JPS52104062A - Production of surface protection film of electronic parts - Google Patents

Production of surface protection film of electronic parts

Info

Publication number
JPS52104062A
JPS52104062A JP1998976A JP1998976A JPS52104062A JP S52104062 A JPS52104062 A JP S52104062A JP 1998976 A JP1998976 A JP 1998976A JP 1998976 A JP1998976 A JP 1998976A JP S52104062 A JPS52104062 A JP S52104062A
Authority
JP
Japan
Prior art keywords
surface protection
protection film
production
electronic parts
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998976A
Other languages
Japanese (ja)
Inventor
Takeo Yoshimi
Hideo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1998976A priority Critical patent/JPS52104062A/en
Publication of JPS52104062A publication Critical patent/JPS52104062A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PURPOSE: To produce a surface protection film with high reliability which excells in wet proof and anti corosive character, by means of forming Si3N4 film with plasma CVD, through a silicate glass film on the surface of Al distribution layer.
COPYRIGHT: (C)1977,JPO&Japio
JP1998976A 1976-02-27 1976-02-27 Production of surface protection film of electronic parts Pending JPS52104062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1998976A JPS52104062A (en) 1976-02-27 1976-02-27 Production of surface protection film of electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1998976A JPS52104062A (en) 1976-02-27 1976-02-27 Production of surface protection film of electronic parts

Publications (1)

Publication Number Publication Date
JPS52104062A true JPS52104062A (en) 1977-09-01

Family

ID=12014574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1998976A Pending JPS52104062A (en) 1976-02-27 1976-02-27 Production of surface protection film of electronic parts

Country Status (1)

Country Link
JP (1) JPS52104062A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598833A (en) * 1979-01-22 1980-07-28 Mitsubishi Electric Corp Semiconductor device
JPS56116628A (en) * 1980-02-20 1981-09-12 Fujitsu Ltd Semiconductor device
JPS56150831A (en) * 1980-04-24 1981-11-21 Nec Corp Semiconductor device
JPS5793530A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57157529A (en) * 1981-03-24 1982-09-29 Seiko Epson Corp Semiconductor device
JPS59143362A (en) * 1983-02-03 1984-08-16 Fuji Xerox Co Ltd Passivation film
JPS62248239A (en) * 1986-04-22 1987-10-29 Nec Corp Manufacture of semiconductor device
JPS63211648A (en) * 1988-01-29 1988-09-02 Hitachi Ltd Resin seal type semiconductor device
US5371411A (en) * 1980-09-01 1994-12-06 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US5552639A (en) * 1980-09-01 1996-09-03 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5598833A (en) * 1979-01-22 1980-07-28 Mitsubishi Electric Corp Semiconductor device
JPS56116628A (en) * 1980-02-20 1981-09-12 Fujitsu Ltd Semiconductor device
JPS56150831A (en) * 1980-04-24 1981-11-21 Nec Corp Semiconductor device
US5371411A (en) * 1980-09-01 1994-12-06 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US5583381A (en) * 1980-09-01 1996-12-10 Hitachi, Ltd. Resin molded type-semiconductor device having a conductor film
US5552639A (en) * 1980-09-01 1996-09-03 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US5539257A (en) * 1980-09-01 1996-07-23 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
JPS5793530A (en) * 1980-12-03 1982-06-10 Nec Corp Semiconductor device
JPS57157529A (en) * 1981-03-24 1982-09-29 Seiko Epson Corp Semiconductor device
JPH0582065B2 (en) * 1983-02-03 1993-11-17 Fuji Xerox Co Ltd
JPS59143362A (en) * 1983-02-03 1984-08-16 Fuji Xerox Co Ltd Passivation film
JPS62248239A (en) * 1986-04-22 1987-10-29 Nec Corp Manufacture of semiconductor device
JPS63211648A (en) * 1988-01-29 1988-09-02 Hitachi Ltd Resin seal type semiconductor device

Similar Documents

Publication Publication Date Title
JPS5351970A (en) Manufacture for semiconductor substrate
JPS52104062A (en) Production of surface protection film of electronic parts
JPS52104063A (en) Production of surface protection film in electronic parts
JPS5331964A (en) Production of semiconductor substrates
JPS52131484A (en) Semiconductor device
JPS5257531A (en) Sheathed heater and its manufacturing method
JPS5230188A (en) Process for producing smiconductor device
JPS52116076A (en) Preparation of film for protecting surface of electronic parts
JPS5258473A (en) Production of semiconductor device
JPS5436182A (en) Manufacture for semiconductor device
JPS5297674A (en) Surface protecting film of electronic parts
JPS52149975A (en) Production of semiconductor device
JPS5290276A (en) Production of semiconductor device
JPS52116075A (en) Preparation of film for protecting surface of electronic parts
JPS5317287A (en) Production of semiconductor device
JPS5376A (en) Manufacture of semiconductor device
JPS52130287A (en) Integrated circuit production
JPS5227362A (en) Formation method of passivation film
JPS52127767A (en) Plasma etching method
JPS5357972A (en) Production of semiconductor device
JPS522283A (en) Method of forming a boron silicate glass layer
JPS5228279A (en) Process of semiconductor device
JPS53136482A (en) Semiconductor device and its manufacture
JPS51138167A (en) Production method of semiconductor device
JPS5210070A (en) Method for manufacturing silicon semiconductor device