JPS54148379A - Plating method of base ribbon for semiconductor device - Google Patents

Plating method of base ribbon for semiconductor device

Info

Publication number
JPS54148379A
JPS54148379A JP5677278A JP5677278A JPS54148379A JP S54148379 A JPS54148379 A JP S54148379A JP 5677278 A JP5677278 A JP 5677278A JP 5677278 A JP5677278 A JP 5677278A JP S54148379 A JPS54148379 A JP S54148379A
Authority
JP
Japan
Prior art keywords
plating
ribbons
semiconductor device
plating method
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5677278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS623585B2 (enrdf_load_stackoverflow
Inventor
Tomoaki Kojima
Tomoichi Oku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5677278A priority Critical patent/JPS54148379A/ja
Publication of JPS54148379A publication Critical patent/JPS54148379A/ja
Publication of JPS623585B2 publication Critical patent/JPS623585B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5677278A 1978-05-12 1978-05-12 Plating method of base ribbon for semiconductor device Granted JPS54148379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5677278A JPS54148379A (en) 1978-05-12 1978-05-12 Plating method of base ribbon for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5677278A JPS54148379A (en) 1978-05-12 1978-05-12 Plating method of base ribbon for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54148379A true JPS54148379A (en) 1979-11-20
JPS623585B2 JPS623585B2 (enrdf_load_stackoverflow) 1987-01-26

Family

ID=13036757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5677278A Granted JPS54148379A (en) 1978-05-12 1978-05-12 Plating method of base ribbon for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54148379A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62108563A (ja) * 1985-11-06 1987-05-19 Mitsubishi Electric Corp めつき処理装置
US5512780A (en) * 1994-09-09 1996-04-30 Sun Microsystems, Inc. Inorganic chip-to-package interconnection circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62108563A (ja) * 1985-11-06 1987-05-19 Mitsubishi Electric Corp めつき処理装置
US5512780A (en) * 1994-09-09 1996-04-30 Sun Microsystems, Inc. Inorganic chip-to-package interconnection circuit

Also Published As

Publication number Publication date
JPS623585B2 (enrdf_load_stackoverflow) 1987-01-26

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