JPS528854B2 - - Google Patents

Info

Publication number
JPS528854B2
JPS528854B2 JP47005997A JP599772A JPS528854B2 JP S528854 B2 JPS528854 B2 JP S528854B2 JP 47005997 A JP47005997 A JP 47005997A JP 599772 A JP599772 A JP 599772A JP S528854 B2 JPS528854 B2 JP S528854B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47005997A
Other languages
Japanese (ja)
Other versions
JPS4875633A (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47005997A priority Critical patent/JPS528854B2/ja
Priority to DE2301547A priority patent/DE2301547C3/de
Priority to US00323340A priority patent/US3837876A/en
Publication of JPS4875633A publication Critical patent/JPS4875633A/ja
Publication of JPS528854B2 publication Critical patent/JPS528854B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/02—Polysilicates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Sealing Material Composition (AREA)
JP47005997A 1972-01-13 1972-01-13 Expired JPS528854B2 (en:Method)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP47005997A JPS528854B2 (en:Method) 1972-01-13 1972-01-13
DE2301547A DE2301547C3 (de) 1972-01-13 1973-01-12 Organosilicone
US00323340A US3837876A (en) 1972-01-13 1973-01-15 Organosilicone compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47005997A JPS528854B2 (en:Method) 1972-01-13 1972-01-13

Publications (2)

Publication Number Publication Date
JPS4875633A JPS4875633A (en:Method) 1973-10-12
JPS528854B2 true JPS528854B2 (en:Method) 1977-03-11

Family

ID=11626406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47005997A Expired JPS528854B2 (en:Method) 1972-01-13 1972-01-13

Country Status (3)

Country Link
US (1) US3837876A (en:Method)
JP (1) JPS528854B2 (en:Method)
DE (1) DE2301547C3 (en:Method)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1942169A1 (en) 2006-12-26 2008-07-09 Shin-Etsu Chemical Co., Ltd. Addition cure silicone rubber adhesive composition and making method
EP2130873A1 (en) 2008-05-14 2009-12-09 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane composition
WO2012057281A1 (ja) * 2010-10-27 2012-05-03 セメダイン株式会社 硬化性組成物
WO2012056850A1 (ja) * 2010-10-27 2012-05-03 セメダイン株式会社 硬化性組成物
WO2018043270A1 (ja) 2016-09-01 2018-03-08 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
US10077339B2 (en) 2014-04-09 2018-09-18 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components
WO2019054371A1 (ja) 2017-09-15 2019-03-21 東レ・ダウコーニング株式会社 電子部品またはその前駆体、それらの製造方法
WO2019054370A1 (ja) 2017-09-15 2019-03-21 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物およびパターン形成方法
WO2019107196A1 (ja) 2017-11-30 2019-06-06 ダウ・東レ株式会社 硬化性シリコーンゴム組成物
US10358542B2 (en) 2014-04-09 2019-07-23 Dow Toray Co., Ltd. Adhesion promoter and curable organopolysiloxane composition containing same
WO2020080326A1 (ja) 2018-10-18 2020-04-23 ダウ・東レ株式会社 耐寒性に優れる硬化性オルガノポリシロキサン組成物、パターン形成方法および電子部品等
WO2020203304A1 (ja) 2019-03-29 2020-10-08 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2020203297A1 (ja) 2019-03-29 2020-10-08 ダウ・東レ株式会社 多成分型硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
WO2022038888A1 (ja) 2020-08-21 2022-02-24 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
WO2022138335A1 (ja) 2020-12-25 2022-06-30 ダウ・東レ株式会社 積層体の製造方法
WO2022138336A1 (ja) 2020-12-25 2022-06-30 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物および積層体
WO2022215510A1 (ja) 2021-04-09 2022-10-13 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
WO2022234802A1 (ja) 2021-05-07 2022-11-10 ダウ・東レ株式会社 紫外線硬化性シリコーン組成物及びその硬化物、積層体、並びに光学装置又は光学ディスプレイ
WO2023033031A1 (ja) 2021-08-31 2023-03-09 ダウ・東レ株式会社 顆粒状硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2023032734A1 (ja) 2021-08-31 2023-03-09 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2023032735A1 (ja) 2021-08-31 2023-03-09 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2023120347A1 (ja) 2021-12-21 2023-06-29 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーン組成物、その硬化生成物、及び前記組成物を含む積層体
WO2024020137A1 (en) 2022-07-21 2024-01-25 Dow Silicones Corporation Curable silicone-based gel composition, cured gel thereof, encapsulant agent, electronic article and protection method for semiconductor chip
WO2024071150A1 (ja) 2022-09-29 2024-04-04 ダウ・東レ株式会社 電極層形成性硬化性オルガノポリシロキサン組成物、電極層を備えた積層体、その用途、およびその製造方法
WO2024071151A1 (ja) 2022-09-29 2024-04-04 ダウ・東レ株式会社 ホットメルト型電極層形成性オルガノポリシロキサン組成物、電極層を備えた積層体、その用途、およびその製造方法
WO2024071152A1 (ja) 2022-09-29 2024-04-04 ダウ・東レ株式会社 電極層形成性硬化性オルガノポリシロキサン組成物、電極層を備えた積層体、その用途、およびその製造方法
WO2024090403A1 (ja) 2022-10-24 2024-05-02 ダウ・東レ株式会社 半導体製造用導電性ピラーモジュール前駆体、半導体製造用導電性ピラーモジュール、半導体または半導体前駆体、並びにその製造方法
WO2024135806A1 (ja) 2022-12-23 2024-06-27 ダウ・東レ株式会社 ホットメルト性硬化性シリコーン組成物、当該組成物を用いる積層体、および半導体装置の製造方法
WO2024135805A1 (ja) 2022-12-23 2024-06-27 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化生成物、及び前記組成物の使用

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JPS6029750B2 (ja) * 1976-01-22 1985-07-12 関西ペイント株式会社 塗料組成物
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JPS62209164A (ja) * 1981-05-06 1987-09-14 Kanegafuchi Chem Ind Co Ltd シ−リング材の製造方法
US4378250A (en) * 1981-07-31 1983-03-29 Treadway Gerald D Organosilicone coating compositions
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JPH0768256B2 (ja) * 1991-08-01 1995-07-26 株式会社ジャパンエナジー 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
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JP2608826B2 (ja) * 1991-11-27 1997-05-14 信越化学工業株式会社 接着性組成物
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US5567752A (en) * 1995-02-27 1996-10-22 General Electric Company Silicon- and nitrogen- containing adhesion promotors and compositions containing them
JPH08253607A (ja) * 1995-03-15 1996-10-01 Shin Etsu Polymer Co Ltd 押釦スイッチ用カバー部材およびその製造方法
JP3211656B2 (ja) * 1996-03-18 2001-09-25 信越化学工業株式会社 水溶性繊維処理剤及びその製造方法
FI963157A7 (fi) * 1996-08-13 1998-02-14 Silitek Corp Menetelmä näppäimistön päällystämiseksi
DE19639782A1 (de) * 1996-09-27 1998-04-02 Huels Chemische Werke Ag Glycidether-, Acryl- und/oder Methacryl-funktionelle Organopolysiloxan-haltige Zusammensetzungen auf Wasser-Basis, Verfahren zu deren Herstellung sowie deren Verwendung
US6100313A (en) * 1997-03-07 2000-08-08 The Walman Optical Company UV-curable abrasion-resistant coating composition
US5907000A (en) * 1997-03-07 1999-05-25 The Walman Optical Company Adjustable refractive index coating composition
US5789082A (en) * 1997-03-12 1998-08-04 The Walman Optical Company Thermosetting coating composition
US6057040A (en) * 1998-01-22 2000-05-02 Vision--Ease Lens, Inc. Aminosilane coating composition and process for producing coated articles
US6780232B2 (en) * 1999-08-20 2004-08-24 The Walman Optical Company Coating composition yielding abrasion-resistant tiniable coating
US6250760B1 (en) 1999-08-20 2001-06-26 The Walman Optical Company Silane-based coating composition
JP4662601B2 (ja) 2000-03-15 2011-03-30 石原薬品株式会社 着色透明被膜形成組成物、その塗装方法及び剥離方法
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US6500486B1 (en) 2000-06-22 2002-12-31 Elaine M. Anderson Controlled tintability on mar-resistant coatings
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US20080206454A1 (en) * 2007-02-27 2008-08-28 Insight Equity A.P.X., L.P. (Dba Vision-Ease Lens) Composition Of Primer Solution For Use With An Optical Article And Method Of Priming An Optical Article
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Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1942169A1 (en) 2006-12-26 2008-07-09 Shin-Etsu Chemical Co., Ltd. Addition cure silicone rubber adhesive composition and making method
EP2130873A1 (en) 2008-05-14 2009-12-09 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane composition
WO2012057281A1 (ja) * 2010-10-27 2012-05-03 セメダイン株式会社 硬化性組成物
WO2012056850A1 (ja) * 2010-10-27 2012-05-03 セメダイン株式会社 硬化性組成物
US10077339B2 (en) 2014-04-09 2018-09-18 Dow Corning Toray Co., Ltd. Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic components
US10358542B2 (en) 2014-04-09 2019-07-23 Dow Toray Co., Ltd. Adhesion promoter and curable organopolysiloxane composition containing same
WO2018043270A1 (ja) 2016-09-01 2018-03-08 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および電気・電子部品の保護剤または接着剤組成物
US11555118B2 (en) 2016-09-01 2023-01-17 Dow Toray Co., Ltd. Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
WO2019054371A1 (ja) 2017-09-15 2019-03-21 東レ・ダウコーニング株式会社 電子部品またはその前駆体、それらの製造方法
WO2019054370A1 (ja) 2017-09-15 2019-03-21 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物およびパターン形成方法
WO2019107196A1 (ja) 2017-11-30 2019-06-06 ダウ・東レ株式会社 硬化性シリコーンゴム組成物
US11505703B2 (en) 2017-11-30 2022-11-22 Dow Toray Co., Ltd. Curable silicone rubber composition
WO2020080326A1 (ja) 2018-10-18 2020-04-23 ダウ・東レ株式会社 耐寒性に優れる硬化性オルガノポリシロキサン組成物、パターン形成方法および電子部品等
WO2020203304A1 (ja) 2019-03-29 2020-10-08 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
WO2020203297A1 (ja) 2019-03-29 2020-10-08 ダウ・東レ株式会社 多成分型硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
WO2022038888A1 (ja) 2020-08-21 2022-02-24 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、熱伝導性部材および放熱構造体
WO2022138335A1 (ja) 2020-12-25 2022-06-30 ダウ・東レ株式会社 積層体の製造方法
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JPS4875633A (en:Method) 1973-10-12
US3837876A (en) 1974-09-24
DE2301547C3 (de) 1979-07-19
DE2301547B2 (de) 1978-11-09
DE2301547A1 (de) 1973-07-19

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