JPS55118661A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS55118661A JPS55118661A JP2528879A JP2528879A JPS55118661A JP S55118661 A JPS55118661 A JP S55118661A JP 2528879 A JP2528879 A JP 2528879A JP 2528879 A JP2528879 A JP 2528879A JP S55118661 A JPS55118661 A JP S55118661A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- mold
- resin
- lead
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000011347 resin Substances 0.000 abstract 5
- 229920005989 resin Polymers 0.000 abstract 5
- 238000007789 sealing Methods 0.000 abstract 3
- 230000004048 modification Effects 0.000 abstract 2
- 238000012986 modification Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C7/00—Parts, details, or accessories of chairs or stools
- A47C7/62—Accessories for chairs
- A47C7/68—Arm-rest tables ; or back-rest tables
- A47C7/70—Arm-rest tables ; or back-rest tables of foldable type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2528879A JPS55118661A (en) | 1979-03-05 | 1979-03-05 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2528879A JPS55118661A (en) | 1979-03-05 | 1979-03-05 | Lead frame for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55118661A true JPS55118661A (en) | 1980-09-11 |
Family
ID=12161822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2528879A Pending JPS55118661A (en) | 1979-03-05 | 1979-03-05 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55118661A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761851U (ja) * | 1980-09-30 | 1982-04-13 | ||
JPH05335442A (ja) * | 1992-05-27 | 1993-12-17 | Sharp Corp | 半導体装置の樹脂モールド方法 |
-
1979
- 1979-03-05 JP JP2528879A patent/JPS55118661A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5761851U (ja) * | 1980-09-30 | 1982-04-13 | ||
JPH05335442A (ja) * | 1992-05-27 | 1993-12-17 | Sharp Corp | 半導体装置の樹脂モールド方法 |
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