JPS5335378A - Bump type semiconductor device - Google Patents

Bump type semiconductor device

Info

Publication number
JPS5335378A
JPS5335378A JP10959476A JP10959476A JPS5335378A JP S5335378 A JPS5335378 A JP S5335378A JP 10959476 A JP10959476 A JP 10959476A JP 10959476 A JP10959476 A JP 10959476A JP S5335378 A JPS5335378 A JP S5335378A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
bump type
film
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10959476A
Other languages
English (en)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10959476A priority Critical patent/JPS5335378A/ja
Publication of JPS5335378A publication Critical patent/JPS5335378A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP10959476A 1976-09-13 1976-09-13 Bump type semiconductor device Pending JPS5335378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10959476A JPS5335378A (en) 1976-09-13 1976-09-13 Bump type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10959476A JPS5335378A (en) 1976-09-13 1976-09-13 Bump type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5335378A true JPS5335378A (en) 1978-04-01

Family

ID=14514214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10959476A Pending JPS5335378A (en) 1976-09-13 1976-09-13 Bump type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5335378A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145631U (ja) * 1979-04-05 1980-10-20
JPS5871112A (ja) * 1981-10-22 1983-04-27 松下電工株式会社 長押の製造方法
JPS5871113A (ja) * 1981-10-22 1983-04-27 松下電工株式会社 長押の製造方法
JPS58123147U (ja) * 1982-02-16 1983-08-22 宮盛木材化工株式会社 長押

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55145631U (ja) * 1979-04-05 1980-10-20
JPS5871112A (ja) * 1981-10-22 1983-04-27 松下電工株式会社 長押の製造方法
JPS5871113A (ja) * 1981-10-22 1983-04-27 松下電工株式会社 長押の製造方法
JPS6128489B2 (ja) * 1981-10-22 1986-06-30 Matsushita Denko Kk
JPS6128488B2 (ja) * 1981-10-22 1986-06-30 Matsushita Denko Kk
JPS58123147U (ja) * 1982-02-16 1983-08-22 宮盛木材化工株式会社 長押

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