JPS534472A - Semiconductor package - Google Patents

Semiconductor package

Info

Publication number
JPS534472A
JPS534472A JP7694976A JP7694976A JPS534472A JP S534472 A JPS534472 A JP S534472A JP 7694976 A JP7694976 A JP 7694976A JP 7694976 A JP7694976 A JP 7694976A JP S534472 A JPS534472 A JP S534472A
Authority
JP
Japan
Prior art keywords
semiconductor package
circumference
produce
ceramic substrate
leading out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7694976A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5756773B2 (cs
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7694976A priority Critical patent/JPS534472A/ja
Publication of JPS534472A publication Critical patent/JPS534472A/ja
Publication of JPS5756773B2 publication Critical patent/JPS5756773B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP7694976A 1976-06-29 1976-06-29 Semiconductor package Granted JPS534472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7694976A JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7694976A JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Publications (2)

Publication Number Publication Date
JPS534472A true JPS534472A (en) 1978-01-17
JPS5756773B2 JPS5756773B2 (cs) 1982-12-01

Family

ID=13620006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7694976A Granted JPS534472A (en) 1976-06-29 1976-06-29 Semiconductor package

Country Status (1)

Country Link
JP (1) JPS534472A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571050A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS5884961U (ja) * 1981-12-01 1983-06-09 ヤマハ株式会社 重量物の格納運搬具
JPS58182292A (ja) * 1982-04-19 1983-10-25 松下電器産業株式会社 高密度実装方法
JPS6258337U (cs) * 1985-09-30 1987-04-10
JP2010129661A (ja) * 2008-11-26 2010-06-10 Kyocera Corp 電子装置の実装構造

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2019007947A (es) 2017-01-17 2019-08-29 Nippon Steel Corp Hoja de acero para estampacion en caliente.
KR102262353B1 (ko) 2017-01-17 2021-06-08 닛폰세이테츠 가부시키가이샤 핫 스탬프 성형체 및 그의 제조 방법

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571050A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS5884961U (ja) * 1981-12-01 1983-06-09 ヤマハ株式会社 重量物の格納運搬具
JPS58182292A (ja) * 1982-04-19 1983-10-25 松下電器産業株式会社 高密度実装方法
JPS6258337U (cs) * 1985-09-30 1987-04-10
JP2010129661A (ja) * 2008-11-26 2010-06-10 Kyocera Corp 電子装置の実装構造

Also Published As

Publication number Publication date
JPS5756773B2 (cs) 1982-12-01

Similar Documents

Publication Publication Date Title
JPS534472A (en) Semiconductor package
JPS5333574A (en) Semiconductor integrated circuit package
JPS5342659A (en) Semiconductor integrated circuit
JPS5355965A (en) Manufacture of semiconductor device
JPS5223273A (en) Method of manufacturing semiconductor element
JPS51140572A (en) Semiconductor device
JPS5228868A (en) Semiconductor device
JPS538072A (en) Semiconductor device
JPS5380183A (en) Semiconductor device
JPS534471A (en) Semiconductor package
JPS51127678A (en) Semiconductor device and its manufacturing method
JPS5441666A (en) Semiconductor integrated circuit element
JPS5320857A (en) Semiconductor device
JPS5377172A (en) Production of semiconductor device
JPS52119875A (en) Formation of isolation area
JPS535571A (en) Circuit block and its manufacture
JPS5368163A (en) Production of flip chip
JPS5372567A (en) Semiconductor device
JPS5349948A (en) Semiconductor device
JPS5313874A (en) Production of semiconductor device
JPS5211772A (en) Semiconductor device
JPS51122375A (en) Semiconductor device
JPS5434784A (en) Semiconductor integrated circuit device
JPS5247375A (en) Semoiconductor device
JPS5315759A (en) Electronic parts