JPS4948707A - - Google Patents

Info

Publication number
JPS4948707A
JPS4948707A JP4766473A JP4766473A JPS4948707A JP S4948707 A JPS4948707 A JP S4948707A JP 4766473 A JP4766473 A JP 4766473A JP 4766473 A JP4766473 A JP 4766473A JP S4948707 A JPS4948707 A JP S4948707A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4766473A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4948707A publication Critical patent/JPS4948707A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
    • C04B35/645—Pressure sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/122—Metallic interlayers based on refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/405—Iron metal group, e.g. Co or Ni
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/592—Aspects relating to the structure of the interlayer whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/82—Two substrates not completely covering each other, e.g. two plates in a staggered position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP4766473A 1972-05-03 1973-05-01 Pending JPS4948707A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2068772A GB1426873A (en) 1972-05-03 1972-05-03 Methods of pressure bonding a ceramic member to another member

Publications (1)

Publication Number Publication Date
JPS4948707A true JPS4948707A (fr) 1974-05-11

Family

ID=10150010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4766473A Pending JPS4948707A (fr) 1972-05-03 1973-05-01

Country Status (6)

Country Link
JP (1) JPS4948707A (fr)
DE (1) DE2318727C3 (fr)
FR (1) FR2183213B1 (fr)
GB (1) GB1426873A (fr)
IT (1) IT984490B (fr)
NL (1) NL7305890A (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713024A (en) * 1980-06-30 1982-01-23 Nanbu Denki Seisakusho:Kk Grip releasing device in article grip conveyor
JPS58135783A (ja) * 1982-02-05 1983-08-12 Shin Meiwa Ind Co Ltd 拡散接合方法
JPS58181771A (ja) * 1982-04-16 1983-10-24 新明和工業株式会社 拡散接合方法およびこの方法による複合体
JPS58190880A (ja) * 1982-04-30 1983-11-07 昭和アルミニウム株式会社 アルミニウム材とセラミツクス材との接合方法
JPS58217270A (ja) * 1982-03-31 1983-12-17 デ・ビア−ズ・インダストリアル・ダイアモンド・デイビジヨン（プロプライエタリイ）リミテツド 研摩材素地
JPS58219976A (ja) * 1982-06-14 1983-12-21 アンリツ株式会社 仕分け装置
JPS58219977A (ja) * 1982-06-14 1983-12-21 アンリツ株式会社 仕分け装置
JPS5957972A (ja) * 1982-09-27 1984-04-03 新明和工業株式会社 拡散接合方法
JPS59217683A (ja) * 1983-05-25 1984-12-07 新明和工業株式会社 拡散接合方法
JPS6096550A (ja) * 1983-09-08 1985-05-30 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン ２個の部材を結合する方法
JPS60197516A (ja) * 1984-03-15 1985-10-07 Kaindo Uea:Kk 布地ハンガ−の解除装置及び布地回収装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2333358A1 (fr) * 1975-11-28 1977-06-24 Comp Generale Electricite Generateur electrochimique du type soufre-sodium
GB1574804A (en) * 1976-05-20 1980-09-10 Chloride Silent Power Ltd Metal-to-ceramic seals
US4262300A (en) * 1978-11-03 1981-04-14 Isotronics, Inc. Microcircuit package formed of multi-components
JPS57170581A (en) * 1981-03-26 1982-10-20 Sperry Rand Ltd Seal and method of forming same
JPS5916282A (ja) * 1982-07-19 1984-01-27 Yuasa Battery Co Ltd ナトリウム−硫黄電池の製造法
DE3233022A1 (de) * 1982-09-06 1984-03-08 BBC Aktiengesellschaft Brown, Boveri & Cie., 5401 Baden, Aargau Verfahren zum direkten verbinden eines koerpers mit einem keramischen substrat
GB2132601B (en) * 1982-12-23 1986-08-20 Ferranti Plc Joining articles of materials of different expansion coefficients
DE3340424A1 (de) * 1983-11-09 1985-05-15 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrochemische speicherzelle
FR2559474B1 (fr) * 1984-02-15 1988-12-23 Quantel Sa Procede de scellement etanche et etuvable d'objets metalliques sur un corps en materiau vitroceramique
DE3608559A1 (de) * 1986-03-14 1987-09-17 Kernforschungsanlage Juelich Verfahren zum verbinden von formteilen aus sic mit keramik oder metall und zur oberflaechenbehandlung von sisic sowie eine zum verbinden brauchbare legierung
US4785988A (en) * 1986-11-20 1988-11-22 Methode Electronics, Inc. Attachment of lead to elongated conductor
US4895291A (en) * 1989-05-04 1990-01-23 Eastman Kodak Company Method of making a hermetic seal in a solid-state device
JPH0349834A (ja) * 1989-07-14 1991-03-04 Sumitomo Electric Ind Ltd 金を接合材とする工具及びその製造方法
DE69018220T2 (de) * 1989-12-20 1995-07-27 Sumitomo Electric Industries Verbindungswerkzeug.
CA2146123C (fr) * 1992-10-20 2005-01-11 Janusz Kuzma Module et methode de construction
US6730848B1 (en) 2001-06-29 2004-05-04 Antaya Technologies Corporation Techniques for connecting a lead to a conductor
EP1611591B1 (fr) * 2003-03-03 2012-06-06 Koninklijke Philips Electronics N.V. Ensemble cathode pour tube a rayons x et processus d'assemblage par reaction au niveau de l'interface
WO2008128300A1 (fr) 2007-04-23 2008-10-30 Cochlear Limited Ensemble d'implant
US9969654B2 (en) 2014-01-24 2018-05-15 United Technologies Corporation Method of bonding a metallic component to a non-metallic component using a compliant material
CN105364284B (zh) * 2015-12-04 2017-08-08 西北工业大学 一种氧化锆或氧化锆基复合材料的低温快速焊接方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713024A (en) * 1980-06-30 1982-01-23 Nanbu Denki Seisakusho:Kk Grip releasing device in article grip conveyor
JPH034456B2 (fr) * 1980-06-30 1991-01-23 Nambu Electric Co Ltd
JPS58135783A (ja) * 1982-02-05 1983-08-12 Shin Meiwa Ind Co Ltd 拡散接合方法
JPS58217270A (ja) * 1982-03-31 1983-12-17 デ・ビア−ズ・インダストリアル・ダイアモンド・デイビジヨン（プロプライエタリイ）リミテツド 研摩材素地
JPH0356868B2 (fr) * 1982-03-31 1991-08-29
JPS58181771A (ja) * 1982-04-16 1983-10-24 新明和工業株式会社 拡散接合方法およびこの方法による複合体
JPS58190880A (ja) * 1982-04-30 1983-11-07 昭和アルミニウム株式会社 アルミニウム材とセラミツクス材との接合方法
JPS6140626B2 (fr) * 1982-04-30 1986-09-10 Showa Aluminium Co Ltd
JPS58219976A (ja) * 1982-06-14 1983-12-21 アンリツ株式会社 仕分け装置
JPS58219977A (ja) * 1982-06-14 1983-12-21 アンリツ株式会社 仕分け装置
JPH0234844B2 (fr) * 1982-06-14 1990-08-07 Anritsu Corp
JPH0234845B2 (fr) * 1982-06-14 1990-08-07 Anritsu Corp
JPH0222024B2 (fr) * 1982-09-27 1990-05-17 Shin Meiwa Ind Co Ltd
JPS5957972A (ja) * 1982-09-27 1984-04-03 新明和工業株式会社 拡散接合方法
JPS59217683A (ja) * 1983-05-25 1984-12-07 新明和工業株式会社 拡散接合方法
JPS6096550A (ja) * 1983-09-08 1985-05-30 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン ２個の部材を結合する方法
JPH0429621B2 (fr) * 1983-09-08 1992-05-19
JPS60197516A (ja) * 1984-03-15 1985-10-07 Kaindo Uea:Kk 布地ハンガ−の解除装置及び布地回収装置

Also Published As

Publication number Publication date
GB1426873A (en) 1976-03-03
FR2183213B1 (fr) 1976-07-23
NL7305890A (fr) 1973-11-06
DE2318727B2 (de) 1981-06-19
IT984490B (it) 1974-11-20
DE2318727C3 (de) 1982-04-29
DE2318727A1 (de) 1973-11-15
FR2183213A1 (fr) 1973-12-14

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