JPS524433A - Composite plating method - Google Patents
Composite plating methodInfo
- Publication number
- JPS524433A JPS524433A JP8110175A JP8110175A JPS524433A JP S524433 A JPS524433 A JP S524433A JP 8110175 A JP8110175 A JP 8110175A JP 8110175 A JP8110175 A JP 8110175A JP S524433 A JPS524433 A JP S524433A
- Authority
- JP
- Japan
- Prior art keywords
- plating method
- composite plating
- composite
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Contacts (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50081101A JPS583039B2 (en) | 1975-06-30 | 1975-06-30 | Fukugoumetsukihou |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50081101A JPS583039B2 (en) | 1975-06-30 | 1975-06-30 | Fukugoumetsukihou |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS524433A true JPS524433A (en) | 1977-01-13 |
JPS583039B2 JPS583039B2 (en) | 1983-01-19 |
Family
ID=13736984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50081101A Expired JPS583039B2 (en) | 1975-06-30 | 1975-06-30 | Fukugoumetsukihou |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS583039B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55111144A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Manufacturing method of semiconductor device |
JPS56158445A (en) * | 1980-05-13 | 1981-12-07 | Nec Corp | Semiconductor device |
JPS5743439A (en) * | 1981-07-06 | 1982-03-11 | Hitachi Ltd | Selective oxidation isolation type semiconductor device |
JPS57188700A (en) * | 1981-05-14 | 1982-11-19 | Omron Tateisi Electronics Co | Production of electrical contact |
CN102443829A (en) * | 2011-12-08 | 2012-05-09 | 天津大学 | Surface plating of Ag-Ni electric contact and preparation process thereof |
JP2013531729A (en) * | 2010-03-12 | 2013-08-08 | エクスタリック コーポレイション | Coatings and methods |
CN104264197A (en) * | 2014-10-22 | 2015-01-07 | 华文蔚 | Neodymium-nickel-tungsten alloy electroplating solution and preparation method thereof |
TWI656290B (en) * | 2014-06-13 | 2019-04-11 | 日商華爾卡股份有限公司 | Woven article and gland packing |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6148927A (en) * | 1984-08-16 | 1986-03-10 | Matsushita Electronics Corp | Semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49127828A (en) * | 1973-04-12 | 1974-12-06 | ||
JPS49127827A (en) * | 1973-04-13 | 1974-12-06 |
-
1975
- 1975-06-30 JP JP50081101A patent/JPS583039B2/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49127828A (en) * | 1973-04-12 | 1974-12-06 | ||
JPS49127827A (en) * | 1973-04-13 | 1974-12-06 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55111144A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Manufacturing method of semiconductor device |
JPS628939B2 (en) * | 1979-02-20 | 1987-02-25 | Nippon Electric Co | |
JPS56158445A (en) * | 1980-05-13 | 1981-12-07 | Nec Corp | Semiconductor device |
JPS57188700A (en) * | 1981-05-14 | 1982-11-19 | Omron Tateisi Electronics Co | Production of electrical contact |
JPS5743439A (en) * | 1981-07-06 | 1982-03-11 | Hitachi Ltd | Selective oxidation isolation type semiconductor device |
JP2013531729A (en) * | 2010-03-12 | 2013-08-08 | エクスタリック コーポレイション | Coatings and methods |
CN102443829A (en) * | 2011-12-08 | 2012-05-09 | 天津大学 | Surface plating of Ag-Ni electric contact and preparation process thereof |
CN102443829B (en) * | 2011-12-08 | 2014-07-16 | 天津大学 | Surface plating of Ag-Ni electric contact and preparation process thereof |
TWI656290B (en) * | 2014-06-13 | 2019-04-11 | 日商華爾卡股份有限公司 | Woven article and gland packing |
CN104264197A (en) * | 2014-10-22 | 2015-01-07 | 华文蔚 | Neodymium-nickel-tungsten alloy electroplating solution and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPS583039B2 (en) | 1983-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5254626A (en) | Electroplating method | |
JPS51137629A (en) | Highhspeed continuous plating method | |
JPS5237579A (en) | Selffactivated organocray rheololgy composite | |
JPS52109439A (en) | Composite plating method | |
JPS51135835A (en) | Metallizing method | |
JPS524433A (en) | Composite plating method | |
JPS5248526A (en) | Improved electroplating method | |
JPS5241132A (en) | Molten plating method | |
JPS5250937A (en) | Plating method | |
JPS524437A (en) | Composite plating method | |
JPS5270945A (en) | Plating method | |
JPS51131426A (en) | Plating method | |
JPS51112435A (en) | Continuous partially plating method | |
JPS5224132A (en) | Rigid alloy plating method | |
JPS5221475A (en) | Composite | |
JPS5263125A (en) | Ion plating method | |
JPS5232072A (en) | Laminating method | |
JPS5224129A (en) | Nonnelectrolytic gold plating method | |
JPS524434A (en) | Composite plating method | |
JPS5272334A (en) | Plating method | |
JPS52138026A (en) | Polygenetic plating method | |
JPS5288549A (en) | Composite plating method | |
JPS5268034A (en) | Electroplating method | |
JPS5256023A (en) | Composite plating method | |
JPS5257037A (en) | Composite plating method |