JPS51126054A - Manufacturing method of semi-conductor equipment - Google Patents

Manufacturing method of semi-conductor equipment

Info

Publication number
JPS51126054A
JPS51126054A JP4971175A JP4971175A JPS51126054A JP S51126054 A JPS51126054 A JP S51126054A JP 4971175 A JP4971175 A JP 4971175A JP 4971175 A JP4971175 A JP 4971175A JP S51126054 A JPS51126054 A JP S51126054A
Authority
JP
Japan
Prior art keywords
semi
manufacturing
conductor equipment
base plate
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4971175A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5746649B2 (en, 2012
Inventor
Hirobumi Yoshida
Iwahito Yoshitake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4971175A priority Critical patent/JPS51126054A/ja
Publication of JPS51126054A publication Critical patent/JPS51126054A/ja
Publication of JPS5746649B2 publication Critical patent/JPS5746649B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP4971175A 1975-04-25 1975-04-25 Manufacturing method of semi-conductor equipment Granted JPS51126054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4971175A JPS51126054A (en) 1975-04-25 1975-04-25 Manufacturing method of semi-conductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4971175A JPS51126054A (en) 1975-04-25 1975-04-25 Manufacturing method of semi-conductor equipment

Publications (2)

Publication Number Publication Date
JPS51126054A true JPS51126054A (en) 1976-11-02
JPS5746649B2 JPS5746649B2 (en, 2012) 1982-10-05

Family

ID=12838761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4971175A Granted JPS51126054A (en) 1975-04-25 1975-04-25 Manufacturing method of semi-conductor equipment

Country Status (1)

Country Link
JP (1) JPS51126054A (en, 2012)

Also Published As

Publication number Publication date
JPS5746649B2 (en, 2012) 1982-10-05

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