JPS54132166A - Socket for semiconductor device - Google Patents

Socket for semiconductor device

Info

Publication number
JPS54132166A
JPS54132166A JP4074778A JP4074778A JPS54132166A JP S54132166 A JPS54132166 A JP S54132166A JP 4074778 A JP4074778 A JP 4074778A JP 4074778 A JP4074778 A JP 4074778A JP S54132166 A JPS54132166 A JP S54132166A
Authority
JP
Japan
Prior art keywords
socket
main body
semiconductor device
bar
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4074778A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4074778A priority Critical patent/JPS54132166A/en
Publication of JPS54132166A publication Critical patent/JPS54132166A/en
Pending legal-status Critical Current

Links

Landscapes

  • Connecting Device With Holders (AREA)

Abstract

PURPOSE: To miniaturize the socket for semiconductor device by producing the socket with the insulating material and then forming the contact bar by positioning one end of the soldering terminal to the hole provided on the surface with the other end of the terminal protruded over the back of the socket.
CONSTITUTION: Socket main body 1' is produced with the resin such as the Teflon, polypropylene, nylon and the like, and independent contact bar 2a' and 2b' to connect to external lead 6' of semiconductor device 8' are provided inside the hole drilled on one surface of the socket. These contact bars are pierced through main body 1' and then protruded to the opposite side to be used as soldering terminal 3a' and 3b'. Thus, socket main body is formed, and then 1st and 2nd conductor layer 6a' and 6b' holding insulator layer 7' formed to device 8' between are fitted between bar 2a' and 2b'. As a result, a miniature socket can be obtained with a high package density compared with the number of function of the integrated circuit.
COPYRIGHT: (C)1979,JPO&Japio
JP4074778A 1978-04-05 1978-04-05 Socket for semiconductor device Pending JPS54132166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4074778A JPS54132166A (en) 1978-04-05 1978-04-05 Socket for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4074778A JPS54132166A (en) 1978-04-05 1978-04-05 Socket for semiconductor device

Publications (1)

Publication Number Publication Date
JPS54132166A true JPS54132166A (en) 1979-10-13

Family

ID=12589216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4074778A Pending JPS54132166A (en) 1978-04-05 1978-04-05 Socket for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54132166A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1981003396A1 (en) * 1980-05-12 1981-11-26 Ncr Co Integrated circuit package with multi-contact pins
WO1985004522A1 (en) * 1984-03-22 1985-10-10 Mostek Corporation Impedance-matched leads
US4742385A (en) * 1985-08-07 1988-05-03 Nec Corporation Multichip package having outer and inner power supply means

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1981003396A1 (en) * 1980-05-12 1981-11-26 Ncr Co Integrated circuit package with multi-contact pins
WO1985004522A1 (en) * 1984-03-22 1985-10-10 Mostek Corporation Impedance-matched leads
US4742385A (en) * 1985-08-07 1988-05-03 Nec Corporation Multichip package having outer and inner power supply means

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