JPS54111767A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS54111767A JPS54111767A JP1928878A JP1928878A JPS54111767A JP S54111767 A JPS54111767 A JP S54111767A JP 1928878 A JP1928878 A JP 1928878A JP 1928878 A JP1928878 A JP 1928878A JP S54111767 A JPS54111767 A JP S54111767A
- Authority
- JP
- Japan
- Prior art keywords
- ribbon
- bonding
- base
- die
- shifting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1928878A JPS54111767A (en) | 1978-02-21 | 1978-02-21 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1928878A JPS54111767A (en) | 1978-02-21 | 1978-02-21 | Manufacture for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54111767A true JPS54111767A (en) | 1979-09-01 |
JPS6142857B2 JPS6142857B2 (enrdf_load_stackoverflow) | 1986-09-24 |
Family
ID=11995248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1928878A Granted JPS54111767A (en) | 1978-02-21 | 1978-02-21 | Manufacture for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54111767A (enrdf_load_stackoverflow) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51114870A (en) * | 1975-04-02 | 1976-10-08 | Hitachi Ltd | Semiconductor device manufacturing method |
JPS5210770U (enrdf_load_stackoverflow) * | 1975-07-10 | 1977-01-25 | ||
JPS5355966A (en) * | 1976-10-30 | 1978-05-20 | Shinkawa Seisakusho Kk | Mechanism for catching lead frames |
-
1978
- 1978-02-21 JP JP1928878A patent/JPS54111767A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51114870A (en) * | 1975-04-02 | 1976-10-08 | Hitachi Ltd | Semiconductor device manufacturing method |
JPS5210770U (enrdf_load_stackoverflow) * | 1975-07-10 | 1977-01-25 | ||
JPS5355966A (en) * | 1976-10-30 | 1978-05-20 | Shinkawa Seisakusho Kk | Mechanism for catching lead frames |
Also Published As
Publication number | Publication date |
---|---|
JPS6142857B2 (enrdf_load_stackoverflow) | 1986-09-24 |
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