JPS55111144A - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor deviceInfo
- Publication number
- JPS55111144A JPS55111144A JP1882179A JP1882179A JPS55111144A JP S55111144 A JPS55111144 A JP S55111144A JP 1882179 A JP1882179 A JP 1882179A JP 1882179 A JP1882179 A JP 1882179A JP S55111144 A JPS55111144 A JP S55111144A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- film
- region
- pattern
- nitride film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000004075 alteration Effects 0.000 abstract 2
- 230000010354 integration Effects 0.000 abstract 2
- 238000002955 isolation Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 150000004767 nitrides Chemical class 0.000 abstract 2
- 238000007254 oxidation reaction Methods 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Local Oxidation Of Silicon (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1882179A JPS55111144A (en) | 1979-02-20 | 1979-02-20 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1882179A JPS55111144A (en) | 1979-02-20 | 1979-02-20 | Manufacturing method of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55111144A true JPS55111144A (en) | 1980-08-27 |
| JPS628939B2 JPS628939B2 (en, 2012) | 1987-02-25 |
Family
ID=11982220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1882179A Granted JPS55111144A (en) | 1979-02-20 | 1979-02-20 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55111144A (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877241A (ja) * | 1981-11-02 | 1983-05-10 | Nec Corp | 半導体集積回路装置 |
| JPS60111466A (ja) * | 1983-11-22 | 1985-06-17 | Shindengen Electric Mfg Co Ltd | 半導体装置の製造方法 |
| JPH05159180A (ja) * | 1991-12-09 | 1993-06-25 | Hitachi Electron Service Co Ltd | 分電盤内の配線保護方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524433A (en) * | 1975-06-30 | 1977-01-13 | Matsushita Electric Works Ltd | Composite plating method |
-
1979
- 1979-02-20 JP JP1882179A patent/JPS55111144A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS524433A (en) * | 1975-06-30 | 1977-01-13 | Matsushita Electric Works Ltd | Composite plating method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5877241A (ja) * | 1981-11-02 | 1983-05-10 | Nec Corp | 半導体集積回路装置 |
| JPS60111466A (ja) * | 1983-11-22 | 1985-06-17 | Shindengen Electric Mfg Co Ltd | 半導体装置の製造方法 |
| JPH05159180A (ja) * | 1991-12-09 | 1993-06-25 | Hitachi Electron Service Co Ltd | 分電盤内の配線保護方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS628939B2 (en, 2012) | 1987-02-25 |
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