JPS54128277A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54128277A
JPS54128277A JP3553578A JP3553578A JPS54128277A JP S54128277 A JPS54128277 A JP S54128277A JP 3553578 A JP3553578 A JP 3553578A JP 3553578 A JP3553578 A JP 3553578A JP S54128277 A JPS54128277 A JP S54128277A
Authority
JP
Japan
Prior art keywords
chip
base
concavity
heat dissipation
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3553578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130742B2 (enrdf_load_stackoverflow
Inventor
Shunji Koike
Hajime Murakami
Tadayasu Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3553578A priority Critical patent/JPS54128277A/ja
Publication of JPS54128277A publication Critical patent/JPS54128277A/ja
Publication of JPS6130742B2 publication Critical patent/JPS6130742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3553578A 1978-03-29 1978-03-29 Semiconductor device Granted JPS54128277A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3553578A JPS54128277A (en) 1978-03-29 1978-03-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3553578A JPS54128277A (en) 1978-03-29 1978-03-29 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54128277A true JPS54128277A (en) 1979-10-04
JPS6130742B2 JPS6130742B2 (enrdf_load_stackoverflow) 1986-07-15

Family

ID=12444418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3553578A Granted JPS54128277A (en) 1978-03-29 1978-03-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54128277A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
JPS57126153A (en) * 1981-01-30 1982-08-05 Nec Corp Multichip lsi package
JPS57155749A (en) * 1981-03-21 1982-09-25 Nec Corp Chip carrier structure
JPS57155750A (en) * 1981-03-21 1982-09-25 Nec Corp Chip carrier structure
JPS6027433U (ja) * 1983-07-29 1985-02-25 松下電工株式会社 電子部品の実装構造
JPS6078141U (ja) * 1983-10-31 1985-05-31 松下電工株式会社 電子部品の実装構造

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120266A (enrdf_load_stackoverflow) * 1974-03-06 1975-09-20
JPS5321002U (enrdf_load_stackoverflow) * 1976-08-02 1978-02-22
JPS595977A (ja) * 1982-07-02 1984-01-12 Mitsubishi Electric Corp Ｐｐｉ掃引信号発生方式
JPS595977U (ja) * 1982-07-02 1984-01-14 菅原　通明 児童用室内土俵

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50120266A (enrdf_load_stackoverflow) * 1974-03-06 1975-09-20
JPS5321002U (enrdf_load_stackoverflow) * 1976-08-02 1978-02-22
JPS595977A (ja) * 1982-07-02 1984-01-12 Mitsubishi Electric Corp Ｐｐｉ掃引信号発生方式
JPS595977U (ja) * 1982-07-02 1984-01-14 菅原　通明 児童用室内土俵

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
JPS57126153A (en) * 1981-01-30 1982-08-05 Nec Corp Multichip lsi package
JPS57155749A (en) * 1981-03-21 1982-09-25 Nec Corp Chip carrier structure
JPS57155750A (en) * 1981-03-21 1982-09-25 Nec Corp Chip carrier structure
JPS6027433U (ja) * 1983-07-29 1985-02-25 松下電工株式会社 電子部品の実装構造
JPS6078141U (ja) * 1983-10-31 1985-05-31 松下電工株式会社 電子部品の実装構造

Also Published As

Publication number Publication date
JPS6130742B2 (enrdf_load_stackoverflow) 1986-07-15

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