JPS52131486A - Semicondcutor laser unit - Google Patents
Semicondcutor laser unitInfo
- Publication number
- JPS52131486A JPS52131486A JP4787576A JP4787576A JPS52131486A JP S52131486 A JPS52131486 A JP S52131486A JP 4787576 A JP4787576 A JP 4787576A JP 4787576 A JP4787576 A JP 4787576A JP S52131486 A JPS52131486 A JP S52131486A
- Authority
- JP
- Japan
- Prior art keywords
- laser unit
- semicondcutor laser
- laser
- swell
- header
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4787576A JPS52131486A (en) | 1976-04-28 | 1976-04-28 | Semicondcutor laser unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4787576A JPS52131486A (en) | 1976-04-28 | 1976-04-28 | Semicondcutor laser unit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52131486A true JPS52131486A (en) | 1977-11-04 |
JPS552903B2 JPS552903B2 (enrdf_load_stackoverflow) | 1980-01-22 |
Family
ID=12787545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4787576A Granted JPS52131486A (en) | 1976-04-28 | 1976-04-28 | Semicondcutor laser unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52131486A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157093A (en) * | 1978-05-31 | 1979-12-11 | Fujitsu Ltd | Production method of semiconductor laser element |
-
1976
- 1976-04-28 JP JP4787576A patent/JPS52131486A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157093A (en) * | 1978-05-31 | 1979-12-11 | Fujitsu Ltd | Production method of semiconductor laser element |
Also Published As
Publication number | Publication date |
---|---|
JPS552903B2 (enrdf_load_stackoverflow) | 1980-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5435679A (en) | Semiconductor connection method | |
JPS5380966A (en) | Manufacture of electrode fdr semiconductor device | |
JPS52131486A (en) | Semicondcutor laser unit | |
JPS51151069A (en) | Electrode forming method of a semiconductor element | |
JPS5412263A (en) | Semiconductor element and production of the same | |
JPS5321567A (en) | Connecting terminals of semiconductor devices | |
JPS5333057A (en) | Bump type semiconductor device | |
JPS5361970A (en) | Semiconductor element | |
JPS5362471A (en) | Semiconductor device | |
JPS5283173A (en) | Circuit packaging substrate | |
JPS5326585A (en) | Production of mis semiconductor device | |
JPS535571A (en) | Circuit block and its manufacture | |
JPS5310266A (en) | Production of soldred semiconductor wafers | |
JPS5343474A (en) | Semiconductor integrated circuit | |
JPS5313883A (en) | Semiconductor device and its production | |
JPS5370766A (en) | Semiconductor device | |
JPS5284966A (en) | Semiconductor device | |
JPS51137378A (en) | Semi conductor wafer | |
JPS52132789A (en) | Manufacture for supersonic vibrator | |
JPS5323579A (en) | Production of semiconductor device | |
JPS5363866A (en) | Production of semiconductor device | |
JPS5338978A (en) | Manufacture of semiconductor device | |
JPS52152166A (en) | Bump electrode formation method | |
JPS5385161A (en) | Production of semiconductor device | |
JPS5283166A (en) | Semiconductor device and its production |