JPS53135576A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS53135576A
JPS53135576A JP5044277A JP5044277A JPS53135576A JP S53135576 A JPS53135576 A JP S53135576A JP 5044277 A JP5044277 A JP 5044277A JP 5044277 A JP5044277 A JP 5044277A JP S53135576 A JPS53135576 A JP S53135576A
Authority
JP
Japan
Prior art keywords
soldering
semiconductor device
external lead
solder
increasing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5044277A
Other languages
Japanese (ja)
Inventor
Tadashi Hasegawa
Hiroshi Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5044277A priority Critical patent/JPS53135576A/en
Publication of JPS53135576A publication Critical patent/JPS53135576A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To make strong even for fine soldering through increasing the amount of solder, by providing a soldering storage at the external lead junction part, in soldering the external lead to the groove of the base on which a semiconductor element is mounted.
JP5044277A 1977-04-30 1977-04-30 Semiconductor device Pending JPS53135576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044277A JPS53135576A (en) 1977-04-30 1977-04-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044277A JPS53135576A (en) 1977-04-30 1977-04-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS53135576A true JPS53135576A (en) 1978-11-27

Family

ID=12858966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044277A Pending JPS53135576A (en) 1977-04-30 1977-04-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS53135576A (en)

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