other versions
JPS6315745B2 (en
Inventor
Shigeru Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13748578A priority Critical patent/JPS5563850A/en
Publication of JPS5563850A publication Critical patent/JPS5563850A/en
Publication of JPS6315745B2 publication Critical patent/JPS6315745B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prevent alpha-particles from invading from a very small amount of a radioactive substance into a semiconductor chip in a container, by making a part of the lid of the container from a semiconductor.
CONSTITUTION: The reverse side of a semiconductor chip 1 is bonded on a container 2. A silicon crystal plate 4 of 100μ in thickness is bonded on the lid 3 of the container. The lid 3 and the container 2 are bonded on each other. No alpha-particles go into the semiconductor chip 1 from a very small quantity of a radioactive substance of the container 2 and from the lid 3 because the thickness of chip is 100μ or more and the semiconductor 4 is bonded on the lid. Alpha-particles are thus prevented from invading into the semiconductor chip 1.
COPYRIGHT: (C)1980,JPO&Japio
JP13748578A 1978-11-08 1978-11-08 Semiconductor device Granted JPS5563850A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13748578A JPS5563850A (en) 1978-11-08 1978-11-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13748578A JPS5563850A (en) 1978-11-08 1978-11-08 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5563850A true JPS5563850A (en) 1980-05-14
JPS6315745B2 JPS6315745B2 (en) 1988-04-06

Family

ID=15199729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13748578A Granted JPS5563850A (en) 1978-11-08 1978-11-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5563850A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55123149A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Semiconductor device
JPS5895053U (en) * 1981-12-18 1983-06-28 株式会社リコー Semiconductor integrated circuit package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02123841U (en) * 1989-03-24 1990-10-11
JPH0837904A (en) * 1995-08-09 1996-02-13 Kubota Corp Shaking type sorter in threshing machine

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55123149A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Semiconductor device
JPS5895053U (en) * 1981-12-18 1983-06-28 株式会社リコー Semiconductor integrated circuit package

Also Published As

Publication number Publication date
JPS6315745B2 (en) 1988-04-06

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