JPS54132166A - Socket for semiconductor device - Google Patents
Socket for semiconductor deviceInfo
- Publication number
- JPS54132166A JPS54132166A JP4074778A JP4074778A JPS54132166A JP S54132166 A JPS54132166 A JP S54132166A JP 4074778 A JP4074778 A JP 4074778A JP 4074778 A JP4074778 A JP 4074778A JP S54132166 A JPS54132166 A JP S54132166A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- main body
- semiconductor device
- bar
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connecting Device With Holders (AREA)
Abstract
PURPOSE: To miniaturize the socket for semiconductor device by producing the socket with the insulating material and then forming the contact bar by positioning one end of the soldering terminal to the hole provided on the surface with the other end of the terminal protruded over the back of the socket.
CONSTITUTION: Socket main body 1' is produced with the resin such as the Teflon, polypropylene, nylon and the like, and independent contact bar 2a' and 2b' to connect to external lead 6' of semiconductor device 8' are provided inside the hole drilled on one surface of the socket. These contact bars are pierced through main body 1' and then protruded to the opposite side to be used as soldering terminal 3a' and 3b'. Thus, socket main body is formed, and then 1st and 2nd conductor layer 6a' and 6b' holding insulator layer 7' formed to device 8' between are fitted between bar 2a' and 2b'. As a result, a miniature socket can be obtained with a high package density compared with the number of function of the integrated circuit.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4074778A JPS54132166A (en) | 1978-04-05 | 1978-04-05 | Socket for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4074778A JPS54132166A (en) | 1978-04-05 | 1978-04-05 | Socket for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54132166A true JPS54132166A (en) | 1979-10-13 |
Family
ID=12589216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4074778A Pending JPS54132166A (en) | 1978-04-05 | 1978-04-05 | Socket for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54132166A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1981003396A1 (en) * | 1980-05-12 | 1981-11-26 | Ncr Co | Integrated circuit package with multi-contact pins |
WO1985004522A1 (en) * | 1984-03-22 | 1985-10-10 | Mostek Corporation | Impedance-matched leads |
US4742385A (en) * | 1985-08-07 | 1988-05-03 | Nec Corporation | Multichip package having outer and inner power supply means |
-
1978
- 1978-04-05 JP JP4074778A patent/JPS54132166A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1981003396A1 (en) * | 1980-05-12 | 1981-11-26 | Ncr Co | Integrated circuit package with multi-contact pins |
WO1985004522A1 (en) * | 1984-03-22 | 1985-10-10 | Mostek Corporation | Impedance-matched leads |
US4742385A (en) * | 1985-08-07 | 1988-05-03 | Nec Corporation | Multichip package having outer and inner power supply means |
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