JPS54130880A - Detector for chip position on semiconductor wafer - Google Patents

Detector for chip position on semiconductor wafer

Info

Publication number
JPS54130880A
JPS54130880A JP3813578A JP3813578A JPS54130880A JP S54130880 A JPS54130880 A JP S54130880A JP 3813578 A JP3813578 A JP 3813578A JP 3813578 A JP3813578 A JP 3813578A JP S54130880 A JPS54130880 A JP S54130880A
Authority
JP
Japan
Prior art keywords
optical fiber
light
light source
detection
rough
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3813578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6152978B2 (enExample
Inventor
Tomohiro Kuji
Yukio Kenbo
Hiroshi Makihira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3813578A priority Critical patent/JPS54130880A/ja
Priority to US05/964,353 priority patent/US4213117A/en
Publication of JPS54130880A publication Critical patent/JPS54130880A/ja
Publication of JPS6152978B2 publication Critical patent/JPS6152978B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Dicing (AREA)
JP3813578A 1977-11-28 1978-04-03 Detector for chip position on semiconductor wafer Granted JPS54130880A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP3813578A JPS54130880A (en) 1978-04-03 1978-04-03 Detector for chip position on semiconductor wafer
US05/964,353 US4213117A (en) 1977-11-28 1978-11-28 Method and apparatus for detecting positions of chips on a semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3813578A JPS54130880A (en) 1978-04-03 1978-04-03 Detector for chip position on semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS54130880A true JPS54130880A (en) 1979-10-11
JPS6152978B2 JPS6152978B2 (enExample) 1986-11-15

Family

ID=12516982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3813578A Granted JPS54130880A (en) 1977-11-28 1978-04-03 Detector for chip position on semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS54130880A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire
JPS58158937A (ja) * 1982-03-17 1983-09-21 Hitachi Ltd 表面の欠陥検査装置
JPS5989538U (ja) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 ペレツトピツクアツプ装置
JPS61123911A (ja) * 1984-11-20 1986-06-11 Toshiba Corp Ｉｃチップの位置合せ装置
WO2006008829A1 (ja) * 2004-07-22 2006-01-26 Renesas Technology Corp. 半導体装置の製造方法
JP2008145345A (ja) * 2006-12-12 2008-06-26 Lintec Corp チップ間隔の測定装置とその測定方法
JP2009076765A (ja) * 2007-09-21 2009-04-09 Disco Abrasive Syst Ltd 切削装置の切削ブレード検出機構
JP2010171119A (ja) * 2009-01-21 2010-08-05 Laser Solutions Co Ltd 観察装置、位置決め装置、レーザー加工装置および観察方法
JP2012250338A (ja) * 2011-06-07 2012-12-20 Disco Corp 加工装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155743A (en) * 1981-03-20 1982-09-25 Fujitsu Ltd Inspection device for semiconductor bonding wire
JPS58158937A (ja) * 1982-03-17 1983-09-21 Hitachi Ltd 表面の欠陥検査装置
JPS5989538U (ja) * 1982-12-08 1984-06-18 日本電気ホームエレクトロニクス株式会社 ペレツトピツクアツプ装置
JPS61123911A (ja) * 1984-11-20 1986-06-11 Toshiba Corp Ｉｃチップの位置合せ装置
WO2006008829A1 (ja) * 2004-07-22 2006-01-26 Renesas Technology Corp. 半導体装置の製造方法
US7998793B2 (en) 2004-07-22 2011-08-16 Renesas Electronics Corporation Light illumination during wafer dicing to prevent aluminum corrosion
JP2008145345A (ja) * 2006-12-12 2008-06-26 Lintec Corp チップ間隔の測定装置とその測定方法
JP2009076765A (ja) * 2007-09-21 2009-04-09 Disco Abrasive Syst Ltd 切削装置の切削ブレード検出機構
JP2010171119A (ja) * 2009-01-21 2010-08-05 Laser Solutions Co Ltd 観察装置、位置決め装置、レーザー加工装置および観察方法
JP2012250338A (ja) * 2011-06-07 2012-12-20 Disco Corp 加工装置

Also Published As

Publication number Publication date
JPS6152978B2 (enExample) 1986-11-15

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