JPS5486275A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPS5486275A JPS5486275A JP15482177A JP15482177A JPS5486275A JP S5486275 A JPS5486275 A JP S5486275A JP 15482177 A JP15482177 A JP 15482177A JP 15482177 A JP15482177 A JP 15482177A JP S5486275 A JPS5486275 A JP S5486275A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- lead
- solvent
- approximate
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15482177A JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15482177A JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5486275A true JPS5486275A (en) | 1979-07-09 |
JPS6112385B2 JPS6112385B2 (de) | 1986-04-08 |
Family
ID=15592600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15482177A Granted JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5486275A (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61267355A (ja) * | 1985-05-21 | 1986-11-26 | Fuji Plant Kogyo Kk | 半導体パツケ−ジ組立工程での外装処理方法 |
JPS63142841A (ja) * | 1986-12-05 | 1988-06-15 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装処理方法 |
JPS63148669A (ja) * | 1986-12-12 | 1988-06-21 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装方法 |
-
1977
- 1977-12-21 JP JP15482177A patent/JPS5486275A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61267355A (ja) * | 1985-05-21 | 1986-11-26 | Fuji Plant Kogyo Kk | 半導体パツケ−ジ組立工程での外装処理方法 |
JPS63142841A (ja) * | 1986-12-05 | 1988-06-15 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装処理方法 |
JPH0312780B2 (de) * | 1986-12-05 | 1991-02-21 | Fuji Plant Kogyo Kk | |
JPS63148669A (ja) * | 1986-12-12 | 1988-06-21 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6112385B2 (de) | 1986-04-08 |
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