JPS52131486A - Semicondcutor laser unit - Google Patents

Semicondcutor laser unit

Info

Publication number
JPS52131486A
JPS52131486A JP4787576A JP4787576A JPS52131486A JP S52131486 A JPS52131486 A JP S52131486A JP 4787576 A JP4787576 A JP 4787576A JP 4787576 A JP4787576 A JP 4787576A JP S52131486 A JPS52131486 A JP S52131486A
Authority
JP
Japan
Prior art keywords
laser unit
semicondcutor laser
laser
swell
header
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4787576A
Other languages
Japanese (ja)
Other versions
JPS552903B2 (en
Inventor
Yoshio Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP4787576A priority Critical patent/JPS52131486A/en
Publication of JPS52131486A publication Critical patent/JPS52131486A/en
Publication of JPS552903B2 publication Critical patent/JPS552903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE: To prevent the electric short circuit on the side surface of the semiconductor element caused by the swell of the dice bonding solder material when the ohmic electrode is mounted on the header for the production the laser element containing the side surface functioning as a laser resonator.
COPYRIGHT: (C)1977,JPO&Japio
JP4787576A 1976-04-28 1976-04-28 Semicondcutor laser unit Granted JPS52131486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4787576A JPS52131486A (en) 1976-04-28 1976-04-28 Semicondcutor laser unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4787576A JPS52131486A (en) 1976-04-28 1976-04-28 Semicondcutor laser unit

Publications (2)

Publication Number Publication Date
JPS52131486A true JPS52131486A (en) 1977-11-04
JPS552903B2 JPS552903B2 (en) 1980-01-22

Family

ID=12787545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4787576A Granted JPS52131486A (en) 1976-04-28 1976-04-28 Semicondcutor laser unit

Country Status (1)

Country Link
JP (1) JPS52131486A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157093A (en) * 1978-05-31 1979-12-11 Fujitsu Ltd Production method of semiconductor laser element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157093A (en) * 1978-05-31 1979-12-11 Fujitsu Ltd Production method of semiconductor laser element

Also Published As

Publication number Publication date
JPS552903B2 (en) 1980-01-22

Similar Documents

Publication Publication Date Title
JPS5435679A (en) Semiconductor connection method
JPS52131486A (en) Semicondcutor laser unit
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5412263A (en) Semiconductor element and production of the same
JPS5333057A (en) Bump type semiconductor device
JPS5361970A (en) Semiconductor element
JPS5237766A (en) Semiconductor device
JPS52153383A (en) Preparation of semiconductor device
JPS5362471A (en) Semiconductor device
JPS5283173A (en) Circuit packaging substrate
JPS5326585A (en) Production of mis semiconductor device
JPS535571A (en) Circuit block and its manufacture
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5343474A (en) Semiconductor integrated circuit
JPS5313883A (en) Semiconductor device and its production
JPS5375763A (en) Manufacture for semiconductor device
JPS5317274A (en) Electrode structure of semiconductor element
JPS5370766A (en) Semiconductor device
JPS5284966A (en) Semiconductor device
JPS5321567A (en) Connecting terminals of semiconductor devices
JPS51137378A (en) Semi conductor wafer
JPS52132789A (en) Manufacture for supersonic vibrator
JPS5323579A (en) Production of semiconductor device
JPS52126167A (en) Formation of electrode for semiconductor device
JPS5338978A (en) Manufacture of semiconductor device