JPS51151069A - Electrode forming method of a semiconductor element - Google Patents
Electrode forming method of a semiconductor elementInfo
- Publication number
- JPS51151069A JPS51151069A JP50076082A JP7608275A JPS51151069A JP S51151069 A JPS51151069 A JP S51151069A JP 50076082 A JP50076082 A JP 50076082A JP 7608275 A JP7608275 A JP 7608275A JP S51151069 A JPS51151069 A JP S51151069A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- forming method
- electrode forming
- electrode
- lump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/012—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50076082A JPS51151069A (en) | 1975-06-20 | 1975-06-20 | Electrode forming method of a semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50076082A JPS51151069A (en) | 1975-06-20 | 1975-06-20 | Electrode forming method of a semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS51151069A true JPS51151069A (en) | 1976-12-25 |
Family
ID=13594890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50076082A Pending JPS51151069A (en) | 1975-06-20 | 1975-06-20 | Electrode forming method of a semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51151069A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139944A (en) * | 1981-02-23 | 1982-08-30 | Fuji Electric Corp Res & Dev Ltd | Forming method for solder bump electrode |
| JPS6142843U (ja) * | 1984-08-21 | 1986-03-19 | 富士電機株式会社 | 半導体装置 |
| JPS6356941A (ja) * | 1986-08-28 | 1988-03-11 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0422131A (ja) * | 1990-05-17 | 1992-01-27 | Sharp Corp | 半導体装置の製造方法 |
-
1975
- 1975-06-20 JP JP50076082A patent/JPS51151069A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139944A (en) * | 1981-02-23 | 1982-08-30 | Fuji Electric Corp Res & Dev Ltd | Forming method for solder bump electrode |
| JPS6142843U (ja) * | 1984-08-21 | 1986-03-19 | 富士電機株式会社 | 半導体装置 |
| JPS6356941A (ja) * | 1986-08-28 | 1988-03-11 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH0422131A (ja) * | 1990-05-17 | 1992-01-27 | Sharp Corp | 半導体装置の製造方法 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5435679A (en) | Semiconductor connection method | |
| JPS528785A (en) | Semiconductor device electrode structure | |
| JPS522277A (en) | Soldering device | |
| JPS5380966A (en) | Manufacture of electrode fdr semiconductor device | |
| JPS51151069A (en) | Electrode forming method of a semiconductor element | |
| JPS52140269A (en) | Formation of solder electrode | |
| JPS523387A (en) | Manufacturing method of semiconductor device | |
| JPS5228262A (en) | Process for assembling semiconductor device | |
| JPS5333057A (en) | Bump type semiconductor device | |
| JPS52153383A (en) | Preparation of semiconductor device | |
| JPS53140967A (en) | Production of electrodes of semiconductor device | |
| JPS5216978A (en) | Semiconductor | |
| JPS5310266A (en) | Production of soldred semiconductor wafers | |
| JPS51123086A (en) | Semicanductor device and its production process | |
| JPS51147958A (en) | Method for forming metal electrode | |
| JPS5211772A (en) | Semiconductor device | |
| JPS5283166A (en) | Semiconductor device and its production | |
| JPS5368163A (en) | Production of flip chip | |
| JPS52143186A (en) | Taping device | |
| JPS52156583A (en) | Electrode formation method in semiconductor device | |
| JPS52130292A (en) | Patterning method | |
| JPS5232264A (en) | Formation method for solder electrode | |
| JPS53139972A (en) | Production of semiconductor device | |
| JPS5339868A (en) | Packaging method of semiconductor device | |
| JPS5273675A (en) | Structure of die bonding |