JPS55134940A - Resin sealing method for ic - Google Patents
Resin sealing method for icInfo
- Publication number
- JPS55134940A JPS55134940A JP4182179A JP4182179A JPS55134940A JP S55134940 A JPS55134940 A JP S55134940A JP 4182179 A JP4182179 A JP 4182179A JP 4182179 A JP4182179 A JP 4182179A JP S55134940 A JPS55134940 A JP S55134940A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- mold
- circuit substrate
- suction hole
- constructed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
- B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
- B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4182179A JPS55134940A (en) | 1979-04-06 | 1979-04-06 | Resin sealing method for ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4182179A JPS55134940A (en) | 1979-04-06 | 1979-04-06 | Resin sealing method for ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55134940A true JPS55134940A (en) | 1980-10-21 |
Family
ID=12618950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4182179A Pending JPS55134940A (en) | 1979-04-06 | 1979-04-06 | Resin sealing method for ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55134940A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62241344A (ja) * | 1986-04-14 | 1987-10-22 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置の製造方法及び成型金型 |
JPS63250846A (ja) * | 1987-04-08 | 1988-10-18 | Hitachi Ltd | 面付実装用lsiプラスチツクパツケ−ジとその製造方法 |
JPS6455833A (en) * | 1987-08-26 | 1989-03-02 | Mitsui High Tec | Method and apparatus for packaging semiconductor device |
US4881885A (en) * | 1988-04-15 | 1989-11-21 | International Business Machines Corporation | Dam for lead encapsulation |
JPH0421962U (ja) * | 1990-06-18 | 1992-02-24 | ||
JPH05206321A (ja) * | 1991-10-18 | 1993-08-13 | Samsung Electron Co Ltd | 半導体パッケージ |
US5474958A (en) * | 1993-05-04 | 1995-12-12 | Motorola, Inc. | Method for making semiconductor device having no die supporting surface |
JP2019080023A (ja) * | 2017-10-27 | 2019-05-23 | 日亜化学工業株式会社 | 発光装置の製造方法 |
-
1979
- 1979-04-06 JP JP4182179A patent/JPS55134940A/ja active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62241344A (ja) * | 1986-04-14 | 1987-10-22 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置の製造方法及び成型金型 |
JPS63250846A (ja) * | 1987-04-08 | 1988-10-18 | Hitachi Ltd | 面付実装用lsiプラスチツクパツケ−ジとその製造方法 |
JPS6455833A (en) * | 1987-08-26 | 1989-03-02 | Mitsui High Tec | Method and apparatus for packaging semiconductor device |
US4881885A (en) * | 1988-04-15 | 1989-11-21 | International Business Machines Corporation | Dam for lead encapsulation |
JPH0421962U (ja) * | 1990-06-18 | 1992-02-24 | ||
JPH05206321A (ja) * | 1991-10-18 | 1993-08-13 | Samsung Electron Co Ltd | 半導体パッケージ |
US5474958A (en) * | 1993-05-04 | 1995-12-12 | Motorola, Inc. | Method for making semiconductor device having no die supporting surface |
JP2019080023A (ja) * | 2017-10-27 | 2019-05-23 | 日亜化学工業株式会社 | 発光装置の製造方法 |
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