JPS55123166A - Planar thyristor - Google Patents

Planar thyristor

Info

Publication number
JPS55123166A
JPS55123166A JP3146079A JP3146079A JPS55123166A JP S55123166 A JPS55123166 A JP S55123166A JP 3146079 A JP3146079 A JP 3146079A JP 3146079 A JP3146079 A JP 3146079A JP S55123166 A JPS55123166 A JP S55123166A
Authority
JP
Japan
Prior art keywords
layer
type
exposed
diffusion
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3146079A
Other languages
Japanese (ja)
Inventor
Hiroshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3146079A priority Critical patent/JPS55123166A/en
Publication of JPS55123166A publication Critical patent/JPS55123166A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1012Base regions of thyristors
    • H01L29/102Cathode base regions of thyristors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE:To avoid the occurrence of erroneous operation by providing a shallow p<+>-type layer on the exposed parts of the junction of a p-type gate layer and an n<+>-type cathode layer in a planar thyristor in which the ends of all junctions are exposed to the surface. CONSTITUTION:In a p-type semiconductor substrate 1, which is to become an anode layer, an n-type base layer 2 is formed by diffusion. A p-type gate layer 3 is formed inside this, and further an n<+>-type cathode layer 4 is formed by diffusion in layer 3, and thereby a planar thyristor, with all junctions exposed to the surface, is constructed. In this structure, a shallow p<+>-type region 9 is formed by diffusion on the two exposed end surfaces of the pn-junction formed by layers 3 and 4. Then, the entire surface is covered with an SiO2 film 5, and by opening windows, a cathode 6 and a gate electrode 7 are fitted respectively on layers 4 and 3. On the back of substrate 1 is fitted anode 8. By this, it is possible to set the excessively sensitive gate current sensitivity at a proper value, so that no erroneous operation occures.
JP3146079A 1979-03-16 1979-03-16 Planar thyristor Pending JPS55123166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3146079A JPS55123166A (en) 1979-03-16 1979-03-16 Planar thyristor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3146079A JPS55123166A (en) 1979-03-16 1979-03-16 Planar thyristor

Publications (1)

Publication Number Publication Date
JPS55123166A true JPS55123166A (en) 1980-09-22

Family

ID=12331864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3146079A Pending JPS55123166A (en) 1979-03-16 1979-03-16 Planar thyristor

Country Status (1)

Country Link
JP (1) JPS55123166A (en)

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