JPS54111767A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS54111767A
JPS54111767A JP1928878A JP1928878A JPS54111767A JP S54111767 A JPS54111767 A JP S54111767A JP 1928878 A JP1928878 A JP 1928878A JP 1928878 A JP1928878 A JP 1928878A JP S54111767 A JPS54111767 A JP S54111767A
Authority
JP
Japan
Prior art keywords
ribbon
bonding
base
die
shifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1928878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142857B2 (enrdf_load_stackoverflow
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1928878A priority Critical patent/JPS54111767A/ja
Publication of JPS54111767A publication Critical patent/JPS54111767A/ja
Publication of JPS6142857B2 publication Critical patent/JPS6142857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Die Bonding (AREA)
JP1928878A 1978-02-21 1978-02-21 Manufacture for semiconductor device Granted JPS54111767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1928878A JPS54111767A (en) 1978-02-21 1978-02-21 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1928878A JPS54111767A (en) 1978-02-21 1978-02-21 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS54111767A true JPS54111767A (en) 1979-09-01
JPS6142857B2 JPS6142857B2 (enrdf_load_stackoverflow) 1986-09-24

Family

ID=11995248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1928878A Granted JPS54111767A (en) 1978-02-21 1978-02-21 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS54111767A (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114870A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Semiconductor device manufacturing method
JPS5210770U (enrdf_load_stackoverflow) * 1975-07-10 1977-01-25
JPS5355966A (en) * 1976-10-30 1978-05-20 Shinkawa Seisakusho Kk Mechanism for catching lead frames

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114870A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Semiconductor device manufacturing method
JPS5210770U (enrdf_load_stackoverflow) * 1975-07-10 1977-01-25
JPS5355966A (en) * 1976-10-30 1978-05-20 Shinkawa Seisakusho Kk Mechanism for catching lead frames

Also Published As

Publication number Publication date
JPS6142857B2 (enrdf_load_stackoverflow) 1986-09-24

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