JPS5746649B2 - - Google Patents
Info
- Publication number
- JPS5746649B2 JPS5746649B2 JP4971175A JP4971175A JPS5746649B2 JP S5746649 B2 JPS5746649 B2 JP S5746649B2 JP 4971175 A JP4971175 A JP 4971175A JP 4971175 A JP4971175 A JP 4971175A JP S5746649 B2 JPS5746649 B2 JP S5746649B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4971175A JPS51126054A (en) | 1975-04-25 | 1975-04-25 | Manufacturing method of semi-conductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4971175A JPS51126054A (en) | 1975-04-25 | 1975-04-25 | Manufacturing method of semi-conductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51126054A JPS51126054A (en) | 1976-11-02 |
| JPS5746649B2 true JPS5746649B2 (en, 2012) | 1982-10-05 |
Family
ID=12838761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4971175A Granted JPS51126054A (en) | 1975-04-25 | 1975-04-25 | Manufacturing method of semi-conductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51126054A (en, 2012) |
-
1975
- 1975-04-25 JP JP4971175A patent/JPS51126054A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51126054A (en) | 1976-11-02 |