JPS5258376A - Etching for flattening of semiconductor surface - Google Patents

Etching for flattening of semiconductor surface

Info

Publication number
JPS5258376A
JPS5258376A JP13403675A JP13403675A JPS5258376A JP S5258376 A JPS5258376 A JP S5258376A JP 13403675 A JP13403675 A JP 13403675A JP 13403675 A JP13403675 A JP 13403675A JP S5258376 A JPS5258376 A JP S5258376A
Authority
JP
Japan
Prior art keywords
etching
flattening
semiconductor surface
serration
flatten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13403675A
Other languages
English (en)
Japanese (ja)
Inventor
Kaoru Niino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13403675A priority Critical patent/JPS5258376A/ja
Priority to DE19762651125 priority patent/DE2651125A1/de
Priority to NL7612499A priority patent/NL7612499A/xx
Publication of JPS5258376A publication Critical patent/JPS5258376A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP13403675A 1975-11-10 1975-11-10 Etching for flattening of semiconductor surface Pending JPS5258376A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP13403675A JPS5258376A (en) 1975-11-10 1975-11-10 Etching for flattening of semiconductor surface
DE19762651125 DE2651125A1 (de) 1975-11-10 1976-11-09 Verfahren zum flachaetzen der oberflaeche von halbleitern
NL7612499A NL7612499A (nl) 1975-11-10 1976-11-10 Werkwijze voor het vlak etsen van het opper- vlak van een halfgeleider.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13403675A JPS5258376A (en) 1975-11-10 1975-11-10 Etching for flattening of semiconductor surface

Publications (1)

Publication Number Publication Date
JPS5258376A true JPS5258376A (en) 1977-05-13

Family

ID=15118859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13403675A Pending JPS5258376A (en) 1975-11-10 1975-11-10 Etching for flattening of semiconductor surface

Country Status (3)

Country Link
JP (1) JPS5258376A (de)
DE (1) DE2651125A1 (de)
NL (1) NL7612499A (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0286855A1 (de) * 1987-04-15 1988-10-19 BBC Brown Boveri AG Verfahren zum Aetzen von Vertiefungen in ein Siliziumsubstrat

Also Published As

Publication number Publication date
NL7612499A (nl) 1977-05-12
DE2651125A1 (de) 1977-05-18

Similar Documents

Publication Publication Date Title
JPS52153384A (en) Preparation of semiconductor device
JPS5431273A (en) Manufacture of semiconductor device
JPS51136289A (en) Semi-conductor producing
JPS5258376A (en) Etching for flattening of semiconductor surface
JPS5425169A (en) Matching method for photo mask against semiconductor wafer
JPS543473A (en) Manufacture of semiconductor device
JPS5258472A (en) Selective oxidation
JPS5232263A (en) Semiconductor manufacturing process
JPS531471A (en) Manufacture for semiconductor device
JPS5240977A (en) Process for production of semiconductor device
JPS52112281A (en) Manufacture of semiconductor
JPS5220764A (en) Manufacturing system of mesa type semi-conductor unit
JPS5251872A (en) Production of semiconductor device
JPS5244175A (en) Method of flat etching of silicon substrate
JPS51118369A (en) Manufacturing process for simiconduator unit
JPS5386177A (en) Production of semiconductor device
JPS5415669A (en) Manufacture of mesa-type semiconductor device
JPS52130567A (en) Preparation of semiconductor device
JPS5247685A (en) Process for production of mos type semiconductor device
JPS51118389A (en) Manufacturing process for senicondanctor unit
JPS5248469A (en) Process for production of semiconductor device
JPS51151081A (en) Mos type semiconductor apparatus and that manufacturing method
JPS51112266A (en) Semiconductor device production method
JPS5211867A (en) Manufacturing method of a semiconductor device
JPS51113578A (en) Semi-conductor elements