JPS5626448A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5626448A
JPS5626448A JP10223579A JP10223579A JPS5626448A JP S5626448 A JPS5626448 A JP S5626448A JP 10223579 A JP10223579 A JP 10223579A JP 10223579 A JP10223579 A JP 10223579A JP S5626448 A JPS5626448 A JP S5626448A
Authority
JP
Japan
Prior art keywords
rays
alpha
tape
active region
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10223579A
Other languages
Japanese (ja)
Inventor
Kazuyuki Miyazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP10223579A priority Critical patent/JPS5626448A/en
Publication of JPS5626448A publication Critical patent/JPS5626448A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To effectively permit the shield of alpha-rays by stacking a polyimide resin or a polyimide group resin on the active region of a circuit element. CONSTITUTION:A circuit element 13 is fixed through junction pads 12 at the inside ends of copper leads 11 provided at one face of a polyimide resin tape 10. The outer ends 17 of the leads 11 project from the outer edge of the tape. A part 14 of the tape 10 interposes on the active region of the element 13 to prevent alpha-rays from coming from the exterior. A tape material, itself, practically contains no substance irradiating the alpha-rays. Therefore, alpha-rays will not come into the active region and no softwave erros will occur. In this composition, a tape assembly method will be applied and the active region of the element will effectively be shielded against the alpha-rays as well.
JP10223579A 1979-08-13 1979-08-13 Semiconductor device Pending JPS5626448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10223579A JPS5626448A (en) 1979-08-13 1979-08-13 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10223579A JPS5626448A (en) 1979-08-13 1979-08-13 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5626448A true JPS5626448A (en) 1981-03-14

Family

ID=14321969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10223579A Pending JPS5626448A (en) 1979-08-13 1979-08-13 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5626448A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817630A (en) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Tape automatic bonding for collected circuit
JPS58207657A (en) * 1982-05-28 1983-12-03 Fujitsu Ltd Manufacture of semiconductor device
JPH02129940A (en) * 1988-11-09 1990-05-18 Ibiden Co Ltd Electronic component mounting film carrier and its manufacture
JPH0311646A (en) * 1989-06-08 1991-01-18 Shinko Electric Ind Co Ltd Film carrier for tab use
JPH0355857A (en) * 1989-07-25 1991-03-11 Fujitsu Ltd Semiconductor device and its manufacture
JPH09172039A (en) * 1995-12-18 1997-06-30 Nec Corp Semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817630A (en) * 1981-07-13 1983-02-01 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Tape automatic bonding for collected circuit
JPS58207657A (en) * 1982-05-28 1983-12-03 Fujitsu Ltd Manufacture of semiconductor device
JPS6249741B2 (en) * 1982-05-28 1987-10-21 Fujitsu Ltd
JPH02129940A (en) * 1988-11-09 1990-05-18 Ibiden Co Ltd Electronic component mounting film carrier and its manufacture
JPH0311646A (en) * 1989-06-08 1991-01-18 Shinko Electric Ind Co Ltd Film carrier for tab use
JPH0355857A (en) * 1989-07-25 1991-03-11 Fujitsu Ltd Semiconductor device and its manufacture
JPH09172039A (en) * 1995-12-18 1997-06-30 Nec Corp Semiconductor device

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