JPS5480684A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS5480684A JPS5480684A JP14833477A JP14833477A JPS5480684A JP S5480684 A JPS5480684 A JP S5480684A JP 14833477 A JP14833477 A JP 14833477A JP 14833477 A JP14833477 A JP 14833477A JP S5480684 A JPS5480684 A JP S5480684A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- insulation film
- substrate
- major plane
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 238000009413 insulation Methods 0.000 abstract 5
- 239000000758 substrate Substances 0.000 abstract 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000001259 photo etching Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Landscapes
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14833477A JPS5480684A (en) | 1977-12-09 | 1977-12-09 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14833477A JPS5480684A (en) | 1977-12-09 | 1977-12-09 | Manufacture for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5480684A true JPS5480684A (en) | 1979-06-27 |
| JPS6161254B2 JPS6161254B2 (enrdf_load_stackoverflow) | 1986-12-24 |
Family
ID=15450438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14833477A Granted JPS5480684A (en) | 1977-12-09 | 1977-12-09 | Manufacture for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5480684A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365627A (ja) * | 1986-09-05 | 1988-03-24 | Rohm Co Ltd | 半導体基板のエツチング方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0297710U (enrdf_load_stackoverflow) * | 1989-01-17 | 1990-08-03 | ||
| JPH02119302U (enrdf_load_stackoverflow) * | 1989-03-13 | 1990-09-26 |
-
1977
- 1977-12-09 JP JP14833477A patent/JPS5480684A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6365627A (ja) * | 1986-09-05 | 1988-03-24 | Rohm Co Ltd | 半導体基板のエツチング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6161254B2 (enrdf_load_stackoverflow) | 1986-12-24 |
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