JPS552903B2 - - Google Patents

Info

Publication number
JPS552903B2
JPS552903B2 JP4787576A JP4787576A JPS552903B2 JP S552903 B2 JPS552903 B2 JP S552903B2 JP 4787576 A JP4787576 A JP 4787576A JP 4787576 A JP4787576 A JP 4787576A JP S552903 B2 JPS552903 B2 JP S552903B2
Authority
JP
Japan
Prior art keywords
laser
swell
header
short circuit
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4787576A
Other languages
Japanese (ja)
Other versions
JPS52131486A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4787576A priority Critical patent/JPS52131486A/en
Publication of JPS52131486A publication Critical patent/JPS52131486A/en
Publication of JPS552903B2 publication Critical patent/JPS552903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Abstract

PURPOSE:To prevent the electric short circuit on the side surface of the semiconductor element caused by the swell of the dice bonding solder material when the ohmic electrode is mounted on the header for the production the laser element containing the side surface functioning as a laser resonator.
JP4787576A 1976-04-28 1976-04-28 Semicondcutor laser unit Granted JPS52131486A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4787576A JPS52131486A (en) 1976-04-28 1976-04-28 Semicondcutor laser unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4787576A JPS52131486A (en) 1976-04-28 1976-04-28 Semicondcutor laser unit

Publications (2)

Publication Number Publication Date
JPS52131486A JPS52131486A (en) 1977-11-04
JPS552903B2 true JPS552903B2 (en) 1980-01-22

Family

ID=12787545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4787576A Granted JPS52131486A (en) 1976-04-28 1976-04-28 Semicondcutor laser unit

Country Status (1)

Country Link
JP (1) JPS52131486A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54157093A (en) * 1978-05-31 1979-12-11 Fujitsu Ltd Production method of semiconductor laser element

Also Published As

Publication number Publication date
JPS52131486A (en) 1977-11-04

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