JPS524433A - Composite plating method - Google Patents

Composite plating method

Info

Publication number
JPS524433A
JPS524433A JP8110175A JP8110175A JPS524433A JP S524433 A JPS524433 A JP S524433A JP 8110175 A JP8110175 A JP 8110175A JP 8110175 A JP8110175 A JP 8110175A JP S524433 A JPS524433 A JP S524433A
Authority
JP
Japan
Prior art keywords
plating method
composite plating
composite
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8110175A
Other languages
Japanese (ja)
Other versions
JPS583039B2 (en
Inventor
Shiyunichi Nakayama
Hideaki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP50081101A priority Critical patent/JPS583039B2/en
Publication of JPS524433A publication Critical patent/JPS524433A/en
Publication of JPS583039B2 publication Critical patent/JPS583039B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)
JP50081101A 1975-06-30 1975-06-30 Fukugoumetsukihou Expired JPS583039B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50081101A JPS583039B2 (en) 1975-06-30 1975-06-30 Fukugoumetsukihou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50081101A JPS583039B2 (en) 1975-06-30 1975-06-30 Fukugoumetsukihou

Publications (2)

Publication Number Publication Date
JPS524433A true JPS524433A (en) 1977-01-13
JPS583039B2 JPS583039B2 (en) 1983-01-19

Family

ID=13736984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50081101A Expired JPS583039B2 (en) 1975-06-30 1975-06-30 Fukugoumetsukihou

Country Status (1)

Country Link
JP (1) JPS583039B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111144A (en) * 1979-02-20 1980-08-27 Nec Corp Manufacturing method of semiconductor device
JPS56158445A (en) * 1980-05-13 1981-12-07 Nec Corp Semiconductor device
JPS5743439A (en) * 1981-07-06 1982-03-11 Hitachi Ltd Selective oxidation isolation type semiconductor device
JPS57188700A (en) * 1981-05-14 1982-11-19 Omron Tateisi Electronics Co Production of electrical contact
CN102443829A (en) * 2011-12-08 2012-05-09 天津大学 Surface plating of Ag-Ni electric contact and preparation process thereof
JP2013531729A (en) * 2010-03-12 2013-08-08 エクスタリック コーポレイション Coatings and methods
CN104264197A (en) * 2014-10-22 2015-01-07 华文蔚 Neodymium-nickel-tungsten alloy electroplating solution and preparation method thereof
TWI656290B (en) * 2014-06-13 2019-04-11 日商華爾卡股份有限公司 Woven article and gland packing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6148927A (en) * 1984-08-16 1986-03-10 Matsushita Electronics Corp Semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49127828A (en) * 1973-04-12 1974-12-06
JPS49127827A (en) * 1973-04-13 1974-12-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49127828A (en) * 1973-04-12 1974-12-06
JPS49127827A (en) * 1973-04-13 1974-12-06

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55111144A (en) * 1979-02-20 1980-08-27 Nec Corp Manufacturing method of semiconductor device
JPS628939B2 (en) * 1979-02-20 1987-02-25 Nippon Electric Co
JPS56158445A (en) * 1980-05-13 1981-12-07 Nec Corp Semiconductor device
JPS57188700A (en) * 1981-05-14 1982-11-19 Omron Tateisi Electronics Co Production of electrical contact
JPS5743439A (en) * 1981-07-06 1982-03-11 Hitachi Ltd Selective oxidation isolation type semiconductor device
JP2013531729A (en) * 2010-03-12 2013-08-08 エクスタリック コーポレイション Coatings and methods
CN102443829A (en) * 2011-12-08 2012-05-09 天津大学 Surface plating of Ag-Ni electric contact and preparation process thereof
CN102443829B (en) * 2011-12-08 2014-07-16 天津大学 Surface plating of Ag-Ni electric contact and preparation process thereof
TWI656290B (en) * 2014-06-13 2019-04-11 日商華爾卡股份有限公司 Woven article and gland packing
CN104264197A (en) * 2014-10-22 2015-01-07 华文蔚 Neodymium-nickel-tungsten alloy electroplating solution and preparation method thereof

Also Published As

Publication number Publication date
JPS583039B2 (en) 1983-01-19

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