JPS5253778A - Ion plating apparatus - Google Patents

Ion plating apparatus

Info

Publication number
JPS5253778A
JPS5253778A JP13009775A JP13009775A JPS5253778A JP S5253778 A JPS5253778 A JP S5253778A JP 13009775 A JP13009775 A JP 13009775A JP 13009775 A JP13009775 A JP 13009775A JP S5253778 A JPS5253778 A JP S5253778A
Authority
JP
Japan
Prior art keywords
ion plating
plating apparatus
plated
ionization
impurities
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13009775A
Other languages
Japanese (ja)
Other versions
JPS5521109B2 (en
Inventor
Yoichi Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP13009775A priority Critical patent/JPS5253778A/en
Publication of JPS5253778A publication Critical patent/JPS5253778A/en
Publication of JPS5521109B2 publication Critical patent/JPS5521109B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:A vacuum evaporation chamber is divided into two or more parts by electromagnetic shielding plates and ionization of evaporated particles by high frequency excitation is carried out in each part to increase bonding strength of plated products and prevent degradation of plated films due to the presence of impurities.
JP13009775A 1975-10-29 1975-10-29 Ion plating apparatus Granted JPS5253778A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13009775A JPS5253778A (en) 1975-10-29 1975-10-29 Ion plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13009775A JPS5253778A (en) 1975-10-29 1975-10-29 Ion plating apparatus

Publications (2)

Publication Number Publication Date
JPS5253778A true JPS5253778A (en) 1977-04-30
JPS5521109B2 JPS5521109B2 (en) 1980-06-07

Family

ID=15025872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13009775A Granted JPS5253778A (en) 1975-10-29 1975-10-29 Ion plating apparatus

Country Status (1)

Country Link
JP (1) JPS5253778A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210267A (en) * 1985-07-05 1987-01-19 Seiko Electronic Components Ltd Ion plating method
JPS63105960A (en) * 1986-06-07 1988-05-11 Kawasaki Steel Corp Production of metallic strip provided with ion plating film having excellent adhesiveness and ion plating device
US5474611A (en) * 1992-05-20 1995-12-12 Yoichi Murayama, Shincron Co., Ltd. Plasma vapor deposition apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474926U (en) * 1971-02-03 1972-09-13
JPS4879736A (en) * 1972-01-27 1973-10-25
JPS49120877A (en) * 1973-03-20 1974-11-19
JPS5022780A (en) * 1973-07-03 1975-03-11

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS474926U (en) * 1971-02-03 1972-09-13
JPS4879736A (en) * 1972-01-27 1973-10-25
JPS49120877A (en) * 1973-03-20 1974-11-19
JPS5022780A (en) * 1973-07-03 1975-03-11

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6210267A (en) * 1985-07-05 1987-01-19 Seiko Electronic Components Ltd Ion plating method
JPH0136553B2 (en) * 1985-07-05 1989-08-01 Seikoo Denshi Buhin Kk
JPS63105960A (en) * 1986-06-07 1988-05-11 Kawasaki Steel Corp Production of metallic strip provided with ion plating film having excellent adhesiveness and ion plating device
US5474611A (en) * 1992-05-20 1995-12-12 Yoichi Murayama, Shincron Co., Ltd. Plasma vapor deposition apparatus

Also Published As

Publication number Publication date
JPS5521109B2 (en) 1980-06-07

Similar Documents

Publication Publication Date Title
FR2410361A1 (en) PULVERIZATION PROCESS FOR NEGATIVE METAL IONS
GB1405489A (en) Sputtering apparatus
JPS5253778A (en) Ion plating apparatus
JPS57194255A (en) Sputtering device
JPS5558371A (en) Sputtering apparatus
JPS526329A (en) Production process of grain oriented electrical steel sheet
JPS5743986A (en) Film forming apparatus
JPS5437076A (en) Sputtering
JPS5254898A (en) Spattering ion source of microwave
JPS5435178A (en) Ultrafine particle depositing apparatus
JPS56121629A (en) Film forming method
JPS5399082A (en) High frequency sputtering apparatus
GB764337A (en) Improvements relating to the treatment of materials by electronic bombardment
JPS5259527A (en) Color picture tube with deflection magnetic field control elements
GB1153518A (en) Improvements in and relating to Sputtering
JPS556364A (en) Production of nd filter
JPS51119386A (en) Vacuum evapotation vessel
JPS5219001A (en) Electric wave shielding panels of electrical wave shielding
JPS53132396A (en) Solid ion source
JPS5225547A (en) Reflex type periodic-wave divider
JPS5441083A (en) Electrostatic induction type semiconductor device and production of the same
JPS5616672A (en) Sputtering target
JPS51146183A (en) High frequency wave ion plating device
JPS57137469A (en) Sputtering device
JPS5223543A (en) Method of forming local vacuum chamber in electron beam welding