JPS55105326A - Manufacturing method of electrode of semiconductor device - Google Patents
Manufacturing method of electrode of semiconductor deviceInfo
- Publication number
- JPS55105326A JPS55105326A JP1371179A JP1371179A JPS55105326A JP S55105326 A JPS55105326 A JP S55105326A JP 1371179 A JP1371179 A JP 1371179A JP 1371179 A JP1371179 A JP 1371179A JP S55105326 A JPS55105326 A JP S55105326A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- films
- electrode
- exposition
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
- Electron Beam Exposure (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1371179A JPS55105326A (en) | 1979-02-07 | 1979-02-07 | Manufacturing method of electrode of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1371179A JPS55105326A (en) | 1979-02-07 | 1979-02-07 | Manufacturing method of electrode of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55105326A true JPS55105326A (en) | 1980-08-12 |
| JPS6216534B2 JPS6216534B2 (enrdf_load_stackoverflow) | 1987-04-13 |
Family
ID=11840809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1371179A Granted JPS55105326A (en) | 1979-02-07 | 1979-02-07 | Manufacturing method of electrode of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55105326A (enrdf_load_stackoverflow) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5646536A (en) * | 1979-09-22 | 1981-04-27 | Nippon Telegr & Teleph Corp <Ntt> | Formation of microminiature electrode |
| JPS5814577A (ja) * | 1981-07-17 | 1983-01-27 | Fujitsu Ltd | 電界効果型半導体装置の製造方法 |
| JPS58153375A (ja) * | 1982-03-08 | 1983-09-12 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
| JPS58199567A (ja) * | 1982-05-17 | 1983-11-19 | Toshiba Corp | シヨツトキ障壁型電界効果トランジスタ及びその製造方法 |
| JPS60145673A (ja) * | 1984-01-09 | 1985-08-01 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS6177370A (ja) * | 1984-09-21 | 1986-04-19 | Fujitsu Ltd | パタ−ン形成方法 |
| JPS61104675A (ja) * | 1984-10-29 | 1986-05-22 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS61125176A (ja) * | 1984-11-22 | 1986-06-12 | Nec Corp | 半導体装置の製造方法 |
| JPH01133375A (ja) * | 1987-09-23 | 1989-05-25 | Siemens Ag | 自己整合ゲートを備えるmesfetの製造方法 |
| JPH02208932A (ja) * | 1989-02-08 | 1990-08-20 | Mitsubishi Electric Corp | パターン形成方法 |
| JPH0319244A (ja) * | 1989-06-15 | 1991-01-28 | Matsushita Electron Corp | 半導体装置の製造方法 |
| JPH03185739A (ja) * | 1989-12-01 | 1991-08-13 | Hughes Aircraft Co | 自己整列tゲートhemt |
| JPH05211171A (ja) * | 1990-03-12 | 1993-08-20 | Electron & Telecommun Res Inst | ガリウム砒素半導体素子の製造方法 |
| JPH07335671A (ja) * | 1994-06-13 | 1995-12-22 | Nec Corp | T型ゲート電極の作製方法 |
| JPH08186128A (ja) * | 1994-12-19 | 1996-07-16 | Korea Electron Telecommun | 電界効果トランジスタのゲート形成方法 |
| JP2007525029A (ja) * | 2004-02-23 | 2007-08-30 | エーエスエムエル ネザーランズ ビー.ブイ. | デバイス製造方法および基板 |
-
1979
- 1979-02-07 JP JP1371179A patent/JPS55105326A/ja active Granted
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5646536A (en) * | 1979-09-22 | 1981-04-27 | Nippon Telegr & Teleph Corp <Ntt> | Formation of microminiature electrode |
| JPS5814577A (ja) * | 1981-07-17 | 1983-01-27 | Fujitsu Ltd | 電界効果型半導体装置の製造方法 |
| JPS58153375A (ja) * | 1982-03-08 | 1983-09-12 | Oki Electric Ind Co Ltd | 半導体素子の製造方法 |
| JPS58199567A (ja) * | 1982-05-17 | 1983-11-19 | Toshiba Corp | シヨツトキ障壁型電界効果トランジスタ及びその製造方法 |
| JPS60145673A (ja) * | 1984-01-09 | 1985-08-01 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS6177370A (ja) * | 1984-09-21 | 1986-04-19 | Fujitsu Ltd | パタ−ン形成方法 |
| JPS61104675A (ja) * | 1984-10-29 | 1986-05-22 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS61125176A (ja) * | 1984-11-22 | 1986-06-12 | Nec Corp | 半導体装置の製造方法 |
| JPH01133375A (ja) * | 1987-09-23 | 1989-05-25 | Siemens Ag | 自己整合ゲートを備えるmesfetの製造方法 |
| JPH02208932A (ja) * | 1989-02-08 | 1990-08-20 | Mitsubishi Electric Corp | パターン形成方法 |
| JPH0319244A (ja) * | 1989-06-15 | 1991-01-28 | Matsushita Electron Corp | 半導体装置の製造方法 |
| JPH03185739A (ja) * | 1989-12-01 | 1991-08-13 | Hughes Aircraft Co | 自己整列tゲートhemt |
| JPH05211171A (ja) * | 1990-03-12 | 1993-08-20 | Electron & Telecommun Res Inst | ガリウム砒素半導体素子の製造方法 |
| JPH07335671A (ja) * | 1994-06-13 | 1995-12-22 | Nec Corp | T型ゲート電極の作製方法 |
| JPH08186128A (ja) * | 1994-12-19 | 1996-07-16 | Korea Electron Telecommun | 電界効果トランジスタのゲート形成方法 |
| JP2007525029A (ja) * | 2004-02-23 | 2007-08-30 | エーエスエムエル ネザーランズ ビー.ブイ. | デバイス製造方法および基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6216534B2 (enrdf_load_stackoverflow) | 1987-04-13 |
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